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Material deposition

Field desorption. The formation of ions in the gas phase from a material deposited on a solid surface (known as an emitter) that is placed in a high electrical field. Field desorption is an ambiguous term because it implies that the electric field desorbs a material as an ion from some kind of emitter on which the material is deposited. There is growing evidence that some of the ions formed are due to thermal ionization and some to field ionization of material... [Pg.438]

The materials deposited by PVD techniques include metals, semiconductors (qv), alloys, intermetaUic compounds, refractory compounds, ie, oxides, carbides, nitrides, borides, etc, and mixtures thereof. The source material must be pure and free of gases and inclusions, otherwise spitting may occur. [Pg.41]

Many materials deposited by CVD have a high elastic modulus and a low fracture toughness and are therefore affected by residual film stresses. [Pg.524]

Faraday s Law of electrolysis states that the amount of chemical change, ie, amount dissolved or deposited, produced by an electric current is proportional to the quantity of electricity passed, as measured in coulombs and that the amounts of different materials deposited or dissolved by the same quantity of electricity are proportional to their gram-equivalent weights (GEW) defined as the atomic weight divided by the valence. The weight in grams of material deposited, IF, is given by... [Pg.527]

Porosity and Pore Size. The same methods used to determine the porosity and pore si2e distribution of the support generally can be used for the catalyst. However, the values found for the catalyst usually ate different from those of the bare support. Porosity could be increased if a part of the support is leached away during preparation of the catalyst, or, more likely, porosity will be decreased because catalytic materials deposited on the support win occupy a part of the support s pore volume. [Pg.196]

Rotary atomisation produces an excellent surface finish. The spray has low velocity, which allows the electrostatic forces attracting the paint particles to the ground workpiece to dominate, and results in transfer efficiencies of 85—99%. The pattern is very large and partially controlled and dkected by shaping ak jets. The spray when using a metallic cup has relatively poor penetration into recessed areas. Excessive material deposited on the edges of the workpiece can also be a problem. [Pg.331]

In solvent sublation an immiscible liquid is placed atop the main liquid to trap the material deposited by the bubbles as they exit (Sebba, Ion Flotation, Elsevier, New York, 1962). The upper hquid should dissolve or at least wet the material. With appropriate selectivity, the separation so achieved can sometimes be much greater than that with bubble fractionation alone. [Pg.2018]

Wrapped nanocrystals. Metal crystallites covered with well-developed graphitic layers are found in soot-like material deposited on the outer surface of a cathode slag. Figure 6 shows a TEM picture of an a(bcc)-Fe particle grown in the cathode soot. Generally, iron crystallites in the tv-Fe phase are faceted. The outer shell is uniform in thickness, and it usually con-... [Pg.157]

While plasma deposits are widely used, especially in the American aero industry to provide wear resistance, there is not at the moment any great demand for the exotic materials deposited to be used as a protection against corrosion. However, M. A. Levinstein of General Electric (USA) reports the successful use of sprayed chromium carbide as a protection for ventilator blades operating in corrosive conditions. [Pg.420]

Material deposited on-load may, when conditions become wet in the off-load plant, cause corrosion. [Pg.855]

One problem with heterogeneous catalysis is that the solid catalyst is easily poisoned. Foreign materials deposited on the catalytic surface during the reaction reduce or even destroy its effectiveness. A major reason for using unleaded gasoline is that lead metal poisons the Pt-Rh mixture in the catalytic converter. [Pg.306]

The amount of material deposited and the effective temperature of the substrate during deposition were systematically varied, while deposition rale was held constant. A set of about 50 samples has been generated. Tfl films are stable over time, due to the large energy barriers for surface relaxation and reoiganization, and the topographical features remain unaltered over a time span of several months. [Pg.403]

The quantitative execution of chemical reactions is the basis of the traditional or classical methods of chemical analysis gravimetry, titrimetry and volumetry. In gravimetric analysis the substance being determined is converted into an insoluble precipitate which is collected and weighed, or in the special case of electrogravimetry electrolysis is carried out and the material deposited on one of the electrodes is weighed. [Pg.7]

The second part is a review of the materials deposited by CVD, i.e., metals, non-metallic elements, ceramics and semiconductors, and the reactions used in their deposition. [Pg.5]

Laser CVD involves essentially the same deposition mechanism and chemistry as conventional thermal CVD and theoretically the same wide range of materials can be deposited. Some examples of materials deposited by laser CVD are listed in Table 5.2.h Hi8]... [Pg.127]

Examples of Materials Deposited by Thermal Laser CVDP P h 1... [Pg.127]

No heat is required and the deposition may occur essentially at room temperature. Moreover, there is no constraint on the type of substrate, which can be opaque, absorbent, or transparent. A limitation of photo CVD is the slow rate of deposition, which has so far restricted its applications. Materials deposited on an experimental... [Pg.128]

Material Deposited Common Precursors Deposition Temp. °C Applications Status... [Pg.143]

Different results were obtained in the case of the Stillinger-Weber (SW) potential for silicon (10). In this case, material deposited on the (ill) orientation was disordered, without distinct layers of atoms. Growth on the (100) face did produce about ten distinct layers at sufficiently high temperatures, although it is not clear whether thicker deposits would retain this order since some degeneration was observed as successive layers were deposited. [Pg.225]

Electrochemical experiments have been carried out on materials deposited by PVD on silicon microfabricated arrays of Au pad electrodes [Guerin et al., 2006a]. The substrate is made up of a square silicon wafer capped with silicon nitride (31.8 mm x 31.8 mm), which has an array of 100 individually addressable Au pad electrodes. These electrodes make up a square matrix on the wafer, which can be masked when placed in a PVD chamber, allowing deposition of thin films on the Au electrodes. Figure 16.3 is a schematic drawing of the configuration. Small electrical contact pads in Au for the individual addressing of electrodes (0.8 mm x 0.8 mm) are placed on the boundaries. [Pg.574]

In the plasma reactor dedicated for intrinsic material deposition (2 in Fig. 5), only hydrogen and silane are used, along with argon. A mixture of trimethylboron (5% TMB in H2), SiHa, and methane (CH4) is used in the / -plasma reactor (3 in Fig. 5). Diborane can also be used. A mixture of phosphine [PH3 (1% in H2)] and SIH4 is used in an n-plasma reactor (4 in Fig. 5). All gases are of 6.0 quality (99.9999% pure) if available from manufacturers, and otherwise as pure as possible. [Pg.27]

The partial pressures of the stable neutral molecules in the discharge (silane, hydrogen, disilane, trisilane) can be measured by a quadrupole mass spectrometer (QMS). The QMS usually is mounted in a differentially pumped chamber, which is connected to the reactor via a small extraction port [286]. In the ASTER system a QMS is mounted on the reactor that is used for intrinsic material deposition. The QMS background pressure (after proper bake-out) is between 10 and 10 mbar. The controllable diameter in the extraction port is adjusted so that during discharge operation the background pressure never exceeds 10"" mbar. [Pg.85]

The microstructure parameter is low in the material deposited at the lowest power (Fig. 44e) it increases rapidly with increasing power up to 20 W, and then decreases again with further increasing power. The opposite holds for the refractive index (Fig. 44f), although that is less clear. A high value of the microstructure indicates a large fraction of Si—Ht bonds in the material, corresponding to an open material structure and a low refractive index. [Pg.120]

Both the dark conductivity and the photoconductivity of the sample deposited at 40 W have been measured. The photoconductivity has been measured under AM 1.5 conditions. The dark conductivity and photoconductivity of the material deposited at 40 W are 1 x 10 and 1.2 x 10 " cm, respectively. These... [Pg.121]


See other pages where Material deposition is mentioned: [Pg.175]    [Pg.391]    [Pg.41]    [Pg.383]    [Pg.516]    [Pg.495]    [Pg.29]    [Pg.130]    [Pg.303]    [Pg.409]    [Pg.439]    [Pg.510]    [Pg.202]    [Pg.1187]    [Pg.484]    [Pg.45]    [Pg.258]    [Pg.240]    [Pg.313]    [Pg.142]    [Pg.275]    [Pg.145]    [Pg.71]    [Pg.466]    [Pg.495]   
See also in sourсe #XX -- [ Pg.3 ]




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