Low-£ dielectrics

The are essentially adjustable parameters and, clearly, unless some of the parameters in A2.4.70 are fixed by physical argument, then calculations using this model will show an improved fit for purely algebraic reasons. In principle, the radii can be fixed by using tables of ionic radii calculations of this type, in which just the A are adjustable, have been carried out by Friedman and co-workers using the HNC approach [12]. Further rermements were also discussed by Friedman [F3], who pointed out that an additional temi is required to account for the fact that each ion is actually m a cavity of low dielectric constant, e, compared to that of the bulk solvent, e. A real difficulty discussed by Friedman is that of making the potential continuous, since the discontinuous potentials above may lead to artefacts. Friedman [F3] addressed this issue and derived... 

Luminescence has been used in conjunction with flow cells to detect electro-generated intennediates downstream of the electrode. The teclmique lends itself especially to the investigation of photoelectrochemical processes, since it can yield mfonnation about excited states of reactive species and their lifetimes. It has become an attractive detection method for various organic and inorganic compounds, and highly sensitive assays for several clinically important analytes such as oxalate, NADH, amino acids and various aliphatic and cyclic amines have been developed. It has also found use in microelectrode fundamental studies in low-dielectric-constant organic solvents. 

Another way of calculating the electrostatic component of solvation uses the Poisson-Boltzmann equations [22, 23]. This formalism, which is also frequently applied to biological macromolecules, treats the solvent as a high-dielectric continuum, whereas the solute is considered as an array of point charges in a constant, low-dielectric medium. Changes of the potential within a medium with the dielectric constant e can be related to the charge density p according to the Poisson equation (Eq. (41)). 

The final class of methods that we shall consider for calculating the electrostatic compone of the solvation free energy are based upon the Poisson or the Poisson-Boltzmann equatior Ihese methods have been particularly useful for investigating the electrostatic properties biological macromolecules such as proteins and DNA. The solute is treated as a body of co stant low dielectric (usually between 2 and 4), and the solvent is modelled as a continuum high dielectric. The Poisson equation relates the variation in the potential (f> within a mediu of uniform dielectric constant e to the charge density p ... 

Capacitors. The outstandingly low dielectric loss of parylenes make them superior candidates for dielectrics in high quality capacitors. Furthermore, their dielectric constant and loss remain constant over a wide temperature range. In addition, they can be easily formed as thin, pinhole-free films. Kemet Flatkaps are fabricated by coating thin aluminum foil with Parylene N on both sides and winding the coated foils in pairs (62). 

In some cases particles have been added to electrical systems to improve heat removal, for example with an SF -fluidized particulate bed to be used in transformers (47). This process appears feasible, using polytetrafluoroethylene (PTFE) particles of low dielectric constant. For a successful appHcation, practical problems such as fluidizing narrow gaps must be solved. 

Decafluorobiphenyl [434-90-2] C F C F (mol wt, 334.1 mp, 68°C bp, 206°C), can be prepared by I Jllmann coupling of bromo- [344-04-7] chloro- [344-07-0] or iodopentafluorobenzene [827-15-6] with copper. This product shows good thermal stabiHty decafluorobiphenyl was recovered unchanged after 1 h below 575°C (270). Decafluorobiphenyl-based derivatives exhibit greater oxidative stabiHty than similar hydrocarbon compounds (271). Therm ally stable poly(fluorinated aryl ether) oligomers prepared from decafluorobiphenyl and bisphenols show low dielectric constant and moisture absorption which are attractive for electronic appHcations (272). 

Most glass-ceramics have low dielectric constants, typically 6—7 at 1 MHz and 20°C. Glass-ceramics comprised primarily of network formers can have dielectric constants as low as 4, with even lower values (K < 3) possible in microporous glass-ceramics (13). On the other hand, very high dielectric constants (over 1000) can be obtained from relatively depolymerized glasses with crystals of high dielectric constant, such as lead or alkaline earth titanate (11,14). 

In the electronics industry. Pis find wide appHcations as a dielectric material for semiconductors due to thermal stabiHty (up to 400°C) and low dielectric constant. Pis are being considered for use in bearings, gears, seals, and prosthetic human joints. The intended part can be machined or molded from the PI, or a film of PI can be appHed to a metallic part. Because of their superior adhesion, dielectric integrity, processing compatibUity, and lack of biological system impact. Pis have been used in many biological appHcations with particular success as body implants. 

PPQs possess a stepladder stmcture that combines good thermal stabiUty, electrical insulation, and chemical resistance with good processing characteristics (81). These properties allow unique appHcations in the aerospace and electronics industries (82,83). PPQ can be made conductive by the use of an electrochemical oxidation method (84). The conductivities of these films vary from 10 to 10 S/cm depending on the dopant anions, thus finding appHcations in electronics industry. Similarly, some thermally stable PQs with low dielectric constants have been produced for microelectronic appHcations (85). Thin films of PQs have been used in nonlinear optical appHcations (86,87). 

For most commercial voltages and frequencies used in power distribution, the capacitance effects are negligible. At relatively high voltages the current due to capacitance may reach sufficient value to affect the circuit, and insulation for such an appHcation is designed for a moderately low dielectric constant. 

Grade XXXPC is similar in electrical properties to Grade XXXP and suitable for punching at lower temperatures than Grade XXXP. This grade is recommended for apphcations requiring high insulation resistance and low dielectric losses under severe humidity conditions. 

Electrical Properties. AH polyolefins have low dielectric constants and can be used as insulators in particular, PMP has the lowest dielectric constant among all synthetic resins. As a result, PMP has excellent dielectric properties and alow dielectric loss factor, surpassing those of other polyolefin resins and polytetrafluoroethylene (Teflon). These properties remain nearly constant over a wide temperature range. The dielectric characteristics of poly(vinylcyclohexane) are especially attractive its dielectric loss remains constant between —180 and 160°C, which makes it a prospective high frequency dielectric material of high thermal stabiUty. 

A substrate is a robust element that provides mechanical support for the die. It can be mounted with more than one die such packages are called multichip modules. Because parasitic capacitance effects are directiy proportional to the dielectric constant, substrate material should have a low dielectric constant. 

Sihcones (qv) have an advantage over organic resias ia their superior thermal stabiUty and low dielectric constants. Polyurethanes, when cured, are tough and possess outstanding abrasion and thermal shock resistance. They also have favorable electrical properties and good adhesion to most surfaces. However, polyurethanes are extremely sensitive to and can degrade after prolonged contact with moisture as a result, they are not as commonly used as epoxies and sihcones (see Urethane polymers). 

Polymers are used as inserts for pins and contacts. Important properties of the commonly used insert materials have been compiled (31). Polysulfones are high temperature thermoplastics that have high rigidity, low creep, excellent thermal stabiHty, flame resistance, low loss tangents, and low dielectric constants. The principal weakness of polysulfones is their low chemical resistance. 

Commonly used materials for cable insulation are poly(vinyl chloride) (PVC) compounds, polyamides, polyethylenes, polypropylenes, polyurethanes, and fluoropolymers. PVC compounds possess high dielectric and mechanical strength, flexibiUty, and resistance to flame, water, and abrasion. Polyethylene and polypropylene are used for high speed appHcations that require a low dielectric constant and low loss tangent. At low temperatures, these materials are stiff but bendable without breaking. They are also resistant to moisture, chemical attack, heat, and abrasion. Table 14 gives the mechanical and electrical properties of materials used for cable insulation. 

Electrical Properties. Polysulfones offer excellent electrical insulative capabiUties and other electrical properties as can be seen from the data in Table 7. The resins exhibit low dielectric constants and dissipation factors even in the GH2 (microwave) frequency range. This performance is retained over a wide temperature range and has permitted appHcations such as printed wiring board substrates, electronic connectors, lighting sockets, business machine components, and automotive fuse housings, to name a few. The desirable electrical properties along with the inherent flame retardancy of polysulfones make these polymers prime candidates in many high temperature electrical and electronic appHcations. 

Because of its low dielectric constant, Hquid hydrogen sulfide is a poor solvent for ionic salts, eg, NaCl, but it does dissolve appreciable quantities of anhydrous AlCl, ZnCl2, FeCl, PCl, SiCl, and SO2. Liquid hydrogen sulfide or hydrogen sulfide-containing gases under pressure dissolve sulfur. At equihbrium H2S pressure, the solubihty of sulfur in Hquid H2S at —45, 0, and 40°C is 0.261, 0.566, and 0.920 wt %, respectively (98). The equiHbria among H2S, H2S, and sulfur have been studied (99,100). 

These lead-based materials (PZT, PLZT, PMN) form a class of ceramics with either important dielectric, relaxor, pie2oelectric, or electrooptic properties, and are thus used for appHcations ia actuator and sensor devices. Resistive properties of these materials ia film form mirror the conduction processes ia the bulk material. Common problems associated with their use are low dielectric breakdown, iacreased aging, and electrode iajection, decreasiag the resistivity and degrading the properties. 

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