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Depositing time

Sensitivity In many voltammetric experiments, sensitivity can be improved by adjusting the experimental conditions. For example, in stripping voltammetry, sensitivity is improved by increasing the deposition time, by increasing the rate of the linear potential scan, or by using a differential-pulse technique. One reason for the popularity of potential pulse techniques is an increase in current relative to that obtained with a linear potential scan. [Pg.531]

Time, Cost, and Equipment Commercial instrumentation for voltammetry ranges from less than 1000 for simple instruments to as much as 20,000 for more sophisticated instruments. In general, less expensive instrumentation is limited to linear potential scans, and the more expensive instruments allow for more complex potential-excitation signals using potential pulses. Except for stripping voltammetry, which uses long deposition times, voltammetric analyses are relatively rapid. [Pg.531]

High efficiency coatings have more than 30 layers, for which the deposition time is long. Thus they are expensive. [Pg.333]

The vapor deposition method at variable substrate temperature provides additional insight into the structure and wetting properties of 8CB in its various phases. If the substrate temperature is between 41 and 33°C, fiat islands 32 A thick are formed if only a small amount of 8CB is condensed on the surface. The size of these fiat islands increases with deposition time while their height remains constant until a uniform layer is formed. If more 8CB is deposited, droplets form on top of the film. This is shown in the image of Figure 14. [Pg.262]

Fig. 2. Effect of deposition time and deposition pressure on (a) dot size (inset shows atomic force micrograph of dots formed at O.STorr) (b) dot density. Fig. 2. Effect of deposition time and deposition pressure on (a) dot size (inset shows atomic force micrograph of dots formed at O.STorr) (b) dot density.
The formation of SiGe nanocrystals on SiOaat ITorr, 10s was clearly observed by atomic force microscopy (inset of Fig. 2(a)). Fig. 2 shows the mean diameter and the surface density of the nanocrystals formed as a function of deposition time and deposition pressure. The mean diameter of the nanocrystals initially increases then decreases with deposition time whereas the nanocrystal density follows the opposite trend. It is evident that different mechanisms dominate in shorter and longer deposition times. According to Kim et al, the formation of SiGe on a dielectric surface preferentially occurs on nucleated Si through impingement [4]. [Pg.72]

Fig. 4. Effect of deposition time on transmittance and electrical resistivity of Sn02 film. Fig. 4. Effect of deposition time on transmittance and electrical resistivity of Sn02 film.
Figure 3. AFM images of the silver nanoparticles on the Xi02(l 00) single crystal at the deposition times of (a) 15s and (b) 180 s. The images were recorded in a tapping mode with driving frequency of 110-150 kHz at a scan rate of 1 Hz by using a silicon cantilever with a normal spring constant of 15Nm (SI-DF20, Seiko instruments). Figure 3. AFM images of the silver nanoparticles on the Xi02(l 00) single crystal at the deposition times of (a) 15s and (b) 180 s. The images were recorded in a tapping mode with driving frequency of 110-150 kHz at a scan rate of 1 Hz by using a silicon cantilever with a normal spring constant of 15Nm (SI-DF20, Seiko instruments).
Figure 5. Height of the silver nanoparticles plotted as a function of their lateral diameter, determined by extended particle analysis for the AFM image (silver deposition time was 180 s). The broken line is for perfect spheres (height/diameter = 1). Figure 5. Height of the silver nanoparticles plotted as a function of their lateral diameter, determined by extended particle analysis for the AFM image (silver deposition time was 180 s). The broken line is for perfect spheres (height/diameter = 1).
Metal loading was controlled by varying the deposition time and the amount of support material loaded into the cup. Since the flux of sputtered atoms and the amount of... [Pg.348]

Figure 16.2 Thickness determination of An deposition onto a bare silicon wafer using a 10 x 10 contact mask in two geometries (see insets), using (a) AFM along the diagonal of an array of 100 electrodes and (b) AFM and ellipsometry for a deposition geometry that allowed an average of 10 fields of identical thickness across the wedge. The source temperatures and deposition times were (a) 1548K, 7200 s and (b) 1623K and 4500 s. Figure 16.2 Thickness determination of An deposition onto a bare silicon wafer using a 10 x 10 contact mask in two geometries (see insets), using (a) AFM along the diagonal of an array of 100 electrodes and (b) AFM and ellipsometry for a deposition geometry that allowed an average of 10 fields of identical thickness across the wedge. The source temperatures and deposition times were (a) 1548K, 7200 s and (b) 1623K and 4500 s.
From the TEM micrographs, particle sizes and the number of particles per unit area could be estimated. Figure 16.6 provides a quantitative analysis of the particle sizes as a function of deposition time. It is evident from the particle size distributions that at low nominal Au thickness (0.13 nm), mean particle diameters are about 1.4 nm and fall in a narrow range of sizes. As the nominal thickness becomes higher, the particle... [Pg.577]

Figure 16.6 TEM micrographs of titania-supported Au particles. The nominal thickness of An was (a) 0.13 nm (h) 0.78nm (c) 1.56nm (d) 2.33 nm. The Au deposition rate was 2.6 X 10 nms. Particle size distributions of Au for various deposition times are shown in the plot, with the distrihutions fitted to a normal Gaussian function. Figure 16.6 TEM micrographs of titania-supported Au particles. The nominal thickness of An was (a) 0.13 nm (h) 0.78nm (c) 1.56nm (d) 2.33 nm. The Au deposition rate was 2.6 X 10 nms. Particle size distributions of Au for various deposition times are shown in the plot, with the distrihutions fitted to a normal Gaussian function.

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