Failure analysis thermal testing

S. Okikawa, M. Sakimoto, M. Tanaka, T. Sato, T. Toya, and Y. Kara, Stress Analysis of Passivation Film Crack for Plastic Molded LSI Caused by Thermal Stress, Proc. Internet ional Society for Testing and Failure Analysis, Oct. 1983, Los Angeles, CA. 

The PPQ failures were characterized as gradually changing from cohesive to adhesive. This type of thermal failure also appeared in Phase I exposure and test. Surface failure analysis had shown that an incompatibility between PPQ resin and the titanium oxide layer had occurred. The PPQ resin was pulling clear from the oxide. Conclusions at this point were that the polymer was thermally stable but an unknown factor was creating an incompatibility with the anodized, prepared oxide. 

Antioxidants are common additives for polymers. Oven ageing and thermal analysis techniques such as DSC and TGA have been used with varying degrees of success to measure both the concentration and effectiveness of antioxidants. In most cases, the failure of these tests to correlate with actual end-use performance is due to the volatility of the antioxidants and other components at test temperatures. Even at a relatively... 

Shah, V. 2007. Handbook of Plastics Testing and Failure Analysis, 3rd ed. New York John Wiley Sons. Six chapters are devoted to mechanical, thermal, electrical, weathering, optical, and chemical properties, and respective testing. The remainder of the book deals with other plastic testing issues and techniques. Includes tables, illustrations, and extensive references. Available online on Wiley Online Library. 

Using the example of a power module (integrated in electric and hybrid vehicles) and an electrolytic capacitor, it will be examined whether this approach is universally valid. A Weibull analysis of test results for this component showed a significantly increasing failure rate due to mechanical stresses caused by thermal cyclical of the component during operation. The test analysis for aluminium electrolytic capacitors showed a similar result. 

Failure analysis is useful for providing the failure locations, modes and mechanisms, verifying the reliability test data and reliability prediction, and providing insights into the physical, chemical, electrical, mechaiucal, and thermal behaviors of solder joints (Ref 104-105). The failure modes of lead-free solder interconnects are similar to those for the tin-lead solder (Ref 104), under various loading conditions. Techniques for failure analysis for lead-free solder joints will be presented in Chapter 10. 

Thermal treatment appears to be the most readily available remedial action technology for dioxin. However, no data are available to confirm the maintainability, reliability and cost-effectiveness of transportable commercial systems. Through a competitive process, the USAF selected ENSCO Corporation for a full-scale field test of their rotary-kiln combustor. The test will be conducted at the NCBC, Mississippi and will involve treatment of approximately 9000 cubic yards of contaminated soil. An intense analytical program and engineering failure mode analysis will support the project. Testing is planned for November 1986 - March 1987. 

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