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Commercial epoxy resins

While there are a wide variety of epoxy resins commercially available which fill most end users needs, efforts continue to develop new resins which overcome some of the deficiencies present in available resins. [Pg.134]

Syntactic Cellular Polymers. Syntactic cellular polymer is produced by dispersing rigid, foamed, microscopic particles in a fluid polymer and then stabilizing the system. The particles are generally spheres or microhalloons of phenoHc resin, urea—formaldehyde resin, glass, or siUca, ranging 30—120 lm dia. Commercial microhalloons have densities of approximately 144 kg/m (9 lbs/fT). The fluid polymers used are the usual coating resins, eg, epoxy resin, polyesters, and urea—formaldehyde resin. [Pg.408]

A second type of uv curing chemistry is used, employing cationic curing as opposed to free-radical polymerization. This technology uses vinyl ethers and epoxy resins for the oligomers, reactive resins, and monomers. The initiators form Lewis acids upon absorption of the uv energy and the acid causes cationic polymerization. Although this chemistry has improved adhesion and flexibility and offers lower viscosity compared to the typical acrylate system, the cationic chemistry is very sensitive to humidity conditions and amine contamination. Both chemistries are used commercially. [Pg.248]

Inversion ofMon cjueous Polymers. Many polymers such as polyurethanes, polyesters, polypropylene, epoxy resins (qv), and siHcones that cannot be made via emulsion polymerization are converted into latices. Such polymers are dissolved in solvent and inverted via emulsification, foUowed by solvent stripping (80). SoHd polymers are milled with long-chain fatty acids and diluted in weak alkaH solutions until dispersion occurs (81). Such latices usually have lower polymer concentrations after the solvent has been removed. For commercial uses the latex soHds are increased by techniques such as creaming. [Pg.27]

A variety of thermosetting resins are used in SMC. Polyesters represent the most volume and are available in systems that provide low shrinkage and low surface profile by means of special additives. Class A automotive surface requirements have resulted in the development of sophisticated systems that commercially produce auto body panels that can be taken direcdy from the mold and processed through standard automotive painting systems, without additional surface finishing. Vinyl ester and epoxy resins (qv) are also used in SMC for more stmcturaHy demanding appHcations. [Pg.96]

Boron filaments are formed by the chemical vapor deposition of boron trichloride on tungsten wire. High performance reinforcing boron fibers are available from 10—20 mm in diameter. These are used mainly in epoxy resins and aluminum and titanium. Commercial uses include golf club shafts, tennis and squash racquets, and fishing rods. The primary use is in the aerospace industry. [Pg.184]

Glycidyl and Vinyl Esters. Glycidyl neodecanoate [26761-45-5] sold commercially as GLYDEXXN-10 (Exxon) or as CarduraElO (Shell), is prepared by the reaction of neodecanoic acid and epichl orohydrin under alkaline conditions, followed by purification. Physical properties of the commercially available material are given in Table 3. The material is a mobile Hquid monomer with a mild odor and is used primarily in coatings. Eor example, it is used as an intermediate for the production of a range of alkyd resins (qv) and acryHcs, and as a reactive diluent for epoxy resins (qv). [Pg.106]

Fig. 1. Structures of commercial epoxy resins (a) phenolic novolac epoxy resin, (b) glycidated polybasic acid, (c) glycidated polyamine (A,A,A, A -tetraglycidyl-4,4 -diaminodiphenylmethane [28768-32-3] (TGMDA)), and (d) glycidated bisphenol A. Fig. 1. Structures of commercial epoxy resins (a) phenolic novolac epoxy resin, (b) glycidated polybasic acid, (c) glycidated polyamine (A,A,A, A -tetraglycidyl-4,4 -diaminodiphenylmethane [28768-32-3] (TGMDA)), and (d) glycidated bisphenol A.
The commercial possibiUties for epoxy resins were first recognized by DeTrey Emres in Switzerland and DeVoe and Raynolds in the United States (1,2). In 1936, DeTrey Emres produced a low melting bisphenol A-based epoxy resin that gave a thermoset composition with phthaUc anhydride. Apphcation of the hardened composition was foreseen in dental products, but initial attempts to market the resin were unsuccessful. The patents were hcensed to CIBA AG of Basel, Switzerland (now CIBA-GEIGY), and in 1946 the first epoxy adhesive was shown at the Swiss Industries Eair and samples of casting resin were offered to the electrical industry. [Pg.362]

Specialty Epoxy Resins. In addition to bisphenol, other polyols such as aUphatic glycols and novolaks are used to produce specialty resins. Epoxy resins may also include compounds based on aUphatic, cycloaUphatic, aromatic, and heterocycHc backbones. Glycidylation of active hydrogen-containing stmctures with epichlorohydrin and epoxidation of olefins with peracetic acid remain the important commercial procedures for introducing the oxirane group into various precursors of epoxy resins. [Pg.363]

Aromatic and Heterocyclic Glycidyl Amine Resins. Among the specialty epoxy resins containing an aromatic amine backbone, the following are commercially significant. [Pg.364]

In the preparation of commercial DGEBPA, an excess of epichl orohydrin is used in order to minimize polymeriza tion of the reactants to higher molecular-weight species. Nevertheless, the typical viscous final product usually contains ca 80% by weight of the monomeric (n = 0) DGEBPA as deterrnined by gel-permeation chromatography (gpc). The manufacture of Hquid epoxy resins in a batch process has been described in some detail (9). [Pg.365]

Polyfunctional aliphatic resins have exhibited high reactivity and degrees of cure with amines but problems of toxicity have diminished their usehilness and commercial interest. SoHd epoxy resins can be prepared by the taffy process or the advancement process. [Pg.366]

SoHd epoxy resins are sometimes designated as 1-, 4-, 7-, or 9-type resins these approximate the degree of polymerization. Commercial products are designated similarly, eg, Epon 1001, 1004, 1007, and 1009 (SheU Chemical Co.). The relationship between n value, epoxy equivalent weight, and melting point is shown in Table 5. [Pg.366]

Calculation of the amount of bisphenol A for a typical advancement to a commercial grade of soHd epoxy resin is based on the epoxy value of the starting material and the epoxy value desired ... [Pg.366]

The alkyd resins are of value because of their comparatively low cost, durability, flexibility, gloss retention and reasonable heat resistance. Alkyd resins modified with rosin, phenolic resin, epoxy resins and monomers such as styrene are of current commercial importance. [Pg.741]

There is, quite clearly, scope or a very wide range of epoxy resins. The nonepoxy part of the molecule may be aliphatic, cycloaliphatic or highly aromatic hydrocarbon or it may be non-hydrocarbon and possibly polar. It may contain unsaturation. Similar remarks also apply to the chain extension/cross-linking agents, so that cross-linked products of great diversity may be obtained. In practice, however, the commercial scene is dominated by the reaction products of bis-phenol A and epichlorohydrin, which have some 80-90% of the market shtu"e. [Pg.744]

The commercial interest in epoxide (epoxy) resins was first made apparent by the publication of German Patent 676117 by I G Farben in 1939 which described liquid polyepoxides. In 1943 P. Castan filed US Patent 2 324483, covering the curing of the resins with dibasic acids. This important process was subsequently exploited by the Ciba Company. A later patent of Castan covered the hardening of epoxide resins with alkaline catalysts used in the range 0.1-5% This patent, however, became of somewhat restricted value as the important amine hardeners are usually used in quantities higher than 5%. [Pg.745]

Of the commercially available EB-curable adhesives [9-12], the resins fall within one of two categories based on their curing mechanisms. The majority of EB-curable resins are based on (meth)acrylate-functionalized oligomers involving a free-radical curing mechanism. The second category is the epoxy resins that cure by a cationic mechanism. [Pg.1020]

Commercially available electrodes are produced in coated fabricated steel housings in which the electrodes are retained by hard-setting epoxy resins. Connecting cables pass from the housing through cable glands and are either installed in conduits to the surface or are wire armoured for protection. [Pg.257]

This reaction is quite general and, since the organic group R can be aliphatic, cycloaliphatic, or aromatic, there is wide scope for variation in the composition of epoxy resins. In practice, however, the most frequently used materials are those based on bisphenol A and epichlorohydrin, which represent over 80% of commercial resins. [Pg.63]

As is usually characteristic of crosslinked polymers of commercial importance, epoxy resins are prepared in two stages, with the initial reaction leading to a linear prepolymer and the subsequent reaction introducing the crosslinks between the molecules. The prepolymers from which epoxy resins are prepared are diglycidyl ethers with the structure shown in Figure 4.2. [Pg.64]

Phenol was originally recovered during the coking of coal, essentially being a by-product. Eventually, commercial routes were developed based on benzene (from coal or petroleum) for example, sulfonation of benzene to ben-zenesulfonic acid followed by reaction with water to phenol plus regenerated sulfuric acid. Phenol is used to make plastics (phenol-formaldehyde and epoxy resins) and textile fibers (nylon). Phenol is also used in solution as a general disinfectant for cleaning toilets, stables, floors, drains, etc. and is used both internally and externally as a disinfectant for animals. [Pg.87]


See other pages where Commercial epoxy resins is mentioned: [Pg.361]    [Pg.251]    [Pg.228]    [Pg.278]    [Pg.32]    [Pg.319]    [Pg.355]    [Pg.19]    [Pg.19]    [Pg.19]    [Pg.20]    [Pg.47]    [Pg.496]    [Pg.362]    [Pg.362]    [Pg.362]    [Pg.366]    [Pg.369]    [Pg.24]    [Pg.749]    [Pg.775]    [Pg.151]    [Pg.36]    [Pg.1021]    [Pg.1022]    [Pg.1034]    [Pg.49]   
See also in sourсe #XX -- [ Pg.598 ]




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