Electronic packaging, importance

Thermal conductivity is also important in highly integrated electronic applications where the heat generated by components must be transferred to a heat pipe or by some other means outside the electronic package. Thermal conductivity within adhesive systems is also a means of reducing exotherm and stresses that could develop during the curing cycle or other excursions to elevated temperatures. 

These reactions have been explained in detail in the sections of Chapter 1 indicated and they are all identified by permanent, covalent bonds between polymeric chains. These chemical-network polymer systems are an important sub-class of network polymers and are sometimes referred to as thermoset polymers. Thermoset polymers cannot be re-melted or undergo flow under the influence of heat once they have been polymerized (i.e. they have a thermosef morphology, unlike thermoplastic polymers, which can be re-melted and flow under application of heat). Owing to their excellent properties at high temperatures (and under extreme environmental conditions) thermoset polymers are suitable for a wide variety of high-performance applications such as electronic packaging, automotive panelling and... 

Most applications of polymers in electronic packaging have a number of common requirements. Most pervasive is the moisture issue, but other important requirements are low dielectric constant, low dielectric losses (dissipation factor), and good adhesion to various substrates and metallizations. With the... 

Polymers are playing increasingly important roles in packaging and interconnection as the versatility of being able to customize their mechanical and electrical properties becomes better established and more well known. The rest of this book presents specific chapters on polymeric materials and their applications in this field. In reading them it is hoped the reader will keep in mind the increasingly important roles of these materials, their consequent market value, and their place in the hierarchy of electronic packaging and interconnection. 

Another important low-permittivity, low-loss ceramic is alumina. Alumina has such an excellent combination of good mechanical properties, high thermal conductivity, and ease of metallization that it is widely used today for thick-film circuit substrates and integrated electronic packaging. 

The thermal characteristics of NR-metal composites are close to the properties of metals, whereas the mechanical properties and the processing methods are typical of polymers.Thermally conducting, but electrically insulating, polymer-matrix composites are increasingly important for electronic packaging because the heat dissipation ability limits the reliability, performance and miniaturization of electronics.Thermal properties such as thermal conductivity, thermal dilfusivity and specific heat of metal (copper, zinc, Fe and bronze) powder-filled polymer composites are investigated experimentally in the range of filler content 0-24% by volume. ... 

Packaging technology has become extremely complex with many criteria to be met, especially in food, pharmaceutical, medical and electronic packaging. Intelligent packaging is becoming more important. Plastic electronic circuits are likely to play an important part in radio frequency identification devices that could become cheap enough to replace barcodes. 

The possibility of creating a robust, low-cost microsystem enabled with the aforementioned capabilities and packed into one single device that manages to combine the so-called micro-electro-mechanical systems (MEMS) with advanced electronic packaging technologies played a very important role for the development of such systems [23]. In addition, the large number of scenarios where wearables can contribute to increase the quality of everyday life, eg, health, physical exercise, or elder monitoring, has increased the attention and interest in the field. 

In electronic packaging technology, metal-polymer adhesion has been important for some years. Many studies have been devoted to the in-... 

As seen from the preceding list, PWBs are exactly in the center of the hierarchy and are the most important and universally used element of electronic packaging. 

Modem electronic packaging has become very complex. Interconnections are pnshed more into lower levels of packaging. The choice of which packaging technology to use is governed by many factors cost, electrical requirements, thermal reqnirements, density reqnirements, and so on. Material also plays a very important role. All things considered, PWBs still play important roles in electronic packaging. 

---