Cooling module

A numerical study of the effect of area ratio on the flow distribution in parallel flow manifolds used in a Hquid cooling module for electronic packaging demonstrate the useflilness of such a computational fluid dynamic code. The manifolds have rectangular headers and channels divided with thin baffles, as shown in Figure 12. Because the flow is laminar in small heat exchangers designed for electronic packaging or biochemical process, the inlet Reynolds numbers of 5, 50, and 250 were used for three different area ratio cases, ie, AR = 4, 8, and 16. 

Fig. 12. Schematic diagram of a Hquid-cooling module manifold for electronic packaging.

While the air distribution must match the heat distribution, the position of extracts is not important. Direct return to air-handling units mounted around the room in numbers necessary for reliability is common practice. In the event of loss of one or more cooling modules a well-designed ventilated ceiling adds to reliability by distributing the reduced amount of air in the same proportions throughout the room. 

The cooling module, shown in Fig. 22, consists of an aluminum box with internal dimensions of 50 X 50 X 65 mm and wall thickness of 3.175 mm. At the bottom, the box is closed with a 3.175 mm thick stainless steel plate. The orifice plate was installed on a support located above the heat source and could be moved up or down. The heat source consists of a diode used in current controlled mode to avoid high voltages. The diode is mounted on a Direct Bond Copper (DBC) substrate layer, which is in turn glued on top of a GIO insulating base. The diode is 8.68 x 4.97 mm in size. The electrical connections are provided by means of two copper rods, 3.175 mm in diameter. 

The values of the ratio of the power eonsumed to the power removed obtained from the cooling module tests are substantially higher than those shown for the orifiee plates. There are several reasons for this. Because some of the jets did not impinge on the diode sinee the area eovered by the jet array was larger than that of the diode, part of the water did not remove any heat, while still being pumped. 

Figure 22 Implementation of microjets in a cooling module (a) schematie, (b) photograph showing...

Figure 23 Cooling module results (4x6 array, d = 140 gm, s = 2 mm) heat flux vs. of Tchip- Tuq. 30.0%...

Figure 12 Heat removal capacity for different liquid cooling modules [6]...

WISP auto-injector with cooling module (Waters Model 710B, MiUipore Corp., Milford, MA, USA)... 

A description of the cure cycle used for materials testing at our laboratory is Evacuation for 5 min, then 25 min of cure with the top chamber bled to atmosphere. During the 25-min cure, the first 8-10 min is required to raise the encapsulant temperature to 160 C, where it is maintained to the end of the cycle. Modules are then removed without being cooled. Modules fabricated with this cure cycle show even and complete curing and no bubbles. 

Analysis of Lemon thyme oil using a single-stage liquid cooled modulator Fast GCxGC separations (chiral and achiral)... 

Nagy M. The effectiveness of water vapor sealing agents when used in apphcation with thermoelectric cooling modules. Undated TE Technology, Inc., Publication, www.tetech. com/pubhcations/pubs/ICT97MJN.pdf, (accessed July 13, 2010). 

Figure 14 Isothermal displacement calorimeter with cooling module. A, stainless-steel support tube, B, vent tube C, current and potential leads for heater D, connector for feed tube E, Teflon plug F, vent plug G, heateriwire supports H, baffles I, Teflon support ], heater wires K, stirrer magnet L, stirrer paddle A,feed tube N, thermistor P, Teflon feed cup Q, water inlet tube R, copper heat sink S, 5Q era precision-bore Dewar flask T, 0-rings U, coin-silver cooling rod V, copper cup W, coin-silver support rods X, copper heat shield Y, coin-silver bar Z, cooling module (Reproduced by permission from J. them, and Eng. Data, 1966, 11, 189)...

FIGURE 6.1 Prismatic ceii in stiff-pouch container with aluminum conduction channel added for heat rejection from a liquid-cooled module. (For color version of this figure, the reader is referred to the online version of this book.)... 

FIGURE 47.1 Cross-sectional view of reflow oven with top and bottom heater assemblies, cooling module, vent stack, insulated tunnel, and printed circuit assemblies (PCAs) atop motorized conveyor. 

Basically three fuel supply and storage approaches for fuel cell systems can be differentiated (Thomas et al., 2000) Fig, 20 Cooling module for the DC sprinter with a fuel... 

Rogg S, Hbglinger M, Zwittig E, Pfender C, Kaiser W and Heckenberger T (2003) Cooling Modules for Vehicles with a Fuel Cell Drive, FUEL CELLS, 3, pp. 153-158. 

---