Electronic packaging Systems requirements

Electronic-Grade MMCs. Metal-matrix composites can be tailored to have optimal thermal and physical properties to meet requirements of electronic packaging systems, eg, cotes, substrates, carriers, and housings. A controUed thermal expansion space tmss, ie, one having a high precision dimensional tolerance in space environment, was developed from a carbon fiber (pitch-based)/Al composite. Continuous boron fiber-reinforced aluminum composites made by diffusion bonding have been used as heat sinks in chip carrier multilayer boards. 

Requirements for the control of electromagnetic interference characteristics of subsystems and equipment. MIL-STD-461, Defense Information Systems Agency Aug. 1999. Tomaiuolo P. EMS Opto success another testimonial. Electronic Packaging and Production. Mar. 2003. 

Various military, and a few civilian, applications with long shelf-life requirements must turn to reserve batteries for their electric power. This is particularly true when the system requires that the power supply be integrally packaged with the electronics and not replaced throughout the storage life of the system. Typical of such applications are fuzing, control, and arming systems for artillery and other spin-stabilized projectiles. 

The system, highlights Motorola s expertise in miniaturization, microfluidics, energy conversion systems, electronic packaging and interface. Making a practical 1 W fuel cell system (Fig. 14) requires not only a small-sized fuel cell stack, but also miniature, low-power peripheral components. 

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