Japan Institute of Electronics Packaging

Unno Y. High density, low-mass hybrid and associated technologies, Proc. Sixth Workshop on Electronics for LHC Experiments, Krakow, Poland (Sep. 2000) Japan Institute of Electronic Packaging (JIEP) Dictionary of Electronic Packaging Technology, ISBN 4-7693-7089-X 63555. 

Active since the early 1990s, the Lead-Free Soldering Committee of the Japan Institute of Electronics Packaging (JIEP) includes more than 40 companies and three academic institutions. The group has focused its efforts on the evaluation of alternative alloy systems. 

Japanese companies are ahead of the rest of the world in the introduction of lead-free products. The Japan Institute of Electronics Packaging s Technology Roadmap for Electronics Packaging in 2010 documents the path toward lead-free product introduction. Lead-free component production is noted to have started in 2000 with rapid progress anticipated between 2003 and 2005. The use of lead-free solder is expected to become pervasive in Japan. While there are a number of products with lead-free solder today, many additional products are expected. The roadmap predicts that the use of lead-free solder will surpass conventional lead-based solders by 2003. While conventional lead-based solders will still be utilized until at least 2010, the volume is... 

Dr. Suetsugu received the Technology Award of the Society of Material Science, Japan IPC Special Award, Technology Award of the Japan Institute of Electronic Packaging, Best Paper Award of the Microelectronics Association, and Honorable Mention by the Society of Polymer Science, Japan. 

Kim, I., and Lee, S-B, Reliability Assessment of BGA Solder Joints under Cyclic Bending Loads, International Symposium on Electronics Materials and Packaging, EMAP2005, December 11-14, 2005, Tokyo Institute of Technology, Tokyo, Japan, pp. Tl-Jil. 

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