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Manufacturing soldering

Fig. 26.5 Drop generator for manufacturing solder balls by solidification of melt droplets [20] (Reprinted from [20]. With kind permission from Prof. Chun, MIT, 2010)... Fig. 26.5 Drop generator for manufacturing solder balls by solidification of melt droplets [20] (Reprinted from [20]. With kind permission from Prof. Chun, MIT, 2010)...
Gibson, A.W. Choi, S. Bieler, T.R. Subramanian, K.N. Environmental concerns and materials issues in manufactured solder joints. Proc. 5th IntT Symposium on Electronics the Environment IEEE Pis-... [Pg.328]

Its alloys include solder, type metal, and various antifriction metals. Great quantities of lead, both as the metal and as the dioxide, are used in storage batteries. Much metal also goes into cable covering, plumbing, ammunition, and in the manufacture of lead tetraethyl. [Pg.85]

CoF is used for the replacement of hydrogen with fluorine in halocarbons (5) for fluorination of xylylalkanes, used in vapor-phase soldering fluxes (6) formation of dibutyl decalins (7) fluorination of alkynes (8) synthesis of unsaturated or partially fluorinated compounds (9—11) and conversion of aromatic compounds to perfluorocycHc compounds (see Fluorine compounds, organic). CoF rarely causes polymerization of hydrocarbons. CoF is also used for the conversion of metal oxides to higher valency metal fluorides, eg, in the assay of uranium ore (12). It is also used in the manufacture of nitrogen fluoride, NF, from ammonia (13). [Pg.178]

Fig. 4. Steps ki the manufacture of a disk thermistor A, hall-milled powder B, pressed disk C, skitered disk D, soldered disk E, edge-ground disk F, lead... Fig. 4. Steps ki the manufacture of a disk thermistor A, hall-milled powder B, pressed disk C, skitered disk D, soldered disk E, edge-ground disk F, lead...
Tin [7440-31 -5] is one of the world s most ancient metals. When and where it was discovered is uncertain, but evidence points to tin being used in 3200—3500 BC. Ancient bron2e weapons and tools found in Ur contained 10—15 wt % tin. In 79 ad, Pliny described an alloy of tin and lead now commonly called solder (see Solders and brazing alloys). The Romans used tinned copper vessels, but tinned iron vessels did not appear until the fourteenth century in Bohemia. Tinned sheet for metal containers and tole (painted) ware made its appearance in England and Saxony about the middle of the seventeenth century. Although tinplate was not manufactured in the United States until the early nineteenth century, production increased rapidly and soon outstripped that in all other countries (1). [Pg.56]

The same general procedures of heating and cooling are foUowed in the case of soldering in a furnace, except that a piece of solder can be laid on the junction prior to insertion in the furnace. The solder melts and flows if the upper furnace temperature is properly set. The temperature should be set at ca 14—28°C (25—50°F) above the Hquidus temperature of the solder or at the manufacturer s recommended soldering temperature. [Pg.488]

Tin. Apphcation of tin on strip steel for can stock has decreased. Nevertheless, tin plating is still done in large volume, and tin plate for can stock was estimated at 11,750 t in 1990 (11). Additionally, 603 t of tin anodes were used for electroplating in electronic apphcations in the United States in 1990. The use of tin in solder manufacture is reported to exceed that used in can stock (12). The cost of tin in early 1993 was 7.50/kg (see Tin and tin alloys). [Pg.144]

The manufacturers stress ease of processing as a particular feature of the material. Recommended melt temperatures are in the range 320-340°C and mould temperatures are 135-165°C. Mould shrinkage of glass-filled grades is usually of the order of 0.2-0.4% in the flow direction and up to twice this value in the transverse direction. The materials are notable for their ability to withstand vapour phase and infrared soldering processes. [Pg.516]

Mercury is used in the manufacture of thermometers, barometers and switchgear, and in the production of amalgams with copper, tin, silver and gold, and of solders. A major use in the chemical industry is in the production of a host of mercury compounds and in mercury cells for the generation of chlorine. Mercury has a significant vapour pressure at ambient temperature and is a cumulative poison. [Pg.128]

Corrosion of solders used in the electronics industry is usually a function of the presence of residues from various manufacturing and assembly operations. Corrosion in heat exchangers, particularly in automobiles is a more significant problem and a test methodology has been described as well as various factors controlling the corrosion of tin-lead alloys in radiators... [Pg.810]


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See also in sourсe #XX -- [ Pg.36 ]




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