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Devices direct patterning

Introduction Aural Pickup Devices Directional Patterns... [Pg.239]

Sun, Y., Shtein, M., and Forrest, S.R., Direct patterning of organic light-emitting devices by organic-vapor jet printing. Applied Physics Letter, 2005.86 113504. [Pg.57]

There is growing interest in direct-patterning of soft materials by NIL, particularly functional polymers. The patterned soft materials remain as a permanent structure or an active component in the final device structure. One such example is to... [Pg.29]

Excimer lasers have also been used to manufacture novel composite membranes to be used as an effective transducer for the selective transfer and sensing of molecular ions [39]. Matson et al. [40] also employed excimer laser direct patterning at 248 nm to produce membranes for solvent separators by a step and drill method but they also developed a mask patterning process to create multiple pores of small size. McNeely et al. [41] developed a rapid prototyping technique to fabricate passive hydrophobic microfluidic systems integrated with macroscopic external devices aimed at highly parallel sample analysis. Sabbert et al. [42] machined cydoolefin copolymer (COC) with no redeposition effects, smooth surface and ablation rates smaller than for PMMA using an ArF excimer laser (193 nm). [Pg.150]

Direct or indirect patterning techniques can be used to microfabricate conjugated polymer devices. Indirect patterning is one commonly used technique in microelectronics industry and can be used for conjugated polymer patterning as well. This... [Pg.296]

In order to develop the proper dow pattern, knowledge of a material s dow properties is essential. Standard test equipment and procedures for evaluating sohds dow properties are available (6). Direct shear tests, mn to measure a material s friction and cohesive properties, allow determination of hopper wall angles for mass dow and the opening size required to prevent arching. Other devices available to evaluate sohds dowabiUty include biaxial and rotary shear testers. [Pg.553]

Figure 18.5 Schematic view of a diffraction experiment, (a) A narrow beam of x-rays (red) is taken out from the x-ray source through a collimating device. When the primary beam hits the crystal, most of it passes straight through, but some is diffracted by the crystal. These diffracted beams, which leave the crystal in many different directions, are recorded on a detector, either a piece of x-ray film or an area detector, (b) A diffraction pattern from a crystal of the enzyme RuBisCo using monochromatic radiation (compare with Figure 18.2b, the pattern using polychromatic radiation). The crystal was rotated one degree while this pattern was recorded. Figure 18.5 Schematic view of a diffraction experiment, (a) A narrow beam of x-rays (red) is taken out from the x-ray source through a collimating device. When the primary beam hits the crystal, most of it passes straight through, but some is diffracted by the crystal. These diffracted beams, which leave the crystal in many different directions, are recorded on a detector, either a piece of x-ray film or an area detector, (b) A diffraction pattern from a crystal of the enzyme RuBisCo using monochromatic radiation (compare with Figure 18.2b, the pattern using polychromatic radiation). The crystal was rotated one degree while this pattern was recorded.
In industrial ventilation the majority of air velocity measurements are related to different means of controlling indoor conditions, like prediction of thermal comfort contaminant dispersion analysis adjustment of supply airflow patterns, and testing of local exhausts, air curtains, and other devices. In all these applications the nature of the flow is highly turbulent and the velocity has a wide range, from O.l m in the occupied zone to 5-15 m s" in supply jets and up to 30-40 m s in air curtain devices. Furthermore, the flow velocity and direction as well as air temperature often have significant variations in time, which make measurement difficult. [Pg.1152]

Adjustable pattern air diffuser An air diffuser incorporating a device that allows the direction of the leaving air to be adjusted. [Pg.1406]

Silicon wafer has been extensively used in the semiconductor industry. CMP of silicon is one of the key technologies to obtain a smooth, defect-free, and high reflecting silicon surfaces in microelectronic device patterning. Silicon surface qualities have a direct effect on physical properties, such as breakdown point, interface state, and minority carrier lifetime, etc. Cook et al. [54] considered the chemical processes involved in the polishing of glass and extended it to the polishing of silicon wafer. They presented the chemical process which occurs by the interaction of the silicon layer and the... [Pg.249]


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See also in sourсe #XX -- [ Pg.140 , Pg.141 ]




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