Copper semiconductor technologies

The method of deposition is what differentiates the hybrid circuit from other packaging technologies and may be one of two types thick film or thin film. Other methods of metallizing a ceramic substrate, such as direct bond copper, active metal brazing, and plated copper, may also be considered to be in the hybrid family, but do not have a means for directly fabricating resistors and are not considered here. Semiconductor technology provides the active components, such as integrated circuits, transistors, and diodes. The passive components, such as resistors, capacitors, and inductors, may also be fabricated by thick- or thin-film methods or may be added as separate components. 

StiU another method used to produce PV cells is provided by thin-fiLm technologies. Thin films ate made by depositing semiconductor materials on a sohd substrate such as glass or metal sheet. Among the wide variety of thin-fiLm materials under development ate amorphous siUcon, polycrystaUine sUicon, copper indium diselenide, and cadmium teUuride. Additionally, development of multijunction thin-film PV cells is being explored. These cells use multiple layers of thin-film sUicon alloys or other semiconductors tailored to respond to specific portions of the light spectmm. 

The acceptance of chemical mechanical planarization (CMP) as a manufacturable process for state-of-the-art interconnect technology has made it possible to rely on CMP technology for numerous semiconductor manufacturing process applications. These applications include shallow trench isolation (STI), deep trench capacitors, local tungsten interconnects, inter-level-dielectric (ILD) planarization, and copper damascene. In this chapter. 

Doi T. Details of Semiconductor CMP Technology. Japan 2000. p 61-66. Hoshino S, Uda Y, Yamamoto E. Characteristics of copper CMP process for ultra-low pressure. Ninth International CMP Planarization for ULSI Multilevel Interconnection Conference 2004 Feb 24-26. 

One major recent advance in silicon-based semiconductor industry is the development of copper interconnects on chips. This new technology replaces the traditional aluminum or aluminum alloy (e.g. Al—Cu) conductors produced by physical vapor deposition (PVD) with copper conductors manufactured by electrodeposition. Copper has been replacing aluminum since 1999 owing to its low bulk electrical... 

Diamond-like carbon since its inception in 1962 has found applications in some very important areas. These applications include coatings used in scratch-resistant optics, razor blades, prosthesis in medical applications electron emission surfaces in electronics as an insulator material for copper heat sinks in semiconductors such as solar cells and sensors for visible to infrared radiations and as structural materials such as deuterated DLC film used for neutron storage in advanced research instrumentation. As technology matures the unique properties of DLC will find new and important applications. 

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