Cooling adhesion

The surface of most porcelain ware is glazed. The main requirement is suitable adjustment of the thermal expansion coefficients of body and glaze, in order to produce a low compression stress in the glaze after cooling. Adhesion of the glaze to the body is very satisfactory as a result of perfect wetting which follows from the similarity of the two materials. Penetration of glaze into the body pores also has positive effects. 

Phenol—formaldehyde (PF) was the first of the synthetic adhesives developed. By combining phenol with formaldehyde, which has exceptional cross-linking abiHties with many chemicals and materials, and a small amount of sodium hydroxide, a resin was obtained. The first resins soHdified as they cooled, and it was discovered that if it was ground to a powder with a small amount of additional formaldehyde and the appHcation of more heat, the mixture would Hquify and then convert to a permanently hard material. Upon combination of the powdered resin mixture with a filler material such as wood flour, the result then being placed in a mold and pressed under heat and pressure, a hard, durable, black plastic material was found to result. For many years these resulting products were called BakeHte, the trade name of the inventor. BakeHte products are still produced today, but this use accounts for only a small portion of the PF resins used. 

Panels then move into a cooling device, normally a wheel or rack, where they are held individually and air is circulated between them to remove the majority of heat remaining in the boards after pressing. It is desirable to reduce the average board surface temperature to about 55°C. This temperature is sufficient to complete the cure of adhesive in the core of the board. The heat also helps to redistribute moisture uniformly within the boards, because the board surfaces are drier than the core when the boards come out of the press. Warm boards are normally stacked for several hours to a day to allow for resin cure and moisture equalization. 

Free mono- and multilayer films may be adhesive- or extmsion-bonded in the laminating process. The bonding adhesive may be water- or solvent-based. Alternatively, a temperature-dependent polymer-based adhesive without solvent may be heated and set by cooling. In extmsion lamination, a film of a thermoplastic such as polyethylene is extmded as a bond between the two flat materials, which are brought together between a chilled and backup roU. 

Ko//M //s. When dispersion is requited ia exceedingly viscous materials, the large surface area and small mixing volume of roU mills allow maximum shear to be maintained as the thin layer of material passiag through the nip is continuously cooled. The roUs rotate at different speeds and temperatures to generate the shear force with preferential adhesion to the warmer roU. 

In contrast to most extmsion processes, extmsion coating involves a hot melt, ca 340°C. The thin web cools rapidly between the die and nip even at high linear rates. Both mechanical and chemical bonding to substrates are involved. Mechanical locking of resin around fibers contributes to the resin s adhesion to paper. Some oxidation of the melt takes place in the air gap, thereby providing sites for chemical bonding to aluminum foil. Excessive oxidation causes poor heat-sealing characteristics. 

Insoluble Sulfur. In natural mbber compounds, insoluble sulfur is used for adhesion to brass-coated wire, a necessary component in steel-belted radial tires. The adhesion of mbber to the brass-plated steel cord during vulcanization improves with high sulfur levels ( 3.5%). Ordinary rhombic sulfur blooms at this dose level. Crystals of sulfur on the surface to be bonded destroy building tack and lead to premature failure of the tire. Rubber mixtures containing insoluble sulfur must be kept cool (<100°C) or the amorphous polymeric form converts to rhombic crystals. 

This stock is discharged from the mixer to equipment that allows cooling and a convenient storage form, such as a mill or an extmder/die plate that yields a sheet or pelletized form. Usually the material is coated with a slurry of clay, calcium carbonate, or zinc stearate to prevent self-adhesion. 

Poly(phenylene sulfide) (PPS) is another semicrystalline polymer used in the composites industry. PPS-based composites are generally processed at 330°C and subsequently cooled rapidly in order to avoid excessive crystallisation and reduced toughness. The superior fire-retardant characteristics of PPS-based composites result in appHcations where fire resistance is an important design consideration. Laminated composites based on this material have shown poor resistance to transverse impact as a result of the poor adhesion of the fibers to the semicrystalline matrix. A PPS material more recently developed by Phillips Petroleum, AVTEL, has improved fiber—matrix interfacial properties, and promises, therefore, an enhanced resistance to transverse impact (see PoLYAffiRS containing sulfur). 

Epilation is required for permanent hair removal. The most effective epilation process is electrolysis or a similar procedure. Epilation can also be achieved by pulling the fibers out of the skin. Eor this purpose, wax mixtures (rosia and beeswax) are blended with Hpids, for example, oleyl oleate, which melt at a suitable temperature (about 50—55°C). The mixture is appHed to the site (a cloth tape may be melted iato the mass) and after cooling is rapidly pulled off the skin. A similar process can be carried out with a tape impregnated with an aggressive adhesive. 

The viscosity of most adhesives increases with time as they set by cross-linking, cooling from the melt or loss of solvent. The cross-linking of a phenolic-polyvinyl formal adhesive and of cold-setting epoxies was found by de Bruyne [41] to be represented adequately by an exponential relationship ... 

For many bonding applications a variety of adhesives can perform adequately. Hot melt adhesives are normally chosen where process speed is critical. Since hot melts have no carrier vehicle (solvent or water), and thicken rapidly as they cool, they are limited in their ability to (1) penetrate low porosity substrates or wet out very rough surfaces (2) cut through or imbibe surface contaminants and (3) wet out high thermal conductivity substrates (e.g. metals). Nonetheless, hot melts are increasingly the adhesive of choice in automated production environments because of their fast set speed. 

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