Coating magnetron sputtering

Figure Bl.17.8. Iron oxide particles coated with 4 nm of Pt in an m-planar magnetron sputter coater (Hennann and Mtiller 1991). Micrographs were taken in a Hitachi S-900 in-lens field emission SEM at 30,000 primary magnification and an acceleration voltage of 30 kV. Image width is 2163 nm.

Fig. 19 —Cross-sectional morphologies of (a) TiN coating with hardness of 26 GPa, and (b) TiN/Si3N4 coating with optimum Si content of 10.8 at. % and hardness of 47.1 GPa deposited by reactive magnetron sputtering.

Fig. 22—Friction coefficients between WC ball and TiN/Si3N4 nanocomposite coatings as function of the Si content. The coatings were deposited by reactive magnetron sputtering. The friction coefficients of the TiN/Si3N4 coatings were obtained under the load of 20 N. In the case of the TiN coating and the Si3N4 coating, the load is 5 N, because the two coatings will fail and peel off from the substrate under the load of 20 N.

Fig. 23—The cutting life of the uncoated drill and the drills deposited with TiN coating and TiN/Si3N4 nanocomposite coatings drilling holes on quenched AISI 420 stainless steel. The coatings were deposited by reactive magnetron sputtering.

Monaghan, D. R, Teer, D. G., Laing, K. C., Efeoglu, I., and Ar-nell, R. D., Deposition of Graded Alloy Nitride Films by Closed Field Unbalanced Magnetron Sputtering," Surf. Coat. Technol., Vol. 5 9,1993, pp. 21 -25. 

C. May and J. Striimpfel, ITO coating by reactive magnetron sputtering — comparison of properties from DC and MF processing, Thin Solid Films, 351 48-52, 1999. 

This chapter examines the deposition of fluorinated polymers using plasma-assisted physical vapor deposition. Ultrathin coatings, between 20 and 5000 nm have been produced, using RF magnetron sputtering. The method of coating, fabrication, and deposition conditions are described. 

Wan, C. H., Lin, M. T., Zhuang, Q. H., and Lin, C. H. Preparation and performance of novel MEA with multicatalyst layer structure for PEFC by magnetron sputter deposition technique. Surface and Coatings Technology 2006 201 214-222. 

In general, the speed at which transfer and deposition take place is low, but it may be improved by magnetron sputtering, of which the types available include planar, closed field, hollow cathode, and post cathode—all giving coatings with good geometrical array. 

The process technology of magnetron sputtering has been described extensively in the literature [24,25]. A noteworthy introduction into magnetron sputtering of optical coatings is given by Herrmann et al. [26]. 

The transition mode process described here differs fundamentally from conventional reactive sputtering processes for ZnO coatings which do not permit optimization of the film characteristics since they are hysteresis-based. An example of this is the work of Jacobson et al. [96] on reactive DC-Magnetron sputtering of ZnO coatings. 

A crucial parameter for the productivity of an in-line sputtering system is the cycle time, with the deposition rate of the magnetron sputter process being an important parameter. The film thickness d [nm] at a given substrate transport speed vc [rnrnin can be calculated from the dynamic deposition rate ad[nmmmin 1] which is the film thickness when the substrate speed is lmmin-1. The dynamic rate can be derived from the static rate as [nmmin-1] on assuming the width b [m] of the coating zone. 

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