Bisphenol A resins

Bisphenol F Resin. Bisphenol F [2467-02-9] epoxy resin is of the same general stmcture as the epoxy phenol novolaks. Bisphenol F is 2,2Emethylene bisphenol. Whereas the epoxy phenol novolaks vary from viscous Hquids to soHd materials, the bisphenol F resin has a low viscosity (ca 4 Pa-s (40 P)) and 165 epoxy equivalent weight. Its n value (degree of polymerization) is about 0.15 and crystallization, often a problem with low viscosity conventional bisphenol A resins, is reduced with the bisphenol F resin. 

Applications with real composites have been performed in order to verify the results so far outlined. Namely, a metalfilled epoxy composite was selected, whose matrix material was a diglycidyl ether of bisphenol-A resin, cured with 8 percent by weight of the resin, triethylene-tetramine. 

Recently, several reports of the flame-retardant properties of boron-containing bisphenol-A resins have appeared from Gao and Liu.89 The synthesis of a boron-containing bisphenol-A formaldehyde resin (64 and 65) (Fig. 42) from a mixture of bisphenol-A, formaldehyde, and boric acid, in the mole ratio 1 2.4 0.5, has been reported.893 The kinetics of the thermal degradation and thermal stability of the resins were determined by thermal analysis. The analysis revealed that the resin had higher heat resistance and oxidative resistance than most common phenol-formaldehyde resins. 

Bisphenol A resins, 10 5-6 Bisphenol A terminated hardeners, 10 406 Bisphenol F epoxy resin, 10 368-369 Bis(phenolic) developers, 19 346-347 Bisphenol resins, formulation of,... 

The brominated bisphenol-A resin, Br2, was also too viscous for convenient filament winding, and in this case the halogen appeared to have small effect upon water absorption or fatigue life. 

EPON 1001 60 225 P MeCI (hot) 284 489 406 539 601 Epichlorohydrin-bisphenol A resin average molecular mass = 900 for steroids, pesticides... 

The epoxy novolac resins are synthesized by reaction of phenolic or cresol novolacs with epichlorohydrin in the same fashion as the bisphenol A resins. The number of epoxy groups per molecule is dependent on the number of hydroxyls in the phenol novolac molecule and to the extent to which they are reacted. Complete epoxidation can be accomplished, but this will lead to steric factors, which could limit the useful size of the cured polymer. Thus, selective epoxidation is often practiced.9... 

Bisphenol F resins are often mixed with conventional DGEBA epoxy resins because of the relatively high cost of the bisphenol F product. When mixed with bisphenol A resins, the two form crystallization-free resins of moderate viscosity. 

For adhesive systems, the liquid epoxy resins most widely used with LP-3 polymers are liquid unmodified and diluent-modified bisphenol A resins and liquid blends of bisphenol A and bisphenol F resins. Solid bisphenol A, multifunctional, and aliphatic diepoxy resins have also been used. Ratios of liquid polysulfide polymer to epoxy are in the range of 1 2 to 2 1. The effect of various degrees of polysulfide on cure properties of a DGEB A epoxy is shown in Table 7.7. An increase in elongation and impact strength is the result of increased amounts of the liquid polysulfide polymer. 

Wilkinson, S. P., et al., Reactive Blends of Amorphous Functionalized Engineering Thermoplastics and Bismaleimide/Diallyl Bisphenol A Resins for High Performance Composite Matrices, Polymer Preprints, vol. 33, no. 1, 1992, p. 425. 

CTBN modified bisphenol A resin (EPON 58005) Modified epoxy resin (EPON 862) 25 75 ... 

CTBN modified bisphenol F resin (EPON 58003) Elastomer modified bisphenol A resin 25 100 ... 

EPI-REZ 3510-W-60 185-215 500-5,000 Waterborne dispersion of bisphenol A resin similar Resolution... 

EPON Resin 58006 330-360 1,500-3,000 at 52°C CTBN elastomer modified bisphenol A resin Resolution... 

Bisphenol A resins. The most widely used epoxy resins are diglycidyl ethers of bisphenol A (DGEBA). These are produced by the reaction of bisphenol A and epichlorohydrin in the presence of sodium hydroxide (Figure 2.1). 

Previous Work on Latent Catalysts for Epoxy Resins. Numerous patents (, , ) have been issued in recent years on the development of latent catalysts for DGEBA (i.e., diglycidylether of bisphenol a ) resins, but most fulfill only a few of the conditions outlined above. One of the most successful of these has been the boron trifluoride-monoethylamine complex ( ). However, one of the serious disadvantages of this particular latent catalyst is the poor electrical properties at elevated temperatures of the epoxy resin in the cured state (7 ). 

The aromatic carbon region of the carbon-13 nmr spectrum of an unheated sample is shown in Figure 6. The four lines marked with arrows are from the bisphenol-A resin. The relative intensities do not necessarily reflect the relative concentration of the two components. But the intensities of these four lines did decrease with the heating time of the mixture until after 7 hours they were barely observable. The DMSO-d solutions of the heated mixtures were intensely green, indicative of the presence of some type of reaction product. However, no new lines were evident in the spectra of the heated samples. This fact was attributed to very low concentrations of soluble reaction products, below the level required for carbon-13 nmr detection. 

Parabis. [Dow] Bisphenol A resin intermediate used to produce PC and poly-sulfone engineering thernx lastic resins. 

The DSC determination of many polymers has been described by numerous studies illustrative examples are those for plasticizers such as dioctyl phthalate in polyfvinyl chloride) (202) brominated bisphenol A resin (203) cured epoxy resin (204) polystyrene (205) and others. 

Expanded materials with excellent high-temperature properties are obtained when cresol novolacs are used as hardeners. A typical formulation is based on mixtures of bisphenol A resins and epoxy novolac resins which are cured by cresol novolacs and accelerated by suitable nitrogen-containing agents. 

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