Bisphenol A, epoxy resins from

Bisphenol A, epoxy resins from, 673 polymers from, 821 Bloch, Konrad Emil, 1084 Block copolymer, 1212 sy nthesis of, 1212... 

Epoxy resin EPON 2002 is a bisphenol A epoxy resin from Shell Chemicals. Vestagon B-31 is a curing agent and accelerator for epoxy coatings, and is made by Huls AG. 

Fig. 17. TAS-tiansfer of aromatic and cycloaliphatic amines hardened bisphenol A epoxy resins from alkaline fusion. Experimental details see Tables 10 and 12. Reference mixture V5 a) di-phenylmethane, b) diphenylsulfone, c) aniline, d) 4.4 -bisC4-hydroxyphenyl]methane, e) 4.4 -diaminodiphenylmethane, D m-phenylenediamine, g) 4.4 -diaminodiphenylsulfone, h) metlw-lenbisl 2-cyclohexylamine]...

One interesting approach to the loss of volatile liquids is the use of an evaporation suppressant for the styrene used to cure unsaturated polyester resins.181 The suppressant, made from a bisphenol A epoxy resin, stearic acid, colophony, triethanolamine, glycerol monostearate, calcium stearate, and sorbitan monostearate, may coat the surface to retard evaporation. 

For the less critical applications, standard (epichlorhydrin/bisphenol A) epoxy resins retain their physical properties well, but are particularly subject to the adverse effects of UV radiation on their appearance. This causes rapid yellowing and chalking due to their aromatic structure and UV agents are ineffective. Therefore, aU mouldings made with these resins which are to be subjected to extended outdoor exposure will benefit from protection by surface coating or shading. 

Figure 24.4 TEM micrographs of systems containing 15 wt% SiOi, both produced from a bisphenol-A epoxy resin grafted with an amine alkoxysilane-coupling agent (a) epoxy/silica hybrid (cocontinuous domains) and (b) epoxy/silica nanocomposite (particulate silica domains).

Bakelite 100 is a phenolic resole from Bakelite AG. Epikote 1007 is a bisphenol A epoxy resin of molecular weight 2900 and is a product of Shell Chemicals. 

Epoxy-zirconia nanohybrid materials were synthesized from bisphenol A epoxy resin (diglycidyl ether of bisphenol A), zirconium(IV)- -propoxide, and hexahydrophthalic anhydride using a combined sol-gel/polymerization process. The obtained materials exhibited nanosized zirconia particles uniformly dispersed within the epoxy matrix and, consequently, showed excellent optical transparency [183-185]. 

The addition of 2% carbon black bisphenol A epoxy resin increased its fracTure toughness by about 18% from 0.73 to 0.86 MPa. 

Epichlorohydrin and Bisphenol A-Derived Resins. The most widely used epoxy resins are diglycidyl ethers of bisphenol A [25068-38-6] (1) derived from bisphenol A [80-05-7] and epichlorohydrin [106-89-8],... 

It is possible to explain the formation of epoxy resins from bisphenol A and epichlorohydrin according to the following scheme. 

Preparation of Epoxy Resins from Bisphenol A and Epichlorohydrin... 

An interesting approach to maleimide-terminated phenoxy resin has recently has described (42). para-Maleimidobenzoic acid was reacted with diglyci-dylbisphenol-A epoxy resin in the presence of catalyst to provide the bismale-imide of Fig. 13. Instead of diglycidyl bisphenol-A, linear epoxy resin pre-polymers can be used in this reaction to form a maleimide terminated phenoxy resin. Another suitable functionalized monomaleimide is m- or p- N-(hydroxyphenyl) maleimide which is synthesized from maleic anhydride and m-aminophenol in DMF as a solvent at 70 °C. The purified hydroxyphenyl maleimide was reacted with epoxy resin to form novel BMIs as outlined in Fig. 14. The new BMI and phenoxy oligomers polymerize at temperatures of 200-220 °C, but the cure temperatures can be significantly lowered when catalysts such as imidazoles or triphenylphosphine are added. The cured homopolymers show Tg of 140 and 230 °C for the n = 2 and the n = 1 polymer, respectively(43). 

The/flc-ClRe(CO)3(4,7-Ph2-phen) complex has been demonstrated to be a useful spectroscopic probe in the curing of photosensitive epoxy-based materials [100], Emission spectra obtained from a 0.05-mm thickness film of a mixed epoxy system of bisphenol-A/novalac resin (Interz, SU8) and diglycidyl ether of bisphenol-A (DGEBA) containing cation-generating triarylsulfonium hexafluo-roantimonate salts as photoinitiators (Union Carbide, Cryacure UVI-6974) and... 

As industrial relevant Friedel-Crafts reaction, the synthesis of Bisphenol-F, a material for epoxy resin, from phenol and formaldehyde was chosen [57]. This reaction involves formation of higher order condensates such as tris-phenols. To minimize the latter, the molar ratio of phenol to formaldehyde is set to a very high value (30-40), which is more than 15 times larger than the amount theoretically necessary. Three types of micromixers were used. These are a T-shaped mixer with 500 pm inner diameter, a multilaminating interdigital micromixer with 40 pm channels and a so-called self-made K-M micromixer with center collision mixing. 

FIGURE 2.4 Synthesis of DGEBA epoxy resin from bisphenol A and epichlorohydrin/... 

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