Application specific integrated circuits ASIC

Availability of multi-amplifier Application Specific Integrated Circuits (ASICs) with low powers of -1 mW per channel. 

Electronic circuits must be protected from the harsh environment of the human body. The packaging of implantable electronics uses various materials, including polymers, metals, and ceramics. The encapsulation method depends somewhat on the electronic circuit technology. Older devices may still use discrete components in a classical form, such as leaded transistors and resistors. The newer designs, depending on the sophistication of the implanted device, may employ application-specific integrated circuits (ASICs) and thick film hybrid circuitry for their implementation. Such circuits place considerable requirements for hermeticity and protection on the implanted circuit packaging. 

Level 5 (genius) pixels (thousands of transistors) have complexities, in general, above a thousand active devices, a level of complexity sufficient for implementing application-specific integrated circuits (ASICs) and microprocessors. But this functionality level has problems not faced by the lower levels. First, for free-space optical interconnection, optical I/Os should be arranged in a structured two-dimensional pattern in order to effectively use the two-dimensional nature of imaging optics. On the other hand, computer-aided design (CAD) tools for elec-... 

Chip stacks. A recent approach to increasing component densities is to connect the die or chip devices vertically as a chip stack instead of assembling them horizontally on a substrate. The silicon chips are first thinned to several mils (2-4 mils), then bonded together. Where the chips are of different sizes, such as an application-specific integrated-circuit (ASIC)... 

CEHW [such as Field-Programmable Gate Arrays (FPGAs), Application Specific Integrated Circuits (ASICs), and other custom micro-coded devices] are often just as complex as S/W-controlled microprocessor-based systems (CAST-27 paragraph 2a). 

Application specific integrated circuits (ASICs), also called custom ICs, are chips specially designed to (1) perform a function that cannot be done using standard components, (2) improve the performance of a circuit, or (3) reduce the volume, weight, and power requirement and increase the reliability... 

This promotes the basic requirements for design and development of E/E/PE systems including hardware and software architecture, sensor, actuators, and PE including embedded software, application specific integrated circuit (ASIC), etc. Major issues related to this shall include but not be limited to the following ... 

FPGA can be conceived as one application specific integrated circuit (ASIC) in a prototype stage. Two technologies have their own pros and cons, hence have their market share based on application. Major differences between ASIC and FPGA come from costs, tool availability, performance, and design flexibility. The major distinct features have been compared in Table APV/1.3-1. 

Table APV/1.3-1 Comparison of Features for Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) ...

In 1999 an incident at Uljin Nuclear Power Station Unit 3 in Korea corrupted data on the performance net of the plant control computer [2]. The incident was caused by the failure of an application-specific integrated circuit (ASIC) chip on a rehostable module, which is part of a network interface module. Several non-operational pumps started without any demand, some closed valves opened and other open valves closed, and some circuit breakers switched on or off. There was also some relay chattering. Due to the response of the operators and because of diverse systems, the incident was mitigated without adverse consequences. 

Figure 7.13 The architecture of a wireless capsule containing temperature and pH sensors at the front, followed by application-specific integrated circuit (ASIC) and batteries.

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