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Application method curing

In addition to joining, adhesives in electrical applications may be required to conduct heat, conduct or isolate electricity, provide shock mounting, seal, protect substrates, etc. Thermal and chemical resistance, weathering, and structural compatibility must also be considered in diverse electrical and electronic applications. Of course, the choice of adhesive will also be governed by application methods, cure temperature, processing speed, and overall economic cost. [Pg.13]

Technical specifications Number of plies required Application methods Cure time... [Pg.690]

Epoxy adhesives have achieved their commercial success due in no small way to their processing capabilities. Epoxy chemistry is compatible with (1) a variety of formulating techniques and processes accessible to the adhesive manufacturer and (2) a variety of application and curing methods accessible to the end user. [Pg.391]

Films. Both structural and nonstructural adhesives are commonly available in film form. Adhesives applied in the form of dry films offer a clean, hazard-free operation with minimum waste and excellent control of film thickness. However, the method is generally limited to parts with flat surfaces or simple curves. Optimum bond strength requires curing under heat and pressure, which may involve considerable equipment and floor space, particularly for large parts. Film material cost is high in comparison to liquids, but waste or material loss is the lowest of any application method. [Pg.409]

Special methods of incorporation alkyl peroxide bridging to vinyl containing siloxane polymers used for conductive applications improved curing characteristics decreased by the presence of carbon black crosslinking based on platinum catalyzed polyvinylmethyl siloxane and polymethyl hydrogen siloxane is not inhibited by carbon black in situ silica formation in fonnation of PDMS nanocomposite, montmorillonite was delaminated in polymer prior to crosslinking ... [Pg.698]

Compression-molding is one of most applicable methods of processing plastic masses [143]. The press material, in the form of a powder, granules or pellets, is charged into the mold and subjected to heat and pressure effects. The article is molded and cured in the heated state. The molding pressure... [Pg.323]

Acrylated melamines have properties which make them suitable for use in OV curable coatings. Properties can be varied by adjusting the combined acrylamide content and the inclusion of other modifiers. Formulation viscosities are satisfactory for normal application methods, and films cure to a high degree of hardness at practical irradiation levels. Benefits demonstrated include improved tape and scratch adhesion, abrasion resistance, color, and Q-U-V durability. [Pg.192]

Combinations with Poly (Vinyl Butyrals). Poly(vinyl butyral) resins with a high acetal content are used, like epoxy resins, to plasticize resols. The weight ratio of resols to poly(vinyl butyral) is generally between 95 5 and 70 30. The employed application methods and curing conditions are similar to those used in the resol-epoxy resin systems. The resistance of such paint films to organic solvents, amines. [Pg.88]

Most paints are supplied as liquids that are applied by different methods, using various types of equipment (see Chap. 8). The properties and uses of powder coatings are described in Section 3.4. Once applied, the wet paint film must dry to a hard solid film. Paints that dry at ambient temperature (air-drying paints) may be force-dried at temperatures up to 100 °C. Other types of paints require higher temperatures (120-220°C) for film formation that involves reaction of two and more binder components. Thus, the paint formulator has to consider both the properties of the liquid film and those of the final dry film. Liquid film properties have to be considered during storage, application, and curing. [Pg.243]

Simple no-mix application Multiple curing methods available... [Pg.765]

The organic substrates were resin layers formed by the spin coatingof PI-5878 (8juthick) onto Si wafers. The resin was heated to approximately 100°C on a hot plate for 20-30 minutes to remove excess solvent (i.e.,N-methylpyrroli-done) so as to form a rigid condensed-phase polyamic acid (PAA) layer. A 0.1% aqueous solution of JT-APS was then applied to the PAA film layer by use of a puddle-spin application method. These specimens were examined by XPS before and after in situ thermal treatment. The results were compared with those obtained for non-silane treated PAA films before and after curing. [Pg.518]

Chemical and humidity Flamma- Method Cure Application ... [Pg.845]

The purpose of this chapter is to aid readers in selecting surface preparation methods, coating materials, and application methods. It also acquaints them with curing methods and helps them to comply with environmental regulations. [Pg.886]

Precautions during the application of paint depend on the methods of application and curing used. Minimizing contact with solvent vapour requires air extraction spray operations will be carried out in spray booths where contaminated air and excess spray droplets are treated. For some materials such as isocyanates, spray operators may be required to wear air-fed hoods. Factory environments are now regulated for all emissions including vapours, dusts and liquid and solid wastes, and these must be monitored and controlled. [Pg.260]

Depending on the differences nsed in the application methods of layers and curing details, there are different open mould processes (such as hand lay-np, spray-np, automated laying... [Pg.331]


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See also in sourсe #XX -- [ Pg.220 ]




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