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Adhesion humidity

In summary, the early ink formulations worked well as they did have good performance characteristics with regards to end user properties (dry time, adhesion, humidity tolerance, etc). But a very significant factor is that they performed very robustly in the printer, due to the fact that the printer was designed around the formulation characteristics. When an ink works well in the field, customers, service people and sales people are all confident to use it. [Pg.145]

In an investigation of the influence of air humidity on adhesion, hysteresis phenomena have been observed [143]. In Fig. IV.IO we show the force of adhesion of spherical glass particles 50 2 /im in diameter as a function of the relative humidity of the air. The lower branch of the hysteresis loop shows the way in which adhesion increases as the air relative humidity is increased the lower branch shows the way in which adhesion drops off as the air humidity is reduced. The failure of the two branches of the adhesion-humidity curve to coincide indicates that the processes of capillary condensation and evaporation of mois-... [Pg.118]

Cyanoacrylate adhesives (Super-Glues) are materials which rapidly polymerize at room temperature. The standard monomer for a cyanoacrylate adhesive is ethyl 2-cyanoacrylate [7085-85-0], which readily undergoes anionic polymerization. Very rapid cure of these materials has made them widely used in the electronics industry for speaker magnet mounting, as weU as for wire tacking and other apphcations requiring rapid assembly. Anionic polymerization of a cyanoacrylate adhesive is normally initiated by water. Therefore, atmospheric humidity or the surface moisture content must be at a certain level for polymerization to take place. These adhesives are not cross-linked as are the surface-activated acryhcs. Rather, the cyanoacrylate material is a thermoplastic, and thus, the adhesives typically have poor temperature resistance. [Pg.233]

A second type of uv curing chemistry is used, employing cationic curing as opposed to free-radical polymerization. This technology uses vinyl ethers and epoxy resins for the oligomers, reactive resins, and monomers. The initiators form Lewis acids upon absorption of the uv energy and the acid causes cationic polymerization. Although this chemistry has improved adhesion and flexibility and offers lower viscosity compared to the typical acrylate system, the cationic chemistry is very sensitive to humidity conditions and amine contamination. Both chemistries are used commercially. [Pg.248]

Interlayer moisture is one of the important controls for PVB-to-glass adhesion of current formulations (although moisture-insensitive formulations are being developed). The moisture content equiUbrates with the relative humidity to which the interlayer is exposed and thus is variable. Prior to lamination, interlayer moisture content is measured by one of three methods. The most rapid is by air absorption using a spectrophotometric technique to determine a... [Pg.526]

Chemical treatments commonly appHed to cormgated paperboard packaging materials include additives that impart various degrees of water resistance, humidity resistance, oil and grease resistance, product abrasion resistance, product corrosion resistance, adhesion release properties, flame-retardant properties, nonskid properties, and static electricity control properties to the finished package (1,2). [Pg.518]

The web materials used to form dmms and cans can be customized to each packaging apphcation. The materials are selected based on the package properties of moisture and humidity resistance, nonstick resistance, or barrier properties required. The adhesives used to bond the phes together include sihcates, poly(vinyl alcohol), and poly(vinyl acetate) (10). Sihcate adhesives are most commonly used in the manufacture of dmm packages. [Pg.519]

Phenohc resins (qv), once a popular matrix material for composite materials, have in recent years been superseded by polyesters and epoxies. Nevertheless, phenohc resins stiU find considerable use in appHcations where high temperature stabiHty and fire resistance are of paramount importance. Typical examples of the use of phenoHc resins in the marine industry include internal bulkheads, decks, and certain finishings. The curing process involves significant production of water, often resulting in the formation of voids within the volume of the material. Further, the fact that phenoHcs are prone to absorb water in humid or aqueous conditions somewhat limits their widespread appHcation. PhenoHc resins are also used as the adhesive in plywood, and phenohc molding compounds have wide use in household appliances and in the automotive, aerospace, and electrical industries (12). [Pg.7]

In addition to transport properties, the adhesive properties are characterized by tensile measurements. For instance, the peel strength is deterrnined by measuring the force required to pull the adhesive from a substrate at a constant speed in a controUed temperature and humidity environment. [Pg.234]

Structural Composites. Because of their exceUent adhesion, good mechanical, humidity, and chemical-resistance properties, epoxy resins are... [Pg.370]

An example of interaction stiffness and force curves for a Si surface with a native oxide at 60% relative humidity (RH) is shown in Fig. 12 [104]. The stiffness and force data show an adhesive interaction between the tip and substrate. The hysteresis on retraction is due to a real change in contact area from surface oxide deformation and is not an experimental artifact. The adhesive force observed during retraction was consistent with capillary condensation and the surface energy measured from the adhesive force was close to that of water. [Pg.210]

Fitzpatrick et al. [41] used small-spot XPS to determine the failure mechanism of adhesively bonded, phosphated hot-dipped galvanized steel (HDGS) upon exposure to a humid environment. Substrates were prepared by applying a phosphate conversion coating and then a chromate rinse to HDGS. Lap joints were prepared from substrates having dimensions of 110 x 20 x 1.2 mm using a polybutadiene (PBD) adhesive with a bond line thickness of 250 p,m. The Joints were exposed to 95% RH at 35 C for 12 months and then pulled to failure. [Pg.284]

Changes observed in the composition of the rubber/brass interphase correlated well with results of adhesion tests carried out on brass-plated steel wires embedded in blocks of rubber [46]. The force required to pull the wires out of the blocks decreased steadily as vulcanization temperature increased. This effect was especially pronounced when the specimens were aged at elevated temperature and humidity for several days before the wires were pulled out of the rubber blocks. [Pg.295]

The humidity requirement is probably most significant for polar or hydrophilic adhesives, for example,. some of the acrylate adhesives. [Pg.469]

Environmental conditions under which solvent release from the adhesive on the substrate is produced must be carefully controlled. Humidity is critical because loss of heat due to solvent evaporation may allow attainment of the dew point (the evaporation of the solvent is an endothermic process), and then condensation of water on the adhesive can result. This phenomenon is often called moisture blooming. The presence of water on the adhesive film causes a detrimental effect because the autoadhesion of rubber chains is greatly inhibited. Therefore, humidity must be controlled and avoided by increasing the temperature during solvent evaporation. [Pg.575]

Like the 1-RTV systems, the two-part room temperature vulcanization systems (2-RTV) cure to produce flexible elastomers that resist humidity and other harsh environments. Interestingly, they display primerless adhesion property to many substrates, and are used in silicone adhesives, sealants, seals, and gaskets, to name a few. [Pg.685]


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See also in sourсe #XX -- [ Pg.349 ]




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