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Small outline integrated circuit

Dunford et al. investigated the metallurgical and reliability aspects of Pb-free mixed technology electronic assemblies utilizing area array packages, leadless ceramic chip passives, and small outline integrated circuits with conventional Sn-Pb terminations on a thin PWB with Au/Ni surface finish utilizing Sn-Ag-Cu-Sb solder as the interconnection alloy. The Sn-Au and Sn-Ag... [Pg.812]

See other pages where Small outline integrated circuit is mentioned: [Pg.384]    [Pg.440]    [Pg.441]    [Pg.360]    [Pg.924]    [Pg.1222]    [Pg.304]    [Pg.676]    [Pg.384]    [Pg.440]    [Pg.441]    [Pg.360]    [Pg.924]    [Pg.1222]    [Pg.304]    [Pg.676]    [Pg.1617]    [Pg.299]    [Pg.231]    [Pg.343]   
See also in sourсe #XX -- [ Pg.447 ]



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