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Thermal response parameter , solid

In chap. 4 we argued that much can be learned by comparing the energetics of different competing states of a crystalline solid. One set of material parameters that can be understood on the basis of total energy methods like those presented in the previous chapter in conjunction with the methods of statistical mechanics are those related to the thermal response of materials. Indeed, one of the workhorses... [Pg.210]

The elementary cell or lattice is the lowest structural level of a crystal. The lattice is characterized by a space symmetry group, atom positions and thermal displacement parameters of the atoms as well as by the position occupancies. In principle, the lattice is the smallest building block for creating an ideal crystal of any size by simple translations, and it is the lattice that is responsible for the fundamental parameter. Therefore, it is extremely important to perform the structure refinement of a crystal obtained, especially if the crystal represents a solid solution compound or demonstrates unusual properties or has unknown oxygen content or is assumed to form a new structure modification. [Pg.190]

Recent publications on the thermal stability of proteins organized in dense solid films, deposited by LB (Nicolini et al. 1993, Facci et al. 1994, Erokhin et al. 1995) and by self-assembling (Shen et al. 1993), leave several questions unanswered, hi particular, it is still not completely clear which parameter is responsible for this phenomenon. Two main factors are discussed when speaking about induced thermal stabihty, namely, decreased water content and molecular close packing (Nicolini et al. 1993). It seems that both of them work in parallel, and unfortunately it is difficult to settle directly which one plays the dominant role. [Pg.153]

The aim of this chapter is to clarify the conditions for which chemical kinetics can be correctly applied to the description of solid state processes. Kinetics describes the evolution in time of a non-equilibrium many-particle system towards equilibrium (or steady state) in terms of macroscopic parameters. Dynamics, on the other hand, describes the local motion of the individual particles of this ensemble. This motion can be uncorrelated (single particle vibration, jump) or it can be correlated (e.g., through non-localized phonons). Local motions, as described by dynamics, are necessary prerequisites for the thermally activated jumps responsible for the movements over macroscopic distances which we ultimately categorize as transport and solid state reaction.. [Pg.95]

Biological responses are typically dependent on a number of test parameters Including state of the tested material (solid or In solution), solvent, organism and test procedure. Since test results are dependent on these variables. It Is advantageous to associate testing conditions with an Intended application. Much of our research with polymers containing tin, antimony and arsenic Is associated with control of mildew and rot for eventual application In topical medications, as thermal Insulation and as additives In paints, textiles and paper products. [Pg.17]

Material Parameters. The key means whereby material specificity enters continuum theories is via phenomenological material parameters. For example, in describing the elastic properties of solids, linear elastic models of material response posit a linear relation between stress and strain. The coefficient of proportionality is the elastic modulus tensor. Similarly, in the context of dissipative processes such as mass and thermal transport, there are coefficients that relate fluxes to their associated driving forces. From the standpoint of the sets of units to be used to describe the various material parameters that characterize solids, our aim is to make use of one of two sets of units, either the traditional MKS units or those in which the e V is the unit of energy and the angstrom is the imit of length. [Pg.808]

The choice of methods is a matter of convenience. Both will capture the essential features of the GLE, namely frictional energy loss from the primary atoms to the secondary atoms and thermal energy transfer from the secondary atoms to the primary atoms. Both will provide a reasonable description of the bulk and surface phonon density of states of the solid. Neither will provide the exact time-dependent response of the solid due to the limited number of parameters used to describe the memory function. [Pg.215]

One parameter which is not included in either model, and which clearly must have an important effect on thermal shock resistance, is the thermal conductivity of the ceramic (see Sec. 13.6). Given that thermal gradients are ultimately responsible for the buildup of stress, it stands to reason that a highly thermally conductive material would not develop large gradients and would thus be thermal shock resistant. For the same reason, the heat capacity and the heat-transfer coefficient between the solid and the environment must also play a role. Thus an even better indicator of thermal shock... [Pg.451]

Each of these steps depends on the process before. The software suite starts with the material selection, in which also an individual material can be dehned. Fiber orientations and the number of plies can be selected in a following step. All material parameters must be chosen before the analysis can start. Six structural analysis modules can be differentiated with the CDS software suite. These solid mechanic modules are thick-walled cylinder, thin plate, thin plate impact-fastener modeling, thick plate, discontinuous tile modeling and compliant beam interlayer analysis. The CDS software suite allows changing the parameters of the manufacturing process or the laminate structure in real time. Four result sections for those parameter changes are provided by the software the effective properties, thermal-processing response, stress-strain results and the failure response. The CDS software suite is a complete analysis tool kit which is easy to use for the client. The software also allows export into an external simulation tool. [Pg.201]


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