Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Thermal mechanical analyzer

The current method of determining the energy properties of polyurethane is the Dynamic Thermal Mechanical Analyzer (DTMA). This instrument applies a cyclic stress/strain to a sample of polyurethane in a tension, compression, or twisting mode. The frequency of application can be adjusted. The sample is maintained in a temperature-controlled environment. The temperature is ramped up over the desired temperature range. The storage modulus of the polyurethane can be determined over the whole range of temperatures. Another important property closely related to the resilience, namely tan delta (8), can also be obtained. Tan (8) is defined in the simplest terms as the viscous modulus divided by the elastic modulus. [Pg.120]

Data obtained on the thermal mechanical analyzer by P. J. Sorokach and on the dilatometer by R. W. Dunning is gratefully acknowledged. [Pg.396]

Thermal Characterization. The DuPont 941 Thermal Mechanical Analyzer (TMA), attached to a model 900 thermal analyzer, was used for the measurement of glass transition temperature (Tg). The heating rate was set at 10 C/min. For wet samples, about 0.05 ml of distilled water was dropped into the TMA sample holder tube before running the experiments, to maintain the sample in a water saturated state during the measurement. [Pg.158]

A Seiko thermal mechanical analyzer (TMA/SS 100) was utilized to measure tensile modulus of the composite films. The gauge length of measurement was 10 mm. A force mode with a ramp rate of 5 g/min up to the maximum force of 40 g was... [Pg.40]

RoHS-Compliant. The Keyword RoHS Compliant is also descriptive, intended to convey that the laminate is sufficiently thermally robust to withstand the rigors of lead-free reflow assembly temperatures. For a more quantitative approach, look for materials that comply with slash sheets that show results for time to delamination (Td) by thermal mechanical analyzer (TMA). This test is optional and the results, given in minutes to delaminate at three benchmark levels of 260,288, and 300°C, are minimums. The establishment of these levels and the minimum time to delamination puts a laminate in the class of the more thermally robust materials, but does not guarantee any minimum performance for a particular multilayer board (MLB) in its specific assembly temperature exposures. [Pg.618]

The coefficient of thermal expansion (CTE) can be measured through several methods, the most direct being through linear or volumetric dilatometry. Thermal mechanical analyzers (TMAs) are ideally suited for such measurements, as their components are made of very low expansion materials such as quartz. With precise temperature control, they are able to accurately measure linear dimensional changes as a function of temperature. They are often equipped to measure other properties such as softening temperature in addition to the coefficient of thermal expansion as a function of temperature. [Pg.546]

Thermal mechanical analysis (TMA) was performed on a TA 2940 thermal mechanical analyzer to measure the glass transition tempanture and thermal expansion coefficients. The heating rate was 5 IC/min. For each sample, three specimens wo-e tested. [Pg.820]

Characterization. Differential scanning calorimetry and thermal mechanical analysis data were obtained on a DuPont 990 thermal analyzer coupled with a DuPont DSC or TMA cell. Isothermal aging studies were carried out with an automatic multisample apparatus. [Pg.42]

Measurements of the coefficient of thermal expansion (CTE) were taken on a thermo mechanical analyzer (TMA 2940) from TA Instruments with a film fiber attachment, in a nitrogen atmosphere. The cured films were cut into 15mm by 3mm samples, the force applied was 0.05N 0.10 N, and the sample was heated at 5 °C/min. The CTE was calculated as a = (AL x K)/(L x AT) where L = length, K = a cell constant, T = temperature °C. Test variability was +/-2.306 ppm/ °C based on five Kapton H tests. [Pg.144]

Super-Ideal Quenching of Products of CO2 Dissociation in Thermal Plasma. Analyze a kinetic scenario for performing super-ideal quenching. Calculate the possible separation of vibrational and translational temperatures of CO2 molecules during cool down of the hot gas mixture from the temperatures optimal for thermal CO2 dissociation. Which mechanism of VT relaxation is the most important during the quenching (take composition of the mixture from Fig. 5-3). [Pg.352]

The study of elastic and viscoelastic materials under conditions of cyclic stress or strain is called dynamic mechanical analysis, DMA. The periodic changes in either stress or strain permits the analysis of the dynamic response of the sample in the other variable. The analysis has certain parallels to the temperature-modulated differential thermal analysis described in Sect 4.4, where the dynamic response of the heat-flow rate is caused by the cyclic temperature change. In fact, much of the description of TMDSC was initially modeled on the more fully developed DMA. The instruments which measure stress versus strain as a function of frequency and temperature are called dynamic mechanical analyzers. The DMA is easily recognized as a further development of TMA. Its importance lies in the direct link of the experiment to the mechanical behavior of the samples. The difficulty of the technique lies in understanding the macroscopic measurement in terms of the microscopic origin. The... [Pg.412]

See differential thermal analysis, differential scanning calorimeter, dynamic mechanical analyzer, and thermogravimetric analysis. [Pg.968]

Selimovic et al. [11] in 2005 introduced a coupled thermal structural analysis, with emphasis on the thermal stresses caused by temperature gradients and the effect of the thermal expansion coefficient on the cell components. They used a FORTRAN code for the solution of current density, species transport, and the flow within the air channels. The temperature distribution obtained was mechanically analyzed using the commercial code FEMLAB. The mechanical analysis was performed solely on the cell components, having neglected the intercormector plates. An elastic approach was used and the cell components were assumed to be free of constraint Material properties based on the literature were used. Stress during operation was elucidated. Both steady-state and transient analyses were conducted. [Pg.768]

Table 2.1 shows TA apparatus which is commercially available. There are a variety of standard types, such as the thermogravimeter (TG), differential thermal analyzer (DTA), differential scanning calorimeter (DSC), thermomechanical analyzer (TMA) and viscoelastic measurement analyzer (the term thermomechanometery is sometimes used for measurements including TMA, DMA and other viscoelastic measurements) including a dynamic mechanical analyzer... [Pg.15]

Thermal, mechanical chemical and fracture properties of epoxy resins filled with alumina particles have been analyzed as a function of average filler size, size distribution, particle shape, loading and epoxy cross-link density (McGrath et al, 2008). The authors have shown that the density of cross-link and the amount of filler were the most important variables, modifying all properties, while other parameters (i.e. particle size, shape and size distribution) have little impact on the final properties. [Pg.104]


See other pages where Thermal mechanical analyzer is mentioned: [Pg.624]    [Pg.495]    [Pg.49]    [Pg.10]    [Pg.199]    [Pg.1069]    [Pg.1072]    [Pg.624]    [Pg.495]    [Pg.49]    [Pg.10]    [Pg.199]    [Pg.1069]    [Pg.1072]    [Pg.42]    [Pg.185]    [Pg.254]    [Pg.73]    [Pg.276]    [Pg.490]    [Pg.275]    [Pg.7]    [Pg.14]    [Pg.236]    [Pg.356]    [Pg.69]    [Pg.206]    [Pg.756]    [Pg.129]    [Pg.138]    [Pg.82]    [Pg.361]    [Pg.198]    [Pg.580]    [Pg.181]    [Pg.488]    [Pg.221]    [Pg.309]    [Pg.290]   
See also in sourсe #XX -- [ Pg.495 ]




SEARCH



Dynamic mechanical thermal analyzer

Dynamic mechanical thermal analyzer DMTA)

Mechanism thermal

THERMAL MECHANICAL

© 2024 chempedia.info