Tape-automated-bonding technology

Figure 5. Tape automated bonding system. (Reproduced permission from Ref. 4. Copyright 1988 [Technology and Management, Ltd.].)...

Manufacturing process of TAB (Tape Automated Bonding) has been developed by reel to reel from the beginning for specific applications. The details of the technology will be considered in Chap. 66. 

SMC-TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology SMC-WP-001 Soldering Capability... 

The next evolution of the circuitry technology was to mount the drive-address IC chips on the glass substrate itself. Toward this end, the new generation of LCD glass, e.g., code 1737, had a TCE that matched that of silicon. The IC chips were mounted by either flip-chip or tape-automated bonding (TAB) techniques. This hybrid approach led to a more compact display morphology. 

Tape automated bonding (TAB) and controlled collapse chip connection (C4) are two other common first-level packaging technologies that allow increased I/O density compared with wirebonding in molded plastic packages. In TAB, chips are thermocompression bonded to the inside ends of radially patterned metal leads on pol5uner tape. The outside ends of the leads are then soldered to a second-level package and the chip is covered with an encapsulant. 

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