Flexible circuits Tape automated bonding

Since the invention of integrated circuits (ICs), polyimides as heat-resistant organic polymers have been applied to insulation materials in electronics devices such as flexible printed circuit boards (FPCs), interlayer dielectrics, buffer coatings, and tape automated bonding (TAB). A polyimide thin layer is easily... 

JP 05311144 (Japanese) 1993 Heat-resistant adhesive compositions containing polyimide-siloxane block copolymers Ube Industries, Japan H Inoe, S Takabayashi, T Funakoshi, K Sonoyana Useful for Cu-clad laminates of printed circuit boards and tape-automated bonding with good flexibility and heat resistance Formulated compositions containing siloxane-imide block copolymers made from aromatic tetracarboxylic acids and aromatic diamines and aminosiloxanes... 

Film Applications Film for tape automated bonding (TAB) applications, flexible printed circuits (FPCs), insulation stirrer automotive wiring harness, bar code labels, aerospace, gas connections, fire gloves, and loudspeaker vibration boards. 

Tape-automated bonding (TAB) has not been considered as a type of flexible circuit because of the slightly different manufacturing processes. However, the basic construction and materials of the final products are the same therefore, TAB is categorized as a type of flexible circuit in this book (see Fig. 61.2). 

Figure 30 Main applications of adhesives in electronic and semiconductor industries (a) polyimide interlayer dielectric films in the fabrication of integrated circuits (b) die attachment in plastic packages (c) die attachment in ceramic packages (d) multichip module with flip chip and surface-mounted devices (e) flexible circuitry (f) tape automated bonding (g) liquid crystal display panels.

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