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NEPCON West

R. Miller in Proceedings of the National Electronic Packaging and Production Conference (NEPCON) West, Des Plaines, lU., 1986, pp. 867—870. [Pg.194]

Mark W. Grenfell, Frank W. Klink. and John G. Owens, Presented at the Nepcon West 1994 Conference, Anaheim, CA, March 4, 1994. [Pg.120]

Sharenow, B. Tape Automated Bonding High Lead Count Cost Analysis, Proc. Technical Program, NEPCON West, 1988 (written subsequently). [Pg.28]

Fathi Z, Tucker D, Ahmad I, et al. Innovative curing of high reliability advanced polymeric encapsulants. Ptoc. NEPCON West, Anaheim, CA 1998. [Pg.33]

Non-woven Aramid Reinforcements Controlled Thermal Expansion Prepreg and Laminate for Printed-Wiring Boards, Nepcon West, New Substrates, Sessions TS-01 and TS-00 (Mar. 27, 1995). [Pg.65]

Newbold J, Lewis A. The effects of new trends in flip-chip packages on automating the underfill process. In Proc. NEPCON West Mar. 1998. [Pg.72]

Gilleo K. The chemistry and physics of underfill. In Proc. NEPCON West, Anaheim, CA Mar. 3-5, 1998 280-292. [Pg.72]

Cross R. Synergistic combinations of thermally conductive fillers in polymer matrices. Proc. NEPCON West. Feb. 1996 531-8. I. [Pg.73]

Jackson D, Bixenman M. Critical cleaning of flip-chip packages using dense phase CO2 Technology, Proc. NEPCON West Conf. 2000 640-649. [Pg.213]

DeBarros T, Katze D. Achieving SMT compatible flip-chip assembly with no-flow underfills. Proc. NEPCON West Conf Anaheim, CA 2000. [Pg.286]

NEPCON West Sponsored by Reed Exhibition Co. Contact (203) 840-5358, fax (203) 840-9856, or e-mail inquiry nepcon.reedexpo.com. [Pg.645]

Levinson, L. M., et al. High Density Interconnects Using Laser Lithography, Proc. NEPCON West (1989)... [Pg.38]

Newbold, J., and Lewis, A., The Effects of New Trends in Flip-Chip Packages on Automating the Underfill Process, Proc. NEPCON West (Mar. [Pg.92]

Lewis, A., and Babiarz, A., Conductive Adhesive Dispensing Considerations, Proc. NEPCON West, Anzhdim, CA (Feb. 1999)... [Pg.259]

Kondo, M., Dispensible Adhesive Benchmarking, Proc. NEPCON West Conf, Anaheim, CA (2000)... [Pg.259]

Fathi, Z., Tucker, D., Ahmad, L, Yaeger, E., Konarski, M., Crane, L., and Heaton, J., Innovative Curing of High Reliability Advanced Polymeric Encapsulants, Proc. NEPCON West, Anaheim, CA (1998)... [Pg.36]

Cross, R., Synergistic Combinations of Thermally Conductive Fillers in Polymer Matrices, Proc. NEPCON West, 1996,1 531-538 (Feb. 1996)... [Pg.93]

Fathi, Z., etal.. Innovative Curing of High Reliability Advanced Polymeric Encapsulants, Proc. NEPCON West (1998)... [Pg.260]

Breunsbach, R., New Developments in Simplified, Low Cost, Semi-Aqueous Emulsion Cleaning Technology, Proceedings of NEPCON West, 1992, pp. 1217-1225. [Pg.1025]

Aguayo, K., and Boyer, K., Case History-Utilization of Nitrogen in IR Reflow Soldering, paper presented at the Technical Proceedings of NEPCON West, Anaheim, 1990. [Pg.1071]

See other pages where NEPCON West is mentioned: [Pg.392]    [Pg.389]    [Pg.858]    [Pg.858]    [Pg.859]    [Pg.82]    [Pg.92]    [Pg.260]    [Pg.919]    [Pg.82]    [Pg.92]    [Pg.259]   
See also in sourсe #XX -- [ Pg.645 ]



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