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System on a chip

C.H. Mastrangelo, DNA analysis systems on a chip, in Solid-State Chemical and Biochemical Sensors (P. Vincenzini and L. Dori, eds), pp. 465-476. Techna, Faenza (1999). [Pg.232]

Miniaturization of detection and identification equipment for use in the field. This is needed by soldiers, first responders, and other emergency and military personnel. This research will also allow the development of detection systems on a chip. Understanding materials and transport phenomena at the micron scale may facilitate research on miniaturized processes. [Pg.4]

Reliability and Degradation of lll-V Optical Devices, Osamu Ueda System-on-a-Chip Design and Test, Rochit Rajsuman... [Pg.213]

Q. He, Integrated nano liquid chromatography system on a chip, Ph.D. thesis, California Institute of Technology, Pasadena, CA, June 21 (2005). [Pg.13]

J. Xie, J. Shih, Y. Miao, T.D. Lee, Y.-C. Tai, Complete gradient-LC- ESI system on a chip for protein analysis. Proceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2005). Miami Beach, Florida, Jan 30-Feb 2, 778 (2005). [Pg.87]

Harrison, D.J., Fluri, K., Seiler, K., Fan, Z., Effenhauser, C.S., Manz, A., Micro-machining a miniaturized capillary electrophoresis-based chemical analysis system on a chip. Science 1993, 261, 895-897. [Pg.422]

Campbell DP, Moore JL, Cobb JM, Hartman NF, Schneider BH, Venugopal MG (1998) Optical system-on-a-chip for chemical and biochemical sensing the chemistry. Proc SPIE 3540 153-161... [Pg.100]

Jess J, Reis R, editors. Design of System on a Chip Devices Components. Springer 2004. p 255. [Pg.23]

Burns J, Mcllrath L, Keast C, Loomis A, Warner K, Wyatt P. Three-dimensional integrated circuits for low-power, high-bandwidth systems on a chip. Proc IEEE ISSCC 2001 453 268-269. [Pg.460]

Pattern density dependency, arising for system-on-a-chip design, is characterized with CMP process optimization, slurry selectivity, over-polish extent and dummy pattern structure. For low density devices, dummy structure is desirable under conditions that the supportive dense structure could exceed a threshold value for reduction of CMP erosioa Physical and electrical evaluations help to identify the process window for different density structure. The characterized SIT process feature will allow designers to print circuit patterns more efficiently and cram more fiinctions onto the silicon. [Pg.228]

Microfabrication technology used to manufacture microreactors also introduces many advantages, most notably the ability to rapidly and cheaply mass-produce devices. The low cost of microfabricated devices makes it possible for these devices to be disposable, a characteristic desirable for many medical applications. Rapid scale-up of production by operating many microreactors in parallel can also be accomplished. Microfabrication also presents the opportunity for complete systems in a single monolithic device or systems on a chip as microreactors are incorporated with chemical sensors and analysis devices, microseparation systems, microfluidic components, and/or microelectronics. [Pg.1645]

Fig. 13 Ploymerare chain reactor system on a chip reported by Ramsey et al. (A) Layout of chip. (B) On-chip Peltier heater/cooler for thermal cycling of PCR process. (From Ref... Fig. 13 Ploymerare chain reactor system on a chip reported by Ramsey et al. (A) Layout of chip. (B) On-chip Peltier heater/cooler for thermal cycling of PCR process. (From Ref...
R. Rajsuman. Testing a system-on-a-chip with embedded microprocessor. In Proc. IntT Testing Conf., 1999, pp. 499 - 508. [Pg.20]

L. E. Larson. Silicon technology tradeoffs for radio-frequency/mixed-signal system-on-a-chip. IEEE Trans. On Electron Devices, Vol. 50, No. 3, March 2003, pp. 683 - 699. [Pg.162]

Karnezas M. Advantages of system on a package and system on a chip. Electronics and Production Packaging. Jul. 2001. [Pg.33]

BERNARDI, L. BOLZANI, L. REBAUDENGO, M. REORDA, M. RODRIGUEZ-ANDINA, J. VIOLANTE, M. A new hybrid fault detection technique for systems-on-a-chip. IEEE Transactions on Computers, New York, USA IEEE Computer Society, 2006, v. 55, n. 2, pp. 185-198. [Pg.103]

Kamezas, M., Advantages of System on a Package and System on a Chip, Electronic Packaging and Production (Jul. 2001)... [Pg.36]


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See also in sourсe #XX -- [ Pg.223 ]

See also in sourсe #XX -- [ Pg.529 ]




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