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Space width

These equations can be solved in a least-squares sense, but in general they do not have a unique solution. The finite phase space width of the basis functions tends to dampen the sensitivity of the results, especially branching ratios, to the particular solution that is chosen. This sensitivity is further reduced when convergence with respect to multispawn is demonstrated. [Pg.455]

The resolution of 2LR with SNR/AZ resist where SNR had Mw of 3.8 x 104 was evaluated as a well-resolved line and space width on the Si wafer. A 0.2 /an SNR layer was coated on a hard-baked AZ resist with 1.0 thickness and exposed with an electron beam, then developed. The obtained pattern of SNR is transferred to the AZ resist layer by 02 RIE. [Pg.319]

Figure 7. Submicron line and space patterns of 2LR with SNR/AZ resist of 1.0 thickness (a) line and space width 0.2 pm, (b) line and space width... Figure 7. Submicron line and space patterns of 2LR with SNR/AZ resist of 1.0 thickness (a) line and space width 0.2 pm, (b) line and space width...
Figure 7 shows the SEM photographs of line and space patterns using an exposure of 10 / 2. The smallest line and space width of the 2LR pattern that was well-resolved is 0.2 . Figure 8 shows the resolution of 1LR poly-a-methylstyrene (aM-CMS) pattern and the 2LR using SNR/AZ resist. In the case of aM-CMS that is known as a high resolution negative electron resist in 1LR, the smallest line and space width is 0.4 jtm with 0.6 jim of resist thickness... [Pg.320]

Lastly, if the SiOj deposition is highly conformal, the regions between closely spaced metal lines may be filled without the production of gaps. If the film thickness is equal to half the space width, the space will fill completely and the comers of the film will join at the top of the space, thereby leaving a nearly planar film. Examples of CVD SiOj processes capable of the required high degree of conformality are ECR deposition and tetraethyl orthosilicate (TEOS) plasma CVD-enhanced. While this approach yields local planarization above closely spaced lines, the wide spaces between metal lines are not filled, and thus a sharp step is experienced at the edge of such spaces. Therefore, this approach is often coupled with SOG or resist etch-back processes or CMP.< >... [Pg.28]

C Consider a double-pane window whose air space width is 20 mm. Now a thin polyester film is used to divide the air space into two 10-min-wide layers. How will the film affect a) convection and (fc) radiation heal transfer through the window ... [Pg.571]

The effect of pH on patterned TEOS oxide wafers was also investigated using the MIT CMP Characterization Mask Set pitch mask [1]. The pitch mask is a 6 x 6 array of various equal width lines and spaces. The lines and spaces have widths ranging from 2 pm to 1000 pm. The 12 mm pitch pattern was first created in photoresist across the entire wafer. The expiosed oxide was plasma etched to a depth of about 7000 A below the surface. This created an array of 36 sub-arrays with equal width lines and spaces so that half the area was lines and the other half spaces. The wafers were pwlished with silica slurry at 3 different pH values. The oxide thickness at the plateau area (starting surface of the oxide) for 10 sub-patterns of line widths 40,60,80,100,125, 150, 180, 200,250, and 500 pm were measured before and after CMP. The measurements were made in each sub-array in increasing order of line/space width. Five dies were measured along the diameter of the wafer. [Pg.14]

Fig.2 shows the characteristics of planarity depending on oxide removal on upper area. The space width is 1000 M m in this case. The grinding shows the excellent planarization and almost same as the ideal curve. But CMP shows poor planarization and lOOOA of step remains after 700nm of oxide removal. Fig.3 (a) and Fig.3 (b) show the profile of the oxide surface. CMP case, not only the oxide on upper area but also the oxide on lower area is removed after the step becomes small. Because of the pad compressivity, the pad surface reached the... [Pg.20]

A second additional pattern dependent effect needs to be accounted for. As illustrated in the right side of Fig. 14, the effective oxide removal rate (which is modified in the removal rate diagram by the effective density) may also have an oxide space width dependence. That is, the removal rate diagram already accounts for the effective density, but for small oxide space sizes one observes even faster removal of the oxide space than density alone explains. We conjecture a relationship as shown in Fig. 14 based on localized high pressures near the edges of raised features. From contact wear analysis, as the oxide space width becomes small these high pressure peaks extend over a larger portion of the entire oxide feature and accelerate the oxide removal. [Pg.207]

Figure 14. Dishing and oxide erosion rate parameter dependencies. Shown at left is a conjectured dependency between the maximum dishing d, and the metal line width. Shown at right is a schematic acceleration of the oxide removal rate for small oxide space widths. Figure 14. Dishing and oxide erosion rate parameter dependencies. Shown at left is a conjectured dependency between the maximum dishing d, and the metal line width. Shown at right is a schematic acceleration of the oxide removal rate for small oxide space widths.
The change in disease state in OA is subjective. However, when X-rays have been used to measure changes in joint space, it cannot directly be linked to severity of pain that the patient is suffering, as it is not directly related to the disease as joint space width may not accurately reflect the width of articular cartilage. It would also be more helpful if the same outcome measures were used in each trial, as some use change in joint space whilst others use a questionnaire of symptom severity (e.g., WOMAC), or even both methods. " ... [Pg.2436]

LEI has been applied successfully to the trace determination of T1 [674] for certification purposes, and for combinations with laser evaporation and all other atomization techniques represents a powerful approach to detection. Laser photoionization and galvanic detection have been applied to hollow cathode dark space diagnostics [675]. Photoionization is produced to measure the dark space widths of linear field distributions directly. A theoretical model has been developed and its predictions verified with experimental findings for a uranium hollow cathode discharge operated in neon or xenon. Variations in the ground-state densities of sputtered neutrals have also been measured. [Pg.301]

CCD array at the end of the section. Typical photodiode arrays from Princeton Instruments and other manufacturers have individual diodes with a center-to-center spacing width of 25 tm and a height of 2 mm. This height matches the height of the 1-to-l image of the arc in a Xe lamp. The center-to-center spacing of the photodiodes and the dispersion of the spectrometer determine the spectral resolution of the system. [Pg.297]

FIGURE 4.24 Evolution of PE values with (a) different linewidth and (b) different ratio of linewidth to space width. [Pg.100]

Industrial rules of thumb generally equate the ceiling-space height to the plenum-space width and to the combined sticker-spacing height. Hydraulic tests on a model kiln confirm the former rule (Nijdam and Keey, 1999), and the latter is verified by a pressure-drop analysis (Nijdam, 1998). [Pg.834]

The pc values calculated for both FAIMS and HOD IMS may vary somewhat depending on the definition of separation space width,but the relative quantities and thus the conclusions regarding resolution are not significantly affected. [Pg.283]

Reactor vessel life could be prolonged since the neutron fluence upon reactor vessel is reduced through the increase in annular space width ... [Pg.86]

Dark space shield (plasma) A grounded surface that is placed at less than a dark space width from the cathode in order to prevent establishing a discharge in the region between the two surfaces. Also called the Ground shield. See also Paschen curve. [Pg.593]


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