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Solder corrosion

Lead-tin alloy solder s resistance to corrosion in aqueous and gaseous environments is a function of the alloy composition. The corrosion resistance of the alloy increases with tin content above 2 wt%. Lead forms unstable oxides, which readily react with chlorides, borates, and sulfates. [Pg.306]


FIG. 7—Radiator solder corrosion deposits at the tube to header joint, as viewed through the filler neck. This special form of corrosion can be minimized by radiator manufacturing techniques as well as recommended coolant maintenance practices. [Pg.17]

Material Die bondability Wire bondability Solderability Corrosion resistance... [Pg.562]

The Fe, Co, and Ni deposits are extremely fine grained at high current density and pH. Electroless nickel, cobalt, and nickel—cobalt alloy plating from fluoroborate-containing baths yields a deposit of superior corrosion resistance, low stress, and excellent hardenabiUty (114). Lead is plated alone or ia combination with tin, iadium, and antimony (115). Sound iasulators are made as lead—plastic laminates by electrolyticaHy coating Pb from a fluoroborate bath to 0.5 mm on a copper-coated nylon or polypropylene film (116) (see Insulation, acoustic). Steel plates can be simultaneously electrocoated with lead and poly(tetrafluoroethylene) (117). Solder is plated ia solutioas containing Pb(Bp4)2 and Sn(Bp4)2 thus the lustrous solder-plated object is coated with a Pb—Sn alloy (118). [Pg.168]

The solder and ahoy market, including low melting or fusible ahoys, is a principal user of indium (see SoLDERS AND BRAZING ALLOYS). The addition of indium results in unique properties of solders such as improved corrosion and fatigue resistance, increased hardness, and compatibhity with gold substrates. To fachitate use in various appHcations, indium and its ahoys can be easily fabricated into wine, ribbon, foil, spheres, preforms, solder paste, and powder. [Pg.80]

Lead—silver alloys are used extensively as soft solders these contain 1—6 wt % silver. Lead—silver solders have a narrower free2ing range and higher melting point (304°C) than conventional solders. Solders containing 2.5 wt % silver or less are used either as binary alloys or combined with 0.5—2 wt % tin. Lead—silver solders have excellent corrosion resistance. The composition of lead—silver solders is Hsted in ASTM B32-93 (solder alloys) (7). [Pg.61]

A similar coating, containing 4 wt % tin, is appUed to copper sheet and is used primarily for huilding flashings. Other lead—tin aUoys, usuaUy with 50 wt % tin, ate appUed as coatings to steel and copper electronic components for corrosion protection, appearance, and ease of soldering. Lead—tin aUoys can... [Pg.61]

Copper and tin phosphides are used as deoxidants in the production of the respective metals, to increase the tensile strength and corrosion resistance in phosphor bronze [12767-50-9] and as components of brazing solders (see Solders and brazing alloys). Phosphor bronze is an alloy of copper and 1.25—11 wt % tin. As tin may be completely oxidized in a copper alloy in the form of stannic oxide, 0.03—0.35 wt % phosphoms is added to deoxidize the alloy. Phosphor copper [12643-19-5] is prepared by the addition of phosphoms to molten copper. Phosphor tin [66579-64-4] 2.5—3 wt % P, is made for the deoxidation of bronzes and German silver. [Pg.378]

Various documents relate to the use of formulations containing trietban olamine as flux for a variety of metals (118,119), for solders (120), for soldering pastes (121,122), and for low corrosion solder pastes (123). [Pg.10]

Solders. In spite of the wide use and development of solders for millennia, as of the mid-1990s most principal solders are lead- or tin-based alloys to which a small amount of silver, zinc, antimony, bismuth, and indium or a combination thereof are added. The principal criterion for choosing a certain solder is its melting characteristics, ie, soHdus and Hquidus temperatures and the temperature spread or pasty range between them. Other criteria are mechanical properties such as strength and creep resistance, physical properties such as electrical and thermal conductivity, and corrosion resistance. [Pg.241]

Solders. Modem dental solders are made from mostly corrosion-resistant, nontoxic metals. Minimal quantities of tin and other elements are often added, some of which could produce toxic effects in the unalloyed state. Each solder is used for specific appHcations (180—188) typical compositions and properties of solders used in dentistry are presented in Table 11. Most of the ingredients of solders are resistant to corrosion, and alloying them with other ingredients renders the alloy safe for use in appHances placed in the oral environment. Silver solders corrode, but are used only for temporary appHances. Available products do not contain cadmium, although cadmium was an ingredient of some silver solders up to ca 1980. [Pg.487]

Tin—Nickel. AHoy deposits having 65% fin have been commercially plated siace about 1951 (135). The 65% fin alloy exhibits good resistance to chemical attack, staining, and atmospheric corrosion, especially when plated copper or bron2e undercoats are used. This alloy has a low coefficient of friction. Deposits are solderable, hard (650—710 HV ), act as etch resists, and find use ia pfinted circuit boards, watch parts, and as a substitute for chromium ia some apphcafions. The rose-pink color of 65% fin is attractive. In marine exposure, tin—nickel is about equal to nickel—chromium deposits, but has been found to be superior ia some iadustfial exposure sites. Chromium topcoats iacrease the protection further. Tia-nickel deposits are bfitde and difficult to strip from steel. Temperature of deposits should be kept below 300°C. [Pg.164]


See other pages where Solder corrosion is mentioned: [Pg.306]    [Pg.124]    [Pg.212]    [Pg.212]    [Pg.306]    [Pg.124]    [Pg.212]    [Pg.212]    [Pg.432]    [Pg.891]    [Pg.924]    [Pg.145]    [Pg.281]    [Pg.320]    [Pg.382]    [Pg.384]    [Pg.80]    [Pg.331]    [Pg.129]    [Pg.132]    [Pg.132]    [Pg.139]    [Pg.530]    [Pg.531]    [Pg.241]    [Pg.61]    [Pg.412]    [Pg.217]    [Pg.227]    [Pg.227]    [Pg.232]    [Pg.232]    [Pg.235]    [Pg.481]    [Pg.488]    [Pg.30]    [Pg.125]    [Pg.155]    [Pg.160]   
See also in sourсe #XX -- [ Pg.306 ]

See also in sourсe #XX -- [ Pg.4 , Pg.5 , Pg.45 , Pg.45 ]




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