Silicon dioxide basicity

Oxidation of Silicon. Silicon dioxide [7631-86-9] Si02, is a basic component of IC fabrication. Si02 layers are commonly used as selective masks against the implantation or diffusion of dopants into silicon. Si02 is also used to isolate one device from another. It is a component of MOS devices, and provides electrical isolation of multilevel metalliza tion stmctures (12). A comparison of Si and Si02 properties is shown in Table 1. 

Finally, the strongly basic metal oxides react with silicon dioxide to form a glassy product ... 

Both our original prediction about the effect of ionization energy on acid-base behavior and the trend which we have observed in the first three elements lead us to expect that the hydroxide or oxide of silicon should not be basic, but perhaps should be weakly acidic. This is in fact observed. Silicon dioxide, Si02, can exist as a hydrated solid containing variable amounts of water,... 

Any two samples of a particular mineral, whatever their source or place of origin, have the same basic composition and characteristic crystal structure moreover, no two different minerals have identical chemical composition and crystal structure (see Textboxes 8 and 21). Quartz, for example, is a common and abundant mineral composed of silicon dioxide, a compound that occurs naturally not only as quartz but also in other crystal structures, known as polymorphs (polymorphs are minerals that have the same chemical composition but different crystal structure), some of which, listed in Table 23, have been used for a variety of purposes. The crystal structure, which is essential for the characterization of solid materials, is just one of a wide range of physical properties, that is, properties not involving chemical differences, which provide convenient criteria for characterizing and identifying solids. 

Table 5.1 summarizes the uses of lime. Lime is used as a basic flux in the manufacture of steel. Silicon dioxide is a common impurity in iron ore that cannot be melted unless it combines with another substance first to convert it to a more fluid lava called slag. Silicon dioxide is a Lewis acid and therefore it reacts with the Lewis base lime. The molten silicate slag is less dense than the molten iron and collects at the top of the reactor, where it can be drawn off. Over 100 lb of lime must be used to manufacture a ton of steel. 

The mineral phase. Mineral colloids are composed of layered silicates and amorphous metal hydroxides. The two basic building layers of the silicates are (i) a tetrahedral silicon dioxide layer modified by occasional substitution by Al and (ii) an octahedral A1 oxyhydroxide layer with occasional substitution by Mg2+, or... 

For oxide CMP, the purpose of the solution is two fold. First, water weakens the Si—O bond in a silicon dioxide film and softens the surface as it becomes hydrated with Si—OH bonds [6,7]. Figure 10 shows the reaction mechanism. Second, the solution is to provide a basic environment (pH > 10), which accelerates the hydration rate. An environment with high pH values will allow the polishing-induced reaction to be further accelerated because the surface Si(OH) species will be partially dissolved into water. In the meantime, the zeta potential of silica increases with increasing pH values. At high zeta potentials silica particles will repel each other, whereby a better-suspended slurry is formed. 

Quartz is the most common mineral in the Earth s crust. It occurs in a wide variety of forms, colors, and lusters, but other properties are generally consistent for all specimens. All quartz has the same basic chemical formula, silicon dioxide (SiC ). It has a hardness of 7, and a distinctive conchoidal fracture. The color and translucency of quartz can be affected by a disruption of the molecular structure, as in smoky quartz, or by the inclusions of tiny amounts of other elements or minerals. In some classifications, quartz is listed with the oxides, but it is most often placed with the silicates. 

The state and capabilities of quantum chemical modeling of silicon dioxide framework structures (silica, aluminosilicates, zeolites) are discussed by Zhido-mirov and Kazansky. Here are basic theoretical approaches to a class of catalytic compositions which contribute the probably most massive quantities of catalysts used by man s (petroleum and chemical) industries. 

The pH of a slurry has a profound influence on its colloidal stability and CMP performance. Strong correlations have been established between the particle isoelectric point (lEP) and the optimal pH for slurry stability. The general rule is that the slurry is more stable at a pH that is away from the lEP, so the zeta potential of the particles is greater than 20 mV. The focus of this section is on the influence of pH on the slurry performances such as material removal rate and defectivity. In order to examine the impact of slurry pH on these two important performance features, we first take a closer look at the interaction between abrasive particles and the surface to be polished. There is a vast amount of literature on the interaction between abrasive particles and silicon dioxide surface [26]. The discussion below will focus on the interaction between ceria abrasive particles and the silicon dioxide surface to be polished. The basic principles and conclusions can be easily extended to other pairs of abrasive particles and surfaces. 

Even before alchemy became a subject of study, many chemical reactions were used and the products applied to daily life. For example, the first metals used were probably gold and copper, which can be found in the metallic state. Copper can also be readily formed by the reduction of malachite—basic copper carbonate, Cu2(C03)(0H)2—in charcoal fires. Silver, tin, antimony, and lead were also known as early as 3000 BC. Iron appeared in classical Greece and in other areas around the Mediterranean Sea by 1500 BC. At about the same time, colored glasses and ceramic glazes, largely composed of silicon dioxide (Si02, the major component of sand) and other metallic oxides, which had been melted and allowed to cool to amorphous solids, were introduced. 

Although the surface of most IC chips has been passivated with a layer of inorganic dielectric material such as silicon dioxide or silicon nitride (polyimides have also been used as final passivating layers), the protection provided by such layers is not sufficient to ensure reliable operation throughout the lifetime of the device. The three basic methods of protection are... 

Quite recently attention was paid to the role of oxides, either as electro-active species, as impurities or as additives in the electro-deposition of transition metals. This may be demonstrated, e.g. in the case of electro-deposition of molybdenum, where the electrolysis of neither pure K2M0O4, nor the KF-K2M0O4 mixture yields a molybdenum deposit. However, introducing small amounts of boron oxide, or silicon dioxide to the basic melts, smooth and adherent molybdenum deposits may be obtained. Also, in the case of niobium and tantalum deposition, the presence of oxygen either from the moisture or added on purpose leads to the formation of oxohalo-complexes, which due to their lowered symmetry and thus lower energetic state, decompose easier at the cathode yielding pure metal. 

As with metals, semiconductors are also subject to passivation. Figure 22.9 shows the anodic dissolution and the passivation of n-type and p-type silicon electrodes in sodium hydroxide solution [13]. Silicon dissolves in basic solution in the form of soluble divalent silicon, Si(OH),iq or Si(OH)2jaq, and passivates forming a silicon dioxide film. 

The anodic passivation of semiconductors in aqueous solution occurs in much the same way as that of metals and produces a passive oxide film on the semiconductor electrodes. Figure 22.25 shows the anodic dissolution current and the thickness of the passive film as a function of electrode potential for p-type and n-type silicon electrodes in basic sodium hydroxide solution [32,33], As mentioned earlier, silicon dissolves in the active state as divalent silicon ions and in the passive state a film of quadravalent insoluble silicon dioxide is formed on the silicon electrode. The passive film is in the order of 0.2-1.0 nm thick with an electric field of 106 107 V cm 1 in the film within the potential range where water is stable. 

The ore contains aluminium oxide (amphoteric) with large impurities of iron oxide (basic) and silicon dioxide (weakly acidic). The ore is treated with a hot 10% solution of sodium hydroxide, which reacts with the amphoteric aluminium oxide to form a solution of sodium aluminate. Iron oxide does not react as it is a base, and silicon dioxide does not... 

Finally, new polymorphic structures can arise from different ways of assembling closely related coordination polyhedra. Three possibilities are known that lead to polymorphism of this type, which are most commonly found in oxidic lattices. First, the coordination polyhedron of one lattice particle is the same, while that of the other is only slightly changed (e g., silicon dioxide). Second, the coordination polyhedron of one lattice particle is the same, and that of the other is considerably changed (e.g., titanium dioxide). Finally, the coordination polyhedra are both deformed to varying degrees, with the basic lattice type being the same but the type of distortion different (e.g., zirconium dioxide). 

Several techniques can be used for masking the ions so as to define the area to be implanted. Usually for microelectronics a contact mask is required. Typical masks are silicon dioxide (Si02), silicon nitride (Si3N4), photoresist, or metal films. The basic requirements for a mask include ... 

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