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Transistor semiconductors

Figure C2.16.9. Schematic cross-section and biasing of a metai-oxide-semiconductor transistor. A unifonn conducting channei is induced between source (S) and drain (D) for > V. Voitage is appiied between the gate (G) and the source. Part (A) shows the channei for - V the transistor acts as a triode. The source-... Figure C2.16.9. Schematic cross-section and biasing of a metai-oxide-semiconductor transistor. A unifonn conducting channei is induced between source (S) and drain (D) for > V. Voitage is appiied between the gate (G) and the source. Part (A) shows the channei for - V the transistor acts as a triode. The source-...
D. Landheer, G. Aers, W.R. Mckinnon, M.J. Deen, and J.C. Ranuarez, Model for the field effect from layers of biological macromolecules on the gates of metal-oxide-semiconductor transistors. J. Appl. Phys. 98, 044701-1-15 (2005). [Pg.234]

The rapid developments in the microelectronics industry over the last three decades have motivated extensive studies in thin-film semiconductor materials and their implementation in electronic and optoelectronic devices. Semiconductor devices are made by depositing thin single-crystal layers of semiconductor material on the surface of single-crystal substrates. For instance, a common method of manufacturing an MOS (metal-oxide semiconductor) transistor involves the steps of forming a silicon nitride film on a central portion of a P-type silicon substrate. When the film and substrate lattice parameters differ by more than a trivial amount (1 to 2%), the mismatch can be accommodated by elastic strain in the layer as it grows. This is the basis of strained layer heteroepitaxy. [Pg.317]

Schorner, R., et al., Enhanced Channel Mobility of 4H-SiC Metal-Oxide-Semiconductor Transistors Fabricated with Standard Polycrystalline Silicon Technology and Gate-Oxide Nitridation, Applied Physics Letters, Vol. 80, No. 22, June 3, 2002, p. 176. [Pg.174]

Semiconductor (transistor) biosensors are widely used. They possess a several process advantages over the others small size, good reproducibility and high sensitivity, multipurpose chip design, accessibility and low price. [Pg.291]

Standard metal-oxide-semiconductor transistors which have ideal structure for dielectric breakdown studies were employed in our experiments (Fig. 1). [Pg.314]

Khanna, V.K. (2004) Emerging Trends in Ultra-miniaturized CMOS (Complementary Metal-Oxide-Semiconductor) Transistors, Single-Electron and Molecular-Scale Devices ... [Pg.325]

A bipolar transistor may be used as a switch (either fully on with maximum current, or fully off with no current) and as an amplifier (always partly on). Bipolar transistors are the quickest devices. However the current flow through the base creates heat. This disadvantage makes bipolar transistors less popular than other devices such as metal oxide semiconductor transistor. [Pg.110]

Different types of SiC Field Effect Transistors, Metal Oxide Semiconductor Transistors (MOSFETs), Metal Semiconductor Field Effect Transistors (MESFETs), and Junction Field Effect Transistors (JFETs) compete for future applications in high temperature and harsh environment electronics. This Datareview details these various types of FETs, the structures used and the performances obtained. Interesting recent developments and potential applications, such as FET integrated circuits, a hybrid operational amplifier and an inverter circuit are also outlined. [Pg.247]

Figure C2.16.9. Schematic cross-section and biasing of a metal-oxide-semiconductor transistor. A uniform... Figure C2.16.9. Schematic cross-section and biasing of a metal-oxide-semiconductor transistor. A uniform...
Chemical and physical processing techniques for ferroelectric thin films have undergone explosive advancement in the past few years (see Ref. 1, for example). The use of PZT (PbZri- cTi c03) family ferroelectrics in the nonvolatile and dynamic random access memory applications present potentially large markets [2]. Other thin-film devices based on a wide variety of ferroelectrics have also been explored. These include multilayer thin-film capacitors [3], piezoelectric or electroacoustic transducer and piezoelectric actuators [4-6], piezoelectric ultrasonic micromotors [7], high-frequency surface acoustic devices [8,9], pyroelectric intrared (IR) detectors [10-12], ferroelectric/photoconduc-tive displays [13], electrooptic waveguide devices or optical modulators [14], and ferroelectric gate and metal/insulator/semiconductor transistor (MIST) devices [15,16]. [Pg.481]

In last century the knowledge of defects in a solid, especially an oxide, has been explored comprehensively. The contribution of Schottky and Wagner successfully put the problem on a quantitative basis and promote the discovery of semiconductor transistor. The idea of non-stoichiometry was developed by Berthollet more than a hundred years ago and the controversy between berthollides, which do not obey the Dalton s law, and daltonides, which follow Dalton s law of constant and multiple proportions based originally upon the study of simple ionic and molecular species, encouraged the scientific debates on how existence of point defect in a compound is is it random statistic distribution or the structure related The experimental data are the best way to explore the truth. Indirect and direct observations of atom... [Pg.3]

Epitaxial Enhancement. Epitaxial enhancement is used to deposit a layer of ultrapure silicon on the surface of the wafer. This provides a layer with different properties from those of the underlying wafer material, an essential feature for the proper functioning of the MOS (metal-oxide-semiconductor) transistors that are used in modern chips. In this process, polished wafers are placed into a programmable oven and spun in an atmosphere of trichlo-rosilane gas. Decomposition of the trichlorosilane... [Pg.619]

Semiconductor transistors were invented in 1947 and integrated circuits in 1970, and the complexity of electronic components has increased by about 40 percent each year. [Pg.622]

Digital electronics got its start in 1906, when American inventor Lee de Forest constructed the triode vacuum tube. Large, slow, and power-hungry as they were, vacuum tubes were nevertheless used to construct the first analogfue and digital electronic computers. In 1947, American physicist William Shockley and colles ues constructed the first semiconductor transistor junction, which quickly developed into more advanced silicon-germanium junction transistors. [Pg.1057]

The available methods of production of integrated circuits have essentially reached the physical limit of their capabilities to construct viable semiconductor transistors. Atomic force microscopy is being used to investigate the construction of transistor-like structures based on quantum dots rather than on semiconductor junctions. [Pg.1643]


See other pages where Transistor semiconductors is mentioned: [Pg.2892]    [Pg.112]    [Pg.343]    [Pg.410]    [Pg.738]    [Pg.307]    [Pg.343]    [Pg.274]    [Pg.666]    [Pg.5]    [Pg.247]    [Pg.14]    [Pg.2892]    [Pg.216]    [Pg.5]    [Pg.306]    [Pg.242]    [Pg.765]    [Pg.785]    [Pg.1058]    [Pg.1852]    [Pg.1855]   
See also in sourсe #XX -- [ Pg.182 ]




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