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Semiconductors chemisorption bond

In these experiments, too, it is possible, therefore, to interpret the decrease in the activation energy in the light as due to excitation and loosening of the bond between noble metal and oxygen at the surface. The chemisorption bond between the oxygen atom and the noble metal atom may be described by a resonance similar to the resonance of the semiconductor bond. The bond is excited and weakened by photon absorption. The oxygen transition from the excited chemisorption bond to the CO molecule requires less energy than in the dark. [Pg.149]

When desorption takes place from a metal surface, many hot charge carriers are generated in the substrate by laser irradiation and are extended over the substrate. Then, the desorption occurs through substrate-mediated excitation. In the case of semiconductor surfaces, the excitation occurs in the substrate because of the narrow band gap. However, the desorption is caused by a local excitation, since the chemisorption bond is made of a localized electron of a substrate surface atom. When the substrate is an oxide, on the other hand, little or no substrate electronic-excitation occurs due to the wide band gap and the excitation relevant to the desorption is local. Thus, the desorption mechanism for adsorbed molecules is quite different at metal and oxide surfaces. Furthermore, the multi-dimensional potential energy surface (PES) of the electronic excited state in the adsorbed system has been obtained theoretically on oxide surfaces [19, 20] due to a localized system, but has scarcely been calculated on metal surfaces [21, 22] because of the delocalized and extended nature of the system. We describe desorption processes undergoing a single excitation for NO and CO desorption from both metal and oxide surfaces. [Pg.292]

The original version of the model assumes a semiconductor adsorbent with no intrinsic surface states, so that before adsorption occurs the bands are flat to the surface. Wolkenstein [6] even refers to weak and strong chemisorption with the former an adsorbed molecule is bound only by covalent forces, whilst, with the latter, charge exchange with the semiconductor takes place. The important point is that the model does not stipulate that the chemisorption bond must be completely ionic. [Pg.182]

The methods used to calculate surface states need not concern us here in any detail, but it will be instructive to give a brief indication of the two approaches currently employed (self-consistent calculations of the electronic energy and surface potential and realistic tight binding models), since this will provide some insight into semiconductor surface bonds and hence into chemisorption. [Pg.198]

On -type semiconductors, H2 and CO almost totally cover the surface, whereas chemisorption on />-type semiconductors is less extensive. In this strong chemisorption a free electron or positive hole from the lattice is involved in the chemisorptive bonding. This changes the electrical charge of the adsorption center, which can then transfer its charge to the adsorbed molecule. [Pg.160]

As early as in 1937, Nyrop (17) suggested that electron transfer may occur during chemisorption. Dowden (18) clarified the situation by classifying the possible reactions with respect to the type of bond (ionic, covalent, or mixed) and the type of adsorbent (metal, semiconductor, or insulator). He attempted to indicate some probable criteria to be used in the choice of the best adsorbent for use with a given adsorbate. [Pg.264]

Chemisorption is the process by which various ions are adsorbed on the semiconductor surface with the formation of a chemical bond and can affect a number of important cell parameters. [Pg.79]

Keywords Chemisorption surface structure cycloaddition silicon dimer semiconductor functionalization 7r bonding free-radical reactions. [Pg.333]

Mui et al.36 report a comparative experimental - theoretical study of amines on both the Si(001)-(2x 1) and the Ge(001)-(2x 1) surface. Both substrates were modeled by X9H12 (X = Si, Ge) clusters, utilizing DFT at the BLYP/6-31G(d) level of theory. For both, the Si and the Ge substrate, formation of a X-N dative bond (X = Si, Ge) is the initial step of the reaction between the considered amine species and the semiconductor surface. Flowever, while primary and secondary amines display N-H dissociation when attached to Si(001)-(2 x 1), no such trend is observed for the Ge counterpart of this system. This deviating behavior may be understood in terms of the energy barrier that separates the physisorption from the chemisorption minimum, involving the cleavage of an H atom. For dimethylamine adsorption, this quantity turned out to be about 50% higher for the Ge than for the Si surface. The authors relate this characteristic difference between the two substrates to the different proton affinities of Si and Ge. [Pg.512]

Thus chemisorption of oxygen on simple semiconductors and spinels involves changes in heats of adsorption and, consequently, in energies of oxygen-solid surface bonds. [Pg.442]

Physical adsorption is one of the important ways for the precise characterization of the surface structure of the catalyst. In the chemisorption, the interactive force between adsorption molecule and the solid surface is of the chemical affinity, which makes the chemical bond form between the adsorbed molecule and the solid surface. In general, they form covalent bond or coordinated bond containing enough parts of ion-bond on the metal surface, and obviously ionic bond on the surface of semiconductor oxide as well as some compounds, so chemisorption has significant selectivity. By the use of the selectivity of chemisorption, the surface area of metal components and the munber of active sites in the multi-component catalyst and supported catalyst can be measured. Thus a lot of useful information can be achieved. [Pg.578]

Fig. 2.4 N, O, and F chemisorption modified valence DOS for a metal and a semiconductor with four excessive DOS features bonding lone pairs (< p), electron holes (< p), and dipoles... Fig. 2.4 N, O, and F chemisorption modified valence DOS for a metal and a semiconductor with four excessive DOS features bonding lone pairs (< p), electron holes (< p), and dipoles...

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See also in sourсe #XX -- [ Pg.717 ]




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