Radiation adhesives

Sealants durability resistance to heat cold water, ozone and ultraviolet radiation adhesion to a variety of substrates high recovery colour stability glazing sealants construction sealants (neutral cure systems) sanitary sealants... 

Because the entitlement experiment has not yet yielded any adhesion failures at the point of this analysis (roughly 10 years of exposure), it is not possible to directly compare the GMOD adhesion results to those of the entitlement experiment at this time. However, a review of the GMOD adhesion data in Fig. 7.4 shows that with exposure to radiation, adhesion failures are seen in both clear and black samples well before 10 years of exposure. The indications are that the entitlement conditions have extended the times to fail for adhesion. This observation is as would be expected, since adhesion failures are known to derive largely from radiative damage at the primer and polycarbonate interface. 

Higher alkyl acrylates and alkyl-functional esters are important in copolymer products, in conventional emulsion appHcations for coatings and adhesives, and as reactants in radiation-cured coatings and inks. In general, they are produced in direct or transesterification batch processes (17,101,102) because of their relatively low volume. 

Protein-Based Adhesives. Proteia-based adhesives are aormaHy used as stmctural adhesives they are all polyamino acids that are derived from blood, fish skin, caseia [9000-71 -9] soybeans, or animal hides, bones, and connective tissue (coUagen). Setting or cross-linking methods typically used are iasolubilization by means of hydrated lime and denaturation. Denaturation methods require energy which can come from heat, pressure, or radiation, as well as chemical denaturants such as carbon disulfide [75-15-0] or thiourea [62-56-6]. Complexiag salts such as those based upon cobalt, copper, or chromium have also been used. Formaldehyde and formaldehyde donors such as h exam ethyl en etetra am in e can be used to form cross-links. Removal of water from a proteia will also often denature the material. 

Thermal imaging is sensitive to iafrared radiation that detects temperature changes over the surface of a part when heat has been appHed. Thermal diffusion ia a soHd is affected by variatioa ia composition or by the preseace of cracks, voids, delamiaatioas, etc the effects are detected by surface temperature changes. Defects cannot be detected if their depth below the surface is more than two to three times their diameter. Nondestmctive testing has been primarily used for composites and analysis of adhesive bonds or welds. Several studies are documented ia the Hterature (322—327). 

The anodized surface is often subjected to additional treatment before the radiation-sensitive coating is appHed. The use of aqueous sodium siUcate is well known and is claimed to improve the adhesion of diazo-based compositions ia particular (62), to reduce aluminum metal-catalyzed degradation of the coating, and to assist ia release after exposure and on development. Poly(viQyl phosphonic acid) (63) and copolymers (64) are also used. SiUcate is normally employed for negative-workiag coatings but rarely for positive ones. The latter are reported (65) to benefit from the use of potassium flu o r o zirc onate. 

Fig. 10. Generalized formulation design outline for radiation-curable coatings and adhesive systems. The cross-linker is a multifimctional unsaturated cross-linking agent or oligomer, rj = viscosity CR = cure rate S = shrinl ge H = hardness F = flexibility A = adhesion 7 = surface energy ...

Leadley and Watts used monochromaticized A1K radiation to investigate the interactions that were responsible for adhesion between polymers and substrates [24]. When polymethylmethacrylate (PMMA) was adsorbed onto silicon substrates, the C(ls) spectrum shown in Fig. 21a was obtained. Originally, it was... 

The vast majority of reactive hot melts are moisture-curing urethane adhesives. Radiation (UV/EB) curable adhesives have been explored in the laboratory since the mid-1970s, but are only recently beginning to gain significant market penetration, particularly for PSA applications. The formulation and properties of these two classes of adhesives are discussed below. 

While the chemistry of radiation curable hot melt adhesives is the same as that used in liquid (syrup) adhesives and coatings discussed elsewhere in this volume, there is a fundamental difference between the objectives of reaction in the two types of systems. Syrups consist largely or entirely of reactive monomeric and/or oligomeric materials. Radiation is used to initiate the polymerization of virtually the entire mass. In contrast, hot melts generally contain polymers initially, and these polymers are capable of reaction via radiation to produce chain extension and... 

One key consideration in developing radiation curable adhesive systems is the thermal stability and volatility of any photoinitiators used. These chemicals are designed for liquid systems where these issues do not arise. Few of the commercial photoinitiators have adequate thermal stability at the highest hot melt temperatures (180-200°C) and many are too volatile. Reduced application temperatures and special antioxidant packages are often required. 

Table 3 lists the selected properties [16] that we have measured for several commercially available acrylate resins manufactured by the Sartomer Company and the Rohm and Haas Company. The resins were cured in an AECL Gammacell Model 240. The temperature rise was measured for an 8-g sample using Acsion s (formerly AECL Radiation Applications Branch) Gamma Calorimetry method [17]. All of this information is being used to evaluate the applicability of EB-cured acrylate adhesives for repairing composite structures. Combinations of these adhesives can be used to create electron-curable adhesives suitable for composite repair. 

Campbell, F.J. and Brenner, W., Curing high performance structural adhesives by electron-beam radiation. Nav. Eng. J., June, p. 160 (1982). 

Huber, H.F., Radiation cured adhesives. Beta-Gamma, 1, 3 (1992). 

Woods, J.G., Radiation-curable adhesives. In Pappas, S.P. (Ed.), Radiation Curing, Science and Technology. Plenum Press, New York, 1992. 

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