Properties encapsulants

Dendrimers represent a class of materials which combine unique features (well-defined macromole-cular structure, monodispersity, low viscosity) with remarkable properties (encapsulation, catalysis. 

Electrical. Glasses are used in the electrical and electronic industries as insulators, lamp envelopes, cathode ray tubes, and encapsulators and protectors for microcircuit components, etc. Besides their abiUty to seal to metals and other glasses and to hold a vacuum and resist chemical attack, their electrical properties can be tailored to meet a wide range of needs. Generally, a glass has a high electrical resistivity, a high resistance to dielectric breakdown, and a low power factor and dielectric loss. 

Figure 4c also describes the spontaneous polymerisation ofpara- s.yX en.e diradicals on the surface of soHd particles dispersed in a gas phase that contains this reactive monomer (16) (see XylylenePOLYMERS). The poly -xylylene) polymer produced forms a continuous capsule sheU that is highly impermeable to transport of many penetrants including water. This is an expensive encapsulation process, but it has produced capsules with impressive barrier properties. This process is a Type B encapsulation process, but is included here for the sake of completeness. 

Copper wines are used primarily because of thein economy and resistance to sweep, ie, tendency of the wine to move in a plane perpendicular to its length, during plastic encapsulation (11—16). Because copper is harder than gold, more attention is needed during the bonding operation to prevent the chip from cratering. Table 6 fists the various properties for wine materials. 

Silicon—Ca.rbon Thermoset. The Sycar resins of Hercules are sihcon—carbon thermosets cured through the hydrosilation of sihcon hydride and sihcon vinyl groups with a trace amount of platinum catalyst. The material is a fast-cure system (<15 min at 180°C) and shows low moisture absorption that outperforms conventional thermosets such as polyimides and epoxies. Furthermore, the Sycar material provides excellent mechanical and physical properties used in printed wiring board (PWB) laminates and encapsulants such as flow coatable or glob-top coating of chip-on-board type apphcations. 

The abiHty of a given material to perform as an electronic embedding encapsulant depends largely on its properties. Ultrapure chemical properties with a low level of mobile ions such as sodium, potassium, and chloride are essential. Furthermore, the material s electrical, mechanical, and rheological properties are critical. 

Electrical Properties. Electrical properties are important for the corrosion protection of chip-on-board (COB) encapsulated devices. Accelerated temperature, humidity, and bias (THB) are usually used to test the embedding materials. Conventional accelerating testing is done at 85°C, 85% relative humidity, and d-c bias voltage. Triple-track test devices with tantalum nitride (Ta2N), titanium—palladium—gold (Ti—Pd—Au) metallizations with 76... 

Mechanical Properties. Most of electronic IC devices are very fragile. They need strong mechanical protection from the encapsulant to retain their long-term reUabiUty. Encapsulant must provide mechanical protection but still maintain good temperature-cycle and thermal-shock testing, which are part of the routine reUabiUty testing of the embedding electronics. 

The thermal stabiUty of epoxy phenol—novolak resins is useful in adhesives, stmctural and electrical laminates, coatings, castings, and encapsulations for elevated temperature service (Table 3). Filament-wound pipe and storage tanks, liners for pumps and other chemical process equipment, and corrosion-resistant coatings are typical appHcations using the chemically resistant properties of epoxy novolak resins. 

The polysulphides are frequently used in casting mixes and to a less extent in coating, laminating and adhesive applications. Their value in casting and encapsulation lies mainly with their low curing shrinkage and flexibility in the cured state. Their tendency to corrode copper and the somewhat inferior electric insulation properties of the blends does lead to certain limitations. 

---