Plasma-etched surface

Some of the modern surface analysis methods have been used to study the surface chemistry of both plasma etched surfaces and plasma polymerized thin films. Much of this work has involved exposure of these surfaces to air as the samples are transferred from the plasma system to the surface analysis system. However, in a few cases surface analysis has been performed in the plasma system after the plasma gas has been pumped away. This work will be discussed in more detail later in this chapter. 

SEM of plasma-etched surfaces of PP/MMT/PPy = 95.2/4.8/13.2 (by wt.) composite films (bar size = 10 pm). (A) prepared in water/methanol and processed by direct compression molding (B) prepared in water/methanol and processed by compression molding of melt-mixed samples (C) prepared in water/DBSA and processed by direct compression molding and (D) prepared in water/DBSA and processed by compression molding of melt-mixed samples. (From M. Mravc cova, M. Omastova, P. Potschke, A. Pozsgay, B. Pukanszky, and J. Pionteck, Polym. Adv. Technol. 17, 715-726,2006. With permission.)... 

Figure 11.17 Scanning electron microscopy Image of a polished and plasma-etched surface of a textured silicon nitride sample with rodlike 3-Si3N4 grains aligned by a...

The areal capacitances of the pore walls (CdP ), falling in the range 120 to 230 mF cm 2, were on the same order as that of the 1-min direct-etched diamond surface (see Table 19.1). This capacitance enhancement for the plasma-etched surfaces is due to contributions from oxygen-containing functional groups and... 

Coburn J W and Winters H F 1979 Ion- and electron-assisted gas-surface chemistry—an important effect in plasma etching J. Appl. Phys. 50 3189-96... 

The distribution of impurities over a flat sihcon surface can be measured by autoradiography or by scanning the surface using any of the methods appropriate for trace impurity detection (see Trace and residue analysis). Depth measurements can be made by combining any of the above measurements with the repeated removal of thin layers of sihcon, either by wet etching, plasma etching, or sputtering. Care must be taken, however, to ensure that the material removal method does not contaminate the sihcon surface. 

Surface treatment of the composite can have a significant effect on adhesion. Surface treatment enhances one or more of the mechanisms described previously. Wu et al. [15] studied the effects of surface treatment on adhesive bonding for AS-4/APC-2 laminates. They found that the greatest bond strength was achieved from acid etching and plasma etching the composite surface. Table 1 summarizes the various surface treatments that were evaluated. 

A porous surface structure (100 cm ) in the reaction charmel can be generated by an SFg plasma etch process with sibcon nitride masking [12],... 

GL 16] [R 12] [P 15] By a plasma etch process (see description in ]R 12]), a highly porous surface stmcture can be realized which can be catalyst coated [12]. The resulting surface area of 100 m is not far from the porosity provided by the catalyst particles employed otherwise as a fixed bed. In one study, a reactor with such a waU-porous catalyst was compared with another reactor having the catalyst particles as a fixed bed. The number of channels for both reactors was not equal, which has to be considered in the following comparison. 

Oxygen pipelines, 47 754 Oxygen plasma etching, of lotus effect surfaces, 22 117, 119 Oxygen pressure, in oxidation reactions, 49 82... 

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