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Plasma cleaning gases

M. D. Smith, Effect of Various Gas Mixtures on Plasma Cleaned Ceramics, AUiedSignal Inc., Kansas City, Mo., Mar. 1979, p. BDX-613-2107. [Pg.119]

Silicon wafers were oxygen plasma-cleaned in a parallel plate reactor at 400 W power, 300 mTorr pressure for 5 min. The gas flow was set to 100 seem total,... [Pg.401]

Chlorine trifluoride is a promising gas not only as the new cleaning gas but also as the replacement gas for global warming. On the other hand, Ibottoson et al. reported on plasma-less etching of single crystal silicon and some tantalum compounds with chlorine trifluoride [118,119]. The purpose of their studies was to apply chlorine... [Pg.655]

Fig. 11-73 shows a comparison between electron-beam, pulsed corona, and DBD processing of 100 ppm CCI4 in dry air at 25°C (Penetrante et al., 1996a,b). The major products of plasma processing of CCU in air are CU, COCU, and HCl. These products can be easily removed from the gas stream they dissolve and/or dissociate in aqueous solutions and combine with NaHCOs in a scrubber solution to form NaCl. Similar approaches can be applied as performed for product removal from air streams during the plasma cleaning of other diluted chlorine-containing VOC exhausts. [Pg.841]

Unlike solvent and aqueous-based cleaning, plasma cleaning is based on reactions with surface contaminants at the molecular or atomic level. Two mechanisms are possible depending on the level of RF energy and the nature of the plasma gas. [Pg.166]

W. E. Hansen and M. Hozbor, Gas plasma cleaning for electrical product manufacture. International Coil Winding Association Conference, Boston, MA, 1991. [Pg.208]

Surface treatments recommended specifically for PBT include abrasion and solvent cleaning with toluene. A medium-strength bond can be obtained with polyethylene terephthalate plastics and films by abrasion and solvent cleaning. Gas plasma surface treatments and chemical etch have been used where maximum strength is necessary. Solvent cleaning of PET surfaces is recommended. [Pg.469]


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