PAI poly amide imide

ACS name 5-isobenzofurancarboxylic acid, 1,3-dihydro-1,3-dioxo-, polymer with 1,3-benzenediamine and 4,4 -oxybis(benzenamine] (Torlon)  

The most relevant sources of additional data Torlon, Polyamide-imide, Design guide, Solvay Advanced Polymers, 2003, T-50246 

Details - PAI resin obtained from trimellitic anhydride and diamines  

Formulation example the above set of monomers Is used in the production of Torlon 4000 Robertson, G P Guiver, M D Yoshikawa, M Brownstein, S, Polymer, 45,1111-17, 2004 

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PAI Poly(amide imide) TPU Thermoplastic polyurethane elastomer... 

MC MDI MEKP MF MMA MPEG MPF NBR NDI NR OPET OPP OSA PA PAEK PAI PAN PB PBAN PBI PBN PBS PBT PC PCD PCT PCTFE PE PEC PEG PEI PEK PEN PES PET PF PFA PI PIBI PMDI PMMA PMP PO PP PPA PPC PPO PPS PPSU Methyl cellulose Methylene diphenylene diisocyanate Methyl ethyl ketone peroxide Melamine formaldehyde Methyl methacrylate Polyethylene glycol monomethyl ether Melamine-phenol-formaldehyde Nitrile butyl rubber Naphthalene diisocyanate Natural rubber Oriented polyethylene terephthalate Oriented polypropylene Olefin-modified styrene-acrylonitrile Polyamide Poly(aryl ether-ketone) Poly(amide-imide) Polyacrylonitrile Polybutylene Poly(butadiene-acrylonitrile) Polybenzimidazole Polybutylene naphthalate Poly(butadiene-styrene) Poly(butylene terephthalate) Polycarbonate Polycarbodiimide Poly(cyclohexylene-dimethylene terephthalate) Polychlorotrifluoroethylene Polyethylene Chlorinated polyethylene Poly(ethylene glycol) Poly(ether-imide) Poly(ether-ketone) Polyethylene naphthalate Polyether sulfone Polyethylene terephthalate Phenol-formaldehyde copolymer Perfluoroalkoxy resin Polyimide Poly(isobutylene), Butyl rubber Polymeric methylene diphenylene diisocyanate Poly(methyl methacrylate) Poly(methylpentene) Polyolefins Polypropylene Polyphthalamide Chlorinated polypropylene Poly(phenylene oxide) Poly(phenylene sulfide) Poly(phenylene sulfone)... 

Nylon 12 (PA12) Poly(Phthalamide) (PPA) Poly(Amide Imide) (PAI)... 

Additional polymer blends comprising PAEK s offering property combinations of potential utility include PSF [Robeson and Harris, 1986 Harris and Robeson, 1989] structurally different poly(aryl ketones) [Harris and Robeson, 1986], PAr [Robeson and Harris, 1992], poly(amide-imide) PAI [Harris and Gavula, 1992], PPS [Robeson, 1987], and other PI [Harris et al., 1992]. Mixtures of structurally different PAEK s were noted to be isomorphic within specific limits of ether/ketone ratios [Harris and Robeson, 1987]. Blends of polybenzimidazole, PBI and several commercial PI (Ultem 1000 and Matrimid 5218) have been studied in depth at the University of Massachusetts and found to be miscible. FTIR studies [Guerra et al., 1988 Kim et al., 1993], NMR studies [Grobelny et al., 1990], thermal, dielectric, and mechanical... 

Poly(amide imide)s (PAI)s have been used in the late 1960s as wire coating materials.Soon afterwards this class of polymers were considered for aerospace applications." Varieties with urethane units and ester units have been discussed. Now various grades, suitable for extrusion and injection molding are available. Thermosetting types are also on the market. PAIs are in between poly(amide)s (PA)s and poly(imide) (PI) in their properties. 

C. Zhao, Z. Wang, D. Bi, H. Lin, K. Shao, T. Fu, S. Zhong, and H. Na Blend membranes based on disulfonated poly(aryl ether ether ketone)s (SPEEK) and poly(amide imide) (PAI) for direct methanol fuel cell usages. Polymer, 48(11) 3090-3097, May 2007. 

Aromatic poly(amide-imide) (PAI) has an outstanding resistance not only to the thermal operations but also mechanical, electrical, and chemical operations. Although the properties of PAI are inferior to those of aromatic polyimide (PI), which is one of the most heat-resistant polymers, PAI has been widely utilized as a high performance heat resistant polymer as well as PI, because PAI is superior to PI in its workability in industry. ... 

PAIs modified with a siloxane linkage have been synthesized under microwave radiation in ionic liquids by the isocyanate method [39]. 4,4 -Methylene-bis(4-phenylisocyanate) was used. The poly(amide-imide-siloxane)s were obtained in high yields and good inherent viscosities. The high softening temperatures and poor solubility of PAIs in organic solvents can be improved via the incorporation of the flexible siloxane segments into the polymer backbone. 

Poly(amide imide), PAI Poly(ether imide), PEI Polyimide, PI Poly(ether ether ketone), PEEK... 

Poly (amide imide), PAI. Applications constructional parts, wheels, rotors, bearings, housings, slip fittings, lacquers. 

The carbon-based microstructure created on the surface results in a change in the conductivity of 10 to 14 orders of magnitude after implantation. The surface resistivity as a function of beam dose in 50 keV He, B, C, N, and As implanted polyethersulfone (PES) films is shown in Fig. 3 [13]. This behavior is similar to that of 50 keV As and Xe implanted poly-amide-imide (PAI) films, which have a high glass point temperature [6], and in foct is typical of all implanted polymers. For example, a 2 MeV Ar implanted polyvinyl chloride (PVC) film was enhanced 14 orders of magnitude in conductivity and showed similar behavior as a function of beam dose [14]. 

Figure 3.14(a) shows the reaction gas chromatogram obtained from poly(amide-imide) PAI-2. Only one diamine was produced. The chromatogram in Figure 3.14(b) obtained from the fusion reaction of the polyamide terpolymer PI-3, contains peaks for each diamine. The quantitative analysis of both products revealed that the weight ratio of 2,4 toluene diamine to 4,4 -methylenedianiline in the polymer was 2 1. 

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