Nanostructures microelectronics

Das G, Mecarini F, Deangelis F, Prasciolu M, Liberale C, Patrini M, Difabrizio E (2008) Attomole (amol) myoglobin Raman detection from plasmonic nanostructures. Microelectron Eng 85 1282-1285... 

Interesting and useful areas of research are possible when only minute amounts of material are available (sub)milligram-scale synthesis, fractions, explosives, nanostructures, microelectronics, additives, contaminants, multilayers, coatings, thin films, skin-core problems in the case of chemicals, materials, products, but also in challenging areas like e.g. forensic studies. 

Marty E, Rousseau L, Saadany B, Mercier B, Frangais O, Mita Y, Bourouina T (2005) Advanced etching of silicon based on deep reactive ion etching for silicon high aspect ratio microstructures and three-dimensional micro- and nanostructures. Microelectron J 36 673-677... 

Molecular Self-Assembly. Reductive techniques, such as those used in the microelectronics industry, can produce structural features smaller than about 200 nm. The use of proximal probes and other nanomanipulative techniques can be considered to be a hybrid of the reductive lithographic techniques and die synthetic strategies of assembling functional nanostructures atom by atom, or molecule by molecule. The organization of nanostructures and devices by the self-assembly of the component atoms and molecules, a ubiquitous phenomenon in biological systems, forms die noncovalent synthetic approach to nanotechnology. 

Microfabrication is increasingly central to modern science and technology. Many opportunities in technology derive from the ability to fabricate new types of microstructures or to reconstitute existing structures in down-sized versions. The most obvious examples are in microelectronics. Microstructures should also provide the opportunity to study basic scientific phenomena that occur at small dimensions one example is quantum confinement observed in nanostructures [1]. Although microfabrication has its basis in microelectronics and most research in microfabrication has been focused on microelectronic devices [2], applications in other areas are rapidly emerging. These include systems for microanalysis [3-6], micro-volume reactors [7,8], combinatorial synthesis [9], micro electromechanical systems (MEMS) [10, 11], and optical components [12-14]. 

Thin semiconductor films (and other nanostructured materials) are widely used in many applications and, especially, in microelectronics. Current technological trends toward ultimate miniaturization of microelectronic devices require films as thin as less than 5 nm, that is, containing only several atomic layers [1]. Experimental deposition methods have been described in detail in recent reviews [2-7]. Common thin-film deposition techniques are subdivided into two main categories physical deposition and chemical deposition. Physical deposition techniques, such as evaporation, molecular beam epitaxy, or sputtering, involve no chemical surface reactions. In chemical deposition techniques, such as chemical vapor deposition (CVD) and its most important version, atomic layer deposition (ALD), chemical precursors are used to obtain chemical substances or their components deposited on the surface. 

This chapter will investigate the various types of semiconducting materials, focusing on the influence of their structure on overall properties. We will also detail the many applications for semiconductors, especially within the framework of microelectronic circuitry. It should be noted that nanostructural materials represent a new realm of semiconducting materials that are currently being investigated. However, these materials will not be considered in this chapter, but will instead be detailed in Chapter 6 that focuses solely on nanotechnology. 

The tunable electronic properties of CNTs are being explored for next-generation IC architectures. As you may recall from Chapter 4, traditional Si-based microelectronic devices will likely reach a fundamental limit within the next decade or so, necessitating the active search for replacement materials. Accordingly, an area of intense investigation is molecular electronics - in which the electronic device is built from the placement of individual molecules.Not surprisingly, the interconnects of these devices will likely be comprised of CNTs and other (semi)conductive ID nanostructures such as nanowires. 

Simultaneously, with the rapid growth of electrodeposition in microelectronics, a new trend based on the electrodeposition of materials, structures, particles, devices, etc., generally called nano-objects, with dimensions below 100 nm commenced. Nano-objects are fundamental for nanoscience investigations and nanotechnology development. A nano-object is of particular interest if it has physical properties that differ from objects that have macroscopic sizes. Quantization of energy, for example, is observed in systems with greatly reduced size, such as atoms, molecules, and nanostructures. 

The study of small and intermediate-sized clusters has become an important research field because of the role clusters play in the explanation of the chemical and physical properties of matter on the way from molecules to solids/ Depending on their size, clusters can show reactivity and optical properties very different from those of molecules or solids. The great interest in silicon clusters stems mainly from the importance of silicon in microelectronics, but is also due in part to the photoluminescence properties of silicon clusters, which show some resemblance to the bright photoluminescence of porous silicon. Silicon clusters are mainly produced in silicon-containing plasma as used in chemical vapor deposition processes. In these processes, gas-phase nucleation can lead to amorphous silicon films of poor quality and should be avoided.On the other hand, controlled production of silicon clusters seems very suitable for the fabrication of nanostructured materials with a fine control on their structure, morphological, and functional properties. ... 

Electrically conductive polymers are perspective materials in modern technologies because of their potential applications as chemical sensors, catalysts, microelectronic devices, etc. [1]. The interest to new hybrid nanostructured materials based on polymer matrix with poly-7t-conjugated bonds and noble metals nanoparticles constantly increases. This is reasoned by a wide spectrum of new optical and electrophysical properties [2]. 

By Self-Assembly For implementation of nanostmetures into nanoelec-tronic or microelectronic devices, self-assembly is important. Self-assembly of nanostructures can lead to interesting properties due to collective interactions. For example, a side-by-side assembly of nanorods leads to blue shift of the longitudinal plasmon band and the inter-nanorod distance affects the strength of plasmon coupling (59). Some specific examples of self-assembly are discussed below. 

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