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Multi-layer boards

With multi-layer boards, it is a common practice to almost completely fill one layer with ground (if so, it should preferably be the layer immediately below the power components/traces). There are people who, usually rightly so, consider this a panacea for most problems. As we have seen, every signal has a return, and as its harmonics get higher, the return current, rather than trying to find the path of least dc resistance... [Pg.245]

Tsuyama, Koichi,et al., New Multi-Layer Boards Incorporating IVH HTTAVIA, Tfitochi Chemical Technical Report, No. 24,1995-1, pp. 17-20. [Pg.503]

The systems for primary fiber preparation are less complex than a recovered paper processing system due to the much lower level of impurities and contamination in virgin fiber pulps. Depending on the paper type produced and the availability of the various fiber types, a paper machine, or especially a multi-layer board machine, may be fed by several different fiber qualities, each of them treated in separate lines with different process steps. [Pg.195]

The range is from tiny hybrid circuits, watches, double or multi-layer boards (e.g. pocket calculator) up to big area soldering e.g. for shield grounding. [Pg.31]

This is dangerous especially on multi-layer boards in this case it is better to cut the leads of the IC and remove them one by... [Pg.39]

PEN is a good candidate for labels where temperature tolerance is required, such as multi-layer labels for automobile bodies when being painted and dried at high temperatures. PEN is ideally suited for bar code labels where dimensional stability and registration are required at elevated temperatures. PEN labels have dimensional-excellence performance on printed circuit boards, in solvent- and aqueous-based painting operations, and in under-the-hood applications. PEN labels also provide substantially improved performance over PET or vinyl labels when the label must survive in harsh chemical environments. PEN performs extremely well in applications where the label must be in contact with organic solvents, such as acetone, ethers, toluene and phenol, as well as strong bases (30 % NaOH) and moderate acids. [Pg.355]

One problem which arises when a detector array is attached to the face of a multi-layer module is the inability of the detector material to absorb forces generated by a mismatch of coefficient of thermal expansion between the detector array material and the module. Furthermore, it is difficult to isolate a fault that may be attributable to either the detector elements, module wiring or processing elements. A buffer board is introduced in WO-A-8807764 (Grumman Aerospace Corporation, USA, 06.10.88) which facilitates electrical communication between the detector elements and the module and conductive patterns formed on the module layers, and also enhances the structural characteristics and separate testability of the system components. [Pg.323]

Furukawa N,Yuasa M.Omoro F,YamadaY (1996) Adhesive properties of siloxane-mod-ified polyimides and application for multi-layer printed circuit boards. J Adhes 59 1,281... [Pg.102]

Bradley [3] coated circuit boards with a reactive substrate as a method of activating a latent photoinitiator, (V), for subsequent crosslinkable reactions as illustrated below. Multi-layered circuits were also prepared by Kawasaki [4] using benzophenone as the photoinitiator. [Pg.509]

Though the majority of printed circuit boards (PCBs) at present are two-dimensional and made of glass-filled epoxy resins, increasing miniaturization has led to more PCBs being multi-layered with several copper circuits sandwiched between insulating layers. In these applications, because of the added stress due to thermal expansion, specialty materials such as polyamides and fluoropolymers have been increasingly used. [Pg.779]

When combined with complementary measurements, such as locally resolved current measurements, the information value of neutron radiographic measurements can be further enriched. Taking advantage of the penetration power of neutrons, a dedicated cell design including a multi-layer printed circuit board with an embedded matrix of shunt resistors was used to measure the local current densities and the liquid water distributions concurrently [24]. With the combination of these methods, it is possible to correlate the local water content with the local electric performance of the cell. Figure 18.14 shows the superposition of the... [Pg.505]

The reactor compartment accommodating the VBER-150 reactor installation is shielded from outside by a protective guard consisting of the multi-layer ceilings of a superstructure roof, walls of the stern and bow machine rooms and board compartments of the floating NPP superstructure. Altogether, these structures constitute the external reactor compartment protection, which can withstand external impacts including aircraft crash. [Pg.217]

Lee, S., et al., 2010. Arm-band type textUe-MPS player with multi-layer planar fashionable circuit board (P-FCB) techniques. In ISWC, pp. 1-7. [Pg.98]

Low-Temperature Fireable Multi-layer Ceramic Circuit Board , NIKKEI NEW MATERIALS,Aug. 3" (1987), pp. 93-103. [Pg.16]

Layer IVH Stmcture Multi-layered Printed Wiring Board , Proc Japan... [Pg.217]

The north polar region of Mars consists of variously layered sediments, the upper layer consisting of water ice and thus having a high albedo. More detailed pictures ( 30 cm per pixel) were obtained from the High Resolution Imaging Science Experiment (HiRISE) on board the Mars Reconnaissance Orbiter (MRO). The sediment layers in this region are only about 10 cm thick but seem to be covered with a layer of dust. A detailed analysis of the HiRISE pictures of the north pole deposits indicate that complex, multi-step processes must have occurred at the polar icecaps (Herkenhoff et al., 2007). [Pg.286]


See other pages where Multi-layer boards is mentioned: [Pg.175]    [Pg.83]    [Pg.255]    [Pg.175]    [Pg.83]    [Pg.255]    [Pg.346]    [Pg.11]    [Pg.140]    [Pg.365]    [Pg.928]    [Pg.355]    [Pg.105]    [Pg.365]    [Pg.1486]    [Pg.1527]    [Pg.318]    [Pg.236]    [Pg.159]    [Pg.526]    [Pg.1906]    [Pg.510]    [Pg.202]    [Pg.274]    [Pg.322]    [Pg.582]   
See also in sourсe #XX -- [ Pg.122 , Pg.149 ]

See also in sourсe #XX -- [ Pg.122 , Pg.149 ]

See also in sourсe #XX -- [ Pg.245 ]

See also in sourсe #XX -- [ Pg.122 , Pg.149 ]




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