Metal thermal expansion

THUNDER actuators are produced by bonding of thin piezoelectric ceramic plate to metal sheet at elevated temperature by using a high-temperature adhesive. Internal stresses are induced in such actuator due to the ceramic-metal thermal expansion mismatch. This process leads to curved stress-biased actuator capable of high displacements. 

The multilayer systems use low-dielectric-constant materials similar to traditional ceramic substrates for dielectric layers and an internal circuit metallization designed to be cofired with the ceramic dielectric. Cofiring of metallization with a ceramic dielectric required development of compatible systems which would have matching shrinkage onsets, shrinkage rates, and total volumetric shriiikage. Since the metal thermal expansions are... 

Fig. X-14. SEM picture of a drop ot cooled glass on Femico metal (which has the same coefficient of thermal expansion). xl30. (From Ref. 183.)...

Thermal Properties. Many commercial glass-ceramics have capitalized on thek superior thermal properties, particularly low or zero thermal expansion coupled with high thermal stabiUty and thermal shock resistance properties that are not readily achievable in glasses or ceramics. Linear thermal expansion coefficients ranging from —60 to 200 x 10 j° C can be obtained. Near-zero expansion materials are used in apphcations such as telescope mirror blanks, cookware, and stove cooktops, while high expansion frits are used for sealing metals. 

Metal Crystal 22° C stmeture 1000° c Melting point, °C Density, g/cm Thermal expansion coefficient at RT, ioV°c Thermal conductivity at RT, W/(m-K)" Young s modulus, GPa "... 

For wear resistance and low friction, coatings of PTFE or M0S2 generally have been satisfactory. Use of low thermal expansion filler in PTFE helps minimise cracking and loss of adhesion from metal substrates with their lower coefficients of expansion. 

Thermal Stresses and Properties. In general, ceramic reinforcements (fibers, whiskers, or particles) have a coefficient of thermal expansion greater than that of most metallic matrices. This means that when the composite is subjected to a temperature change, thermal stresses are generated in both components. 

Thermal expansion mismatch between the reinforcement and the matrix is an important consideration. Thermal mismatch is something that is difficult to avoid ia any composite, however, the overall thermal expansion characteristics of a composite can be controlled by controlling the proportion of reinforcement and matrix and the distribution of the reinforcement ia the matrix. Many models have been proposed to predict the coefficients of thermal expansion of composites, determine these coefficients experimentally, and analy2e the general thermal expansion characteristics of metal-matrix composites (29-33). 

Electronic-Grade MMCs. Metal-matrix composites can be tailored to have optimal thermal and physical properties to meet requirements of electronic packaging systems, eg, cotes, substrates, carriers, and housings. A controUed thermal expansion space tmss, ie, one having a high precision dimensional tolerance in space environment, was developed from a carbon fiber (pitch-based)/Al composite. Continuous boron fiber-reinforced aluminum composites made by diffusion bonding have been used as heat sinks in chip carrier multilayer boards. 

Because of its high modulus of elasticity, molybdenum is used in machine-tool accessories such as boring bars and grinding quills. Molybdenum metal also has good thermal-shock resistance because of its low coefficient of thermal expansion combined with high thermal conductivity. This combination accounts for its use in casting dies and in some electrical and electronic appHcations. 

Cases can be classified as either hermetic or nonhermetic, based on their permeabiUty to moisture. Ceramics and metals are usually used for hermetic cases, whereas plastic materials are used for nonhermetic appHcations. Cases should have good electrical insulation properties. The coefficient of thermal expansion of a particular case should closely match those of the substrate, die, and sealing materials to avoid excessive residual stresses and fatigue damage under thermal cycling loads. Moreover, since cases must provide a path for heat dissipation, high thermal conductivity is also desirable. 

Thermal Expansion. Coefficients of linear thermal expansion and linear expansion during transformation are listed in Table 7. The expansion coefficient of a-plutonium is exceptionally high for a metal, whereas those of 5- and 5 -plutonium are negative. The net linear increase in heating a polycrystalline rod of plutonium from room temperature to just below the melting point is 5.5%. 

Cross-linked polyester composites have a relatively low coefficient of thermal conductivity that can provide beneficial property retention in thick laminates at high temperatures as well as remove the need for secondary insulation. The coefficient of thermal expansion of glass-reinforced composites is similar to aluminum but higher than most common metals. 

Because of the high functional values that polyimides can provide, a small-scale custom synthesis by users or toU producers is often economically viable despite high cost, especially for aerospace and microelectronic appHcations. For the majority of iudustrial appHcations, the yellow color generally associated with polyimides is quite acceptable. However, transparency or low absorbance is an essential requirement iu some appHcations such as multilayer thermal iusulation blankets for satellites and protective coatings for solar cells and other space components (93). For iutedayer dielectric appHcations iu semiconductor devices, polyimides having low and controlled thermal expansion coefficients are required to match those of substrate materials such as metals, ceramics, and semiconductors usediu those devices (94). 

Thermal Properties. Refractories, like most other soHds, expand upon heating, but much less than most metals. The degree of expansion depends on the chemical composition. A diagram of the thermal expansion of the most common refractories is shown in Figure 1. 

Cordierite [12182-53-5] Mg Al Si O g, is a ceramic made from talc (25%), kaolin (65%), and Al O (10%). It has the lowest thermal expansion coefficient of any commercial ceramic and thus tremendous thermal shock resistance. It has traditionally been used for kiln furniture and mote recently for automotive exhaust catalyst substrates. In the latter, the cordierite taw materials ate mixed as a wet paste, extmded into the honeycomb shape, then dried and fired. The finished part is coated with transition-metal catalysts in a separate process. 

A summary of physical and chemical constants for beryUium is compUed ia Table 1 (3—7). One of the more important characteristics of beryUium is its pronounced anisotropy resulting from the close-packed hexagonal crystal stmcture. This factor must be considered for any property that is known or suspected to be stmcture sensitive. As an example, the thermal expansion coefficient at 273 K of siagle-crystal beryUium was measured (8) as 10.6 x 10 paraUel to the i -axis and 7.7 x 10 paraUel to the i -axis. The actual expansion of polycrystalline metal then becomes a function of the degree of preferred orientation present and the direction of measurement ia wrought beryUium. 

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