Metal polishes

The exposed metal is buffed to a high luster. Metal polishing is reviewed in Reference 3. 

Although abrasive polishing is the most common metal polishing operation, other forms of polishing and chemical brightening are used ia iadustrial operations. Aluminum tmck trailers often are cleaned and brightened by treatments with strong acids or alkaHes, which chemically remove oxides. Chemical methods can also remove tarnish from other metals (55,56). 

Vitreous, colourless form of free silica. Formed when quartz is heated to 870°C (1598°F). Aporous siliceous rock resulting from the decomposition of chertorsiliceous limestone. Used as a base in soap and scouring powders, in metal polishing, as a filtering agent, and in wood and paint fillers. A cryptocrystalline form of free silica. 

Metall-oxyd, n. metallic oxide, -oxydhydrat, n. metal (lie) hydroxide, -papier, n. metal (lie) paper, -poliermittel, n. metal polish, -probe, /, test for metal, assay, -putzmittel, n. metal polish, -rohr, n., -rbhre, /. metal tube oi-pipe, -rohrehett, n. (small) metal tube or pipe, -riickstand, m. metallic residue, -sa-fran, m. crocus of antimony, -salz, n. metallic salt. 

Metal polishing mechanisms appear to be considerably different from silica polishing. The critical event that determines the polishing process in metal CMP appears not only to be influenced by the crystallographic/microstructure deformation process but also to relate to more complex components of slurry [18]. To better understand the removal mechanism in metal CMP, tungsten is chosen, since both industrial and laboratory CMP data are available for this metal, and its abrasion behavior as a metal is similar to that of other ductile metals which have been studied quite extensively under two- and three-body abrasion [66]. 

One laboratory used industrial-type brass valves for many of their water outlets, rather than the more expensive chrome plated ones available from the laboratory supply house. While their appearance was different, their performance was the same. To make the valves look better to both laboratory workers and visitors, the manager would occasionally treat them vdth metal polish. 

A nitric acid/hydrogen fluoride/glycerol mixture used as a chemical metal polish detonated after three days in storage. 

A metal polishing fluid of a similar composition that contained propane-1,2-diol, nitric acid, hydrogen fluoride and silver nitrate detonated thirty minutes after being used. 

Mixtures of the 3 acids, used as metal polishing solutions, are unstable and should not be stored. Lactic acid and nitric acid react autocatalytically after a quiescent period, attaining a temperature of about 90°C with vigorous gas evolution after about 12 h. Prepare freshly, discard after use and handle carefully. 

A chemical polishing mixture was put into a closed glass bottle which burst 30 min later, and formation of silver fulminate was suggested. However, in absence of the silver salt such mixtures evolve gas and should not be stored in any event, especially after use for metal polishing, when the dissolved metal(s) tend to further destabilise the mixture. 

Uses Preparation of 3,4-dichloroaniline solvent for a wide variety of organic compounds and for oxides of nonferrous metals solvent carrier in products of toluene diisocyanate intermediate for dyes fumigant insecticide for termites degreasing hides and wool metal polishes degreasing agent for metals, wood, and leather industrial air control disinfectant heat transfer medium. 

Uses Solvent for cellulose ethers modifying esterification of cellulose acetate ingredient of metal polishes and shoe polishes manufacture of aniline, benzidine, quinoline, azobenzene, drugs, photographic chemicals. 

Uses. Chemical synthesis bleaches metal polish rust remover... 

In Section II, we focus first on wafer-scale models, including macroscopic or bulk polish models (e.g., via Preston s equation), as well as mechanistic and empirical approaches to model wafer-scale dependencies and sources of nonuniformity. In Section III, we turn to patterned wafer CMP modeling and discuss the pattern-dependent issues that have been examined we also discuss early work on feature-scale modeling. In Section IV, we focus on die-scale modeling efforts and issues in the context of dielectric planarization. In Section V, we examine issues in modeling pattern-dependent issues in metal polishing. Summary comments on the status and application of CMP modeling are offered in Section VI. 

In the typical metal polish application recessed features are patterned in a supporting oxide or other dielectric material the goal is to have metal reside only in these recessed regions at the conclusion of the polishing... 

S. Ramarajana and S.V. Babu, Modified Preston Equation For Metal Polishing Revisited, Materials Research Society 1999 Spring Meeting, San Francisco, CA, April 1999. 

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