Metal oxide semiconductor unit processes

Chatterjee A, Ali I, Joyner K, Mercer D, Kuehne J, Mason M, Esuivel A, Rogers D, O Brien S, Mei P, Murtaza S, Kwok SP, Taylor K, Nag S, Hames G, Hanratty M, Marchman H, Ashburn S, Chen I-C. Integration of unit processes in a shallow trench isolation module for a 0.25 pm complementary metal-oxide semiconductor technology. J Vac Sci Technol 1997 B15(6) 1936-1942. 

In Figure 5-la is shown a schematic representation of a silicon MOSFET (metal-oxide-semiconductor field effect transistor). The MOSFET is the basic component of silicon-CMOS (complimentary metal-oxide-semiconductor) circuits which, in turn, form the basis for logic circuits, such as those used in the CPU (central processing unit) of a modern personal computer [5]. It can be seen that the MOSFET is isolated from adjacent devices by a reverse-biased junction (p -channel stop) and a thick oxide layer. The gate, source and drain contact are electrically isolated from each other by a thin insulating oxide. A similar scheme is used for the isolation of the collector from both the base and the emitter in bipolar transistor devices [6],... 

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