Keyes’figure of merit

The Keyes figure of merit, based on thermal conductivity as an additional factor, (see following section) predicts the suitability of a semiconductor for dense logic circuit applications. Again, diamond is far superior to other materials. 

Keyes figure of merit (dense logic circuits) 1 0.5 6 32... 

Although a large variety of nonlinear materials have been used in prototype harmonic doublers (15-17), only waveguide doublers in LiNb03 have been of usable quality. A list of previous waveguide doublers can be found in references 15-17. The key figure of merit is... 

For compact portable consumer electronics applications like mobile phones, it is often the volume rather than the weight of the power source that is the key figure of merit in terms of system packaging. Under these circumstances, it is the energy density, rather than the specific energy, that is of greater interest. The equivalent... 

The device potential of a semiconductor material is often estimated in terms of figures of merit. The Johnson s and Keyes figures of merit are frequently used. Johnson s Figure of Merit (JFM) addresses the potential of a material for high-frequency and high-power applications [8] ... 

FIGURE 1 Figures of merit for Si, GaAs and SiC. KFM - Keyes figure of merit, JFM - Johnson s figure... 

Keyes Figure of Merit (KFM) [9] is relevant to integrated circuits applications ... 

As we have described, TGF has successfully demonstrated the simultaneous concentration and separation of a wide range of species in a variety of implementations. Key figures of merit for TGF as a separation modality are the concentration factor and peak capacity. Static TGF, where the externally applied pressure remains constant, has demonstrated concentration factors in excess of 20,000 but is limited to peak capacities <10 [56], As a result, there has been recent work to develop a dynamic form of TGF called scanning TGF [67], where the externally applied pressure is varied with time. This technique allows higher peak capacity and tunable resolution and concentration by adjusting the rate at which the procedure scans through the applied pressures. 

The most versatile and sophisticated wavelength-selective element is a spectrometer, and substantial efforts to develop integrated microspectrometers on a chip have been made [8]. A key figure of merit for the performance of... 

The key figures of merit for a photoresist are resolution, process latitudes (dose and focus), and reactive ion etch resistance. Other important performance parameters include sensitivity, compatibility with industrial standard developer (0.263N aqueous tetramethylamoniumhydroxide (TMAH) solution), adhesion to substrates, environmental stability, and shelf life. These performance characteristics are mainly determined by the base polymer in the photoresist. It should be pointed out, however, that some of these performance parameters, such as resolution, process latitudes and etch resistance, are also tool and process condition dependent. 

Section 6.2.1) Attempts to compare different analyzer types with respect to some key figures of merit are made in Table 6.1, but it should be borne in mind that such attempts at a succinct comparison are both somewhat subjective and also are likely to become outdated in view of the rapid pace of instrumental development. 

Table 10.1 Key figures of merit that are addressed in validation of an analytical method...

Figure 11.25 Comparison of rival techniques for GC/MS analysis of dioxin-like compounds with respect to three key figures of merit. Reproduced from Focant, J. Chromatogr. A 1067, 265, copyright (2005) with permission from Elsevier.

Besides the capillary length, another key figure of merit is the work of adhesion (W a)-It describes the amount of work necessary to lift a droplet off the surface, hence it is associated with overcoming the surface-liquid interactions. values can be calculated using Dupre s equation [24] ... 

Likewise, SiC has been considered a suitable material for the coolant channels of the blankets of fusion reactors created from a SiC composite (Ward and Dudaev, 2008), and also as a low-activation structural material to protect against the excessive heat loads of the metal first wall of a potential fusion reactor (Hopkins, 1974). The key figure of merit for the latter application is a high thermal shock resistance, R", which is necessary to withstand the stresses introduced by startups and plasma disruptions, together with the thermal cycling associated with normal pulsed mode operation. In this case, Rf = Ob k (l - t lE-a, where CTj, is the flexural strength, k the thermal conductivity, v the Poisson ratio, E the modulus of elasticity, and a the coefficient of thermal expansion. 

Bipolar plates will be used to connect many cells in series. To the fuel cell stack will be added the balance of plant components mentioned in Section 1.7. This will give a system of a certain power, mass, and volume. These figures give the key figures of merit for comparing electrical generators - specific power and power density. 

Thus, the mass dispersion coefficient and the slit widths are the most significant parameters in setting the resolution, and the ratio of dispersion to magnification [DJM) is a key figure of merit in the design of an instrument. However, ultimate resolution is limited by the imaging aberrations. 

One area where there is considerable current interest in chromia-forming alloys is for metallic intercoimectors for solid oxide fuel cells (Quadakkers et al., 2003 Brady et al, 2006). For this application, a key figure of merit is the electrical conductivity of the external scale. This criterion excludes alumina and silica scales which are too insulating. Two examples are provided which show some of the potential alloy design strategies for this application. 

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