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Exchanger Elevation

Most exchangers are at grade with centerline elevations of about 3.0 to 5.5 feet above ground level, for exchangers about 1 to 3 feet in diameter. [Pg.241]

Exchangers at grade are the most economical arrangements. Most veilves eind instruments can be made accessible from grade, tubebundle handling is convenient and maintenance is easy. [Pg.241]

In general, in vacuum service and in certain fractionating services, where close pressure control is required, condensers are placed above the reflux drum. But most condensers are located at grade. [Pg.243]

Pump suction lines from exchangers are just above grade. For nonvaporizing liquids under pressure, pump suction lines can be run overhead however, loopless (and pocketless) suction lines are always preferred. [Pg.244]

Sometimes a flat turn at the edge of the yard piping can be arranged. Of course, here the exchanger yard inter-connecting line will be raised to the elevation of the main yard piping. [Pg.244]


Figure 7-64. With exchanger elevated just above condensate pot, flooding of tubes can be avoided. [Pg.242]

At the condensing-reflux system in Figure 7-67, the elevation of the condensers is influenced by several factors. First, the reflux drum must be elevated because of pump NPSH requirements, say 14 feet to the bottom of the drum (about 2-3 feet below this elevation, a platform is required). To this 14 feet must be added the drum diameter, estimated space for pipe lines, depth of structural steel members plus platform-to exchanger-centerline dimension for establishing the exchanger elevation above grade. [Pg.243]

The encephalopathy induced by lead toxicity is most hkely due to a compromise in the blood-brain barrier. Brain edema occurs in the interstitial area and appears due to compromised blood vessels integrity. The brain capillaries and blood vessels have endothelial cells that contain tight junctions and act as a seal or carrier that excludes many plasma proteins and organic molecules and impedes Na and K exchange. Elevated lead levels disrupt these vessels, and plasma proteins such as albumin enter the interstitial spaces, as do some ions. This increases osmotic pressure, and water accumulates in response. The increased interstitial fluid flows into the cerebrospinal fluid. The edema causes in an increase in intracranial pressure and restricts blood flow to the brain. The direct mechanisms by which the blood-brain barrier and blood vessels that compose the barrier may be compromised may be due to astrocytes appearing to be vulnerable to the toxic effects of lead. The astrocytes cover the walls of the brain blood vessels, and lead can injure these structures. [Pg.52]

The most commonly used protected derivatives of aldehydes and ketones are 1,3-dioxolanes and 1,3-oxathiolanes. They are obtained from the carbonyl compounds and 1,2-ethanediol or 2-mercaptoethanol, respectively, in aprotic solvents and in the presence of catalysts, e.g. BF, (L.F. Fieser, 1954 G.E. Wilson, Jr., 1968), and water scavengers, e.g. orthoesters (P. Doyle. 1965). Acid-catalyzed exchange dioxolanation with dioxolanes of low boiling ketones, e.g. acetone, which are distilled during the reaction, can also be applied (H. J. Dauben, Jr., 1954). Selective monoketalization of diketones is often used with good success (C. Mercier, 1973). Even from diketones with two keto groups of very similar reactivity monoketals may be obtained by repeated acid-catalyzed equilibration (W.S. Johnson, 1962 A.G. Hortmann, 1969). Most aldehydes are easily converted into acetals. The ketalization of ketones is more difficult for sterical reasons and often requires long reaction times at elevated temperatures. a, -Unsaturated ketones react more slowly than saturated ketones. 2-Mercaptoethanol is more reactive than 1,2-ethanediol (J. Romo, 1951 C. Djerassi, 1952 G.E. Wilson, Jr., 1968). [Pg.165]

Hthiated 4-substituted-2-methylthia2oles (171) at -78 C (Scheme 80). Crossover experiments at—78 and 25°C using thiazoles bearing different substituents (R = Me, Ph) proved that at low temperature the lithioderivatives (172 and 173) do not exchange H/Li and that the product ratios (175/176) observed are the result of independent metala-tion of the 2-methyl and the C-5 positions in a kinetically controlled process (444). At elevated temperatures the thermodynamic acidities prevail and the resonance stabilized benzyl-type anion (Scheme 81) becomes more abundant, so that in fine the kinetic lithio derivative is 173, whereas the thermodynamic derivative is 172. [Pg.123]

Nickel—Copper. In the soHd state, nickel and copper form a continuous soHd solution. The nickel-rich, nickel—copper alloys are characterized by a good compromise of strength and ductihty and are resistant to corrosion and stress corrosion ia many environments, ia particular water and seawater, nonoxidizing acids, neutral and alkaline salts, and alkaUes. These alloys are weldable and are characterized by elevated and high temperature mechanical properties for certain appHcations. The copper content ia these alloys also easure improved thermal coaductivity for heat exchange. MONEL alloy 400 is a typical nickel-rich, nickel—copper alloy ia which the nickel content is ca 66 wt %. MONEL alloy K-500 is essentially alloy 400 with small additions of aluminum and titanium. Aging of alloy K-500 results in very fine y -precipitates and increased strength (see also Copper alloys). [Pg.6]

Fig. 3. Rough layout sketch (/) the two fined heaters F-1 and F-2 are located together but are separated from the other equipment with a subpipeway connecting the process area to the heater area (2) the reboiler E-2 is located adjacent to its column, T-1. The preheat exchanger E-4 is located adjacent to tower T-3 (J) the elevated overhead condenser E-3 is located next to the overhead accumulator V-1. Also, the ain condenser EE-3 is located adjacent to its overhead accumulator V-2 (4) the rest of the ain coolers (EE-1—3, -5) are grouped together ia a common fan stmcture (5) all equipment and related piping is routed to and from the existing piperack saving the addition of a new piperack (6) all pumps (P-1—P-6) are located ia a row under the piperack, and each... Fig. 3. Rough layout sketch (/) the two fined heaters F-1 and F-2 are located together but are separated from the other equipment with a subpipeway connecting the process area to the heater area (2) the reboiler E-2 is located adjacent to its column, T-1. The preheat exchanger E-4 is located adjacent to tower T-3 (J) the elevated overhead condenser E-3 is located next to the overhead accumulator V-1. Also, the ain condenser EE-3 is located adjacent to its overhead accumulator V-2 (4) the rest of the ain coolers (EE-1—3, -5) are grouped together ia a common fan stmcture (5) all equipment and related piping is routed to and from the existing piperack saving the addition of a new piperack (6) all pumps (P-1—P-6) are located ia a row under the piperack, and each...
Overhead condensers sometimes need to be located in the stmcture. Usually, partial condensers need to be elevated above the reflux accumulator. Considerable stmcture cost reduction can be achieved if the process can use grade-mounted condensers. Mounting the exchangers at grade may require them to be designed with subcooling so that the reflux accumulator can be located above the condenser. This should be considered as part of the process design. [Pg.78]

Figure 12 shows the plan and elevation views of a process unit piping (9). A dmm is supported off the piperack. Heat exchangers are located far enough back from the support columns so that they are accessible and their shell covers can be removed. Pumps are located underneath the piperack, but sufficient room is provided for maintenance equipment to access the motors and to remove the pump if necessary. The motor is always oriented away from the process equipment and located on that side of the piperack. Instmment valve drops are shown supported from the columns. The instmment trays themselves mn on the outside of the support columns. Flat turns are only made from the outside position of the piperack. Nozzle-to-nozzle pipe mns are made whenever possible. Larger lines are located on the outside of the piperack. Connections to nozzles above the rack are made from the top... [Pg.80]

Sugar analysis by hplc has advanced greatly as a result of the development of columns specifically designed for carbohydrate separation. These columns fall into several categories. (/) Aminopropyl-bonded siHca used in reverse-phase mode with acetonitrile—water as the eluent. (2) Ion-moderated cation-exchange resins using water as the eluent. Efficiency of these columns is enhanced at elevated temperature, ca 80—90°C. Calcium is the usual counterion for carbohydrate analysis, but lead, silver, hydrogen, sodium, and potassium are used to confer specific selectivities for mono-, di-, and... [Pg.10]

Chemical Properties. The chemistry of the sulfur chlorides has been reviewed (141,142). Sulfur monochloride is stable at ambient temperature but undergoes exchange with dissolved sulfur at 100°C, indicating reversible dissociation. When distilled at its atmospheric boiling point, it undergoes some decomposition to the dichloride, but decomposition is avoided with distillation at ca 6.7 kPa (50 mm Hg). At above 300°C, substantial dissociation to S2 and CI2 occurs. Sulfur monochloride is noncombustible at ambient temperature, but at elevated temperatures it decomposes to chlorine and sulfur (137). The sulfur then is capable of burning to sulfur dioxide and a small proportion of sulfur trioxide. [Pg.137]

Class (2) reactions are performed in the presence of dilute to concentrated aqueous sodium hydroxide, powdered potassium hydroxide, or, at elevated temperatures, soHd potassium carbonate, depending on the acidity of the substrate. Alkylations are possible in the presence of concentrated NaOH and a PT catalyst for substrates with conventional pX values up to - 23. This includes many C—H acidic compounds such as fiuorene, phenylacetylene, simple ketones, phenylacetonittile. Furthermore, alkylations of N—H, O—H, S—H, and P—H bonds, and ambident anions are weU known. Other basic phase-transfer reactions are hydrolyses, saponifications, isomerizations, H/D exchange, Michael-type additions, aldol, Darzens, and similar... [Pg.186]

In the dual-temperature H2O/H2S process (61,62), exchange of deuterium between H20(l) and H2S(g) is carried out at pressures of ca 2 MPa (20 atm). At elevated temperatures deuterium tends to displace hydrogen in the hydrogen sulfide and thus concentrates in the gas. At lower temperatures the driving force is reversed and the deuterium concentrates in H2S in contact with water on the tiquid phase. [Pg.6]

Air recirculation. Prevailing winds and the locations and elevations of buildings, equipment, fired heaters, etc., require consideration. All air-cooled heat exchangers in a bank are of one type, i.e., all forced-draft or all induced-draft. Banks of air-cooled exchangers must be placed far enough apart to minimize air recirculation. [Pg.1081]

The other major defects in solids occupy much more volume in the lattice of a crystal and are refeiTed to as line defects. There are two types of line defects, the edge and screw defects which are also known as dislocations. These play an important part, primarily, in the plastic non-Hookeian extension of metals under a tensile stress. This process causes the translation of dislocations in the direction of the plastic extension. Dislocations become mobile in solids at elevated temperamres due to the diffusive place exchange of atoms with vacancies at the core, a process described as dislocation climb. The direction of climb is such that the vacancies move along any stress gradient, such as that around an inclusion of oxide in a metal, or when a metal is placed under compression. [Pg.33]


See other pages where Exchanger Elevation is mentioned: [Pg.241]    [Pg.246]    [Pg.241]    [Pg.246]    [Pg.2785]    [Pg.1284]    [Pg.321]    [Pg.140]    [Pg.290]    [Pg.152]    [Pg.423]    [Pg.497]    [Pg.516]    [Pg.523]    [Pg.204]    [Pg.386]    [Pg.223]    [Pg.451]    [Pg.482]    [Pg.77]    [Pg.77]    [Pg.288]    [Pg.490]    [Pg.363]    [Pg.423]    [Pg.472]    [Pg.108]    [Pg.545]    [Pg.86]    [Pg.142]    [Pg.477]    [Pg.478]    [Pg.291]    [Pg.294]    [Pg.1243]    [Pg.1334]    [Pg.36]   


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