Phenolic resin containing epoxy compounds

Radiation Chemistry of Phenolic Resin Containing Epoxy and Azide Compounds... 

There is a common feature of the polymer composition in PC, PPO, epoxy and phenol-formaldehyde resin, all contain phenoxy moieties in their repeating unit. Hence, it is not unexpected that the major pyrolysis products of these plastics are phenols. The reason of the production of phenolic compounds is the higher bonding energy of the C-0 linkage in the phenoxy moiety related to that of other bonds along the polymer chain. 

Polyethylene and Polypropylene Acceptable bonds have been obtained between treated polyolefin surfaces with polar adhesives, such as epoxies, or solvent cements containing synthetic rubber or phenolic resin. The solvent adhesives are applied to both surfaces and the solvents allowed to evaporate before the parts are joined. Recommended epoxies are the anhydride-cured and amine-cured types. Also suitable is a two-component, polyamide-modified epoxy compound. Other adhesives that provide adequate bond strength to treated polyolefins include styrene-unsatmated polyester and solvent-type nitrile-phenolic (15). 

The electronics industry desires improved flame suppressant additives for microelectronic encapsulants due to bromine induced failure. Epoxy derivatives of novolacs containing meta-bromo phenol have exhibited exceptional hydrolytic and thermal stability in contrast to standard CEN resins with conventional TBBA epoxy resins. When formulated into a microelectronic encapsulant, this stable bromine epoxy novolac contributes to significant enhancements in device reliability over standard resins. The stable bromine CEN encapsulant took about 30% more time to reach 50% failure than the bias pressure cooker device test. In the high temperature storage device test, the stable bromine CEN encapsulant took about 400% more time to reach 50% failure than the standard compound. Finally, the replacement of the standard resins with stable bromine CEN does not adversely affect the desirable reactivity, mechanical, flame retardance or thermal properties of standard molding compounds. 

Different compounds such as epoxides and allyl chloride are used in this important modification of phenolic resins. Epoxides are one key component for phenolic resin modification by an etherification reaction. Technological important reactions are the conversion of novolacs into epoxy novolacs and the ctosslinking of phenolics with epoxy resins. Recently, hydroxymethyl-group-containing phenolics have been converted into epoxides. 

CNSL is obtained as a by-product of the cashew nut industry, mainly containing anacardic acid 80.9%, cardol 10-15%, cardanol, and 2-methyl cardol (Fig. 10). CNSL occurs as a brown viscous fluid in the shell of cashewnut, a plantation product obtained from the cashew tree, Anacardium oxidentale (Bhunia, et al., 2000). CNSL is used in the manufacture of industrially important materials such as cement, primers, specialty coatings, p)aints, varnishes, adhesives, foundry core oils, automotive brake lining industry, laminating and rubber compounding resins, epoxy resins, and in the manufacture of anionic and non-ionic surface active agents. CNSL modified phenolic resins are suitable for many applications and perform improved corrosion and insulation resistance. 

This class of compounds is one of the most important adhesive groups with applications ranging from consumer to aerospace markets. Epoxies are thermosets and are cross-linked during the cure cycle. The chemical stmcmre for a simple epoxy (ethylene oxide) in its unhardened state is shown in Figure 5.2. All epoxy compounds contain two or more of these groups. Epoxy resins form adducts with vinyl, acrylic, and polyester resins producing compounds such as phenol novolac, cresol novolac, bis-[4(2,3-epoxy propyoxy) phenyl] methane, and phenol hydrocarbon novalac [53]. 

Chlorinated paraffins, which contain up to 60-70% chlorine, are low in cost and are used as secondary plasticizer in PVC wire and cable insulations. Perchlorobicyclopentadiene has little plasticizing action and is used in polyethylene. Some of the more expensive bromine-containing fire retardants which have been used in the ratio of 5 p.p.h. in polystyrene foam, may be reduced to 0.5 p.p.h. by adding synergists such as peroxides or nitroso compounds. The reaction-type retardants, such as chlorendic acid and anhydride, hydroxy-terminated phosphonated esters, and specific brominated aliphatic esters, are admixed to rigid and flexible polyurethane foams, reinforced polyesters, phenolics, and epoxy resins. 

Photocationic initiators. Epoxy resins can be cross-linked by compounds containing active hydrogen, e.g., carboxylic acids, anhydrides, amines, phenols etc., or by the ionic polymerization process. Lewis acids such as BF3 and usually a crystalline complex of BF3 with amines, e.g., BF3 NH2C2H5, can be used for curing reaction at 80-100° C [124]. 

Mannich base hardeners for curing epoxy resins may contain residual formaldehyde, phenol and benzyl alcohol, that can have undesirable effects when present in the final product. Determination of these compounds in the hardener was carried out by GC-FID of a 2% solution in chloroform-EtOH, using amyl alcohol as internal standard. LOD was 18, 30 and 26 ppm and LOQ was 75, 86 and 79 ppm of formaldehyde, phenol and benzyl alcohol, respectively. ... 

Bisphenol A is produced by the condensation reaction of excess phenol with acetone in the presence of an acidic catalyst. Sulfur compounds that may be used as a cocatalyst include alkyl mercaptans, such as methyl mercaptan, ethyl mercaptan, and thioglycol acid. Recently, a catalyst composed of an acid-type ion exchange resin, which is modified in part with a sulfur-containing amine compound, has been disclosed [16]. Bisphenol A is used for a wide variety of resins, mostly in the production of epoxy resins. 

Pol)merization reaction of phenol-formaldehyde oligomer (novolac resin - SF-0112) with tetraepoxypolyphenylsilsesquioxanes was carried out in melt condition at 125 5°C temperature at various ratios of initial compounds, without catalyst. The samples were tested on contain of epoxy groups during the reaction. It was shown that during synthesis of block-copolymers the reaction rate decreases, which may be explained by presence of free phenols in used phenol-formaldehyde oligomer. In accor-... 

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