Partial reaction electroless deposition

More recently, Wiese and Weil" reported a detailed study of the mechanism of electroless copper deposition with formaldehyde from alkaline ethylenediamine-tetraacetate (EDTA)-containing solutions. The partial reactions were expected to be... 

Paunovic [23] and Saito [24] first advanced the notion that an electroless deposition process could be modeled using a simple electrochemical approach. They reasoned that the potential of a surface undergoing electroless deposition could be regarded as a mixed potential intermediate in value between the potentials of its constituent anodic and cathodic partial reactions. These authors employed the mixed potential concept of corrosion reactions first outlined in a systematic manner by Wagner and... 

Fig. 1. Current-potential curves for a generalized electroless deposition reaction. The dashed line indicates the curve for the complete electroless solution. The partial anodic and cathodic currents are represented by ia and ic, respectively. Adapted from ref. 28. 

In the mixed potential theory (MPT) model, both partial reactions occur randomly on the surface, both with respect to time and space. However, given the catalytic nature of the reductant oxidation reaction, it may be contended that such a reaction would tend to favor active sites on the surface, especially at the onset of deposition, and especially on an insulator surface catalyzed with Pd nuclei. Since each reaction strives to reach its own equilibrium potential and impose this on the surface, a situation is achieved in which a compromise potential, known as the mixed potential (.Emp), is assumed by the surface. Spiro [27] has argued the mixed potential should more correctly be termed the mixture potential , since it is the potential adopted by the complete electroless solution which comprises a mixture of reducing agent and metal ions, along with other constituents. However, the term mixed potential is deeply entrenched in the literature relating to several systems, not just electroless deposition. 

Figure 1 shows a generalized representation of an electroless deposition process obeying MPT [28]. Polarization curves are shown for the two partial reactions (full lines), and the curve expected for the full electroless solution (dashed curve). The polarization curve for anodic and cathodic partial reactions intersect the potential axis at their respective equilibrium potential values, denoted by / j]cd and respectively. At Emp, the anodic and cathodic partial current densities are equal, a... 

Spiro [27] has derived quantitative expressions for the catalytic effect of electron conducting catalysts on oxidation-reduction reactions in solution in which the catalyst assumes the Emp imposed on it by the interacting redox couples. When both partial reaction polarization curves in the region of Emp exhibit Tafel type kinetics, he determined that the catalytic rate of reaction will be proportional to the concentrations of the two reactants raised to fractional powers in many simple cases, the power is one. On the other hand, if the polarization curve of one of the reactants shows diffusion-controlled kinetics, the catalytic rate of reaction will be proportional to the concentration of that reactant alone. Electroless metal deposition systems, at least those that appear to obey the MPT model, may be considered to be a special case of the general class of heterogeneously catalyzed reactions treated by Spiro. 

A discussion of the applicability of the MPT model to a particular electroless system ideally presumes knowledge of the kinetics and mechanisms of the anodic and cathodic partial reactions, and experimental verification of the interdependence or otherwise of these reactions. However, the study of the kinetics, catalysis, and mechanistic aspects of electroless deposition is an involved subject and is discussed separately. 

Donahue [37] was one of the first to discuss interactions between partial reactions in electroless systems, specifically electroless Ni with NaH2PC>2 reducing agent, where mention was made of an interaction between H2PO2 ions and the cathodic Ni2+ reduction reaction with a calculated reaction order of 0.7. Donahue also derived some general relationships that may be used as diagnostic criteria in determining if interactions exist between the partial reactions in an electroless solution. Many electroless deposition systems have been reported to not follow the MPT model. However, mention of these solutions may be best left to a discussion of the kinetics and mechanism of electroless deposition, since a study of the latter is usually necessary to understand the adherence or otherwise of an electroless solution to the MPT model. 

Although electroless deposition seems to offer greater prospects for deposit thickness and composition uniformity than electrodeposition, the achievement of such uniformity is a challenge. An understanding of catalysis and deposition mechanisms, as in Section 3, is inadequate to describe the operation of a practical electroless solution. Solution factors, such as the presence of stabilizers, dissolved O2 gas, and partially-diffusion-controlled, metal ion reduction reactions, often can strongly influence deposit uniformity. In the field of microelectronics, backend-of-line (BEOL) linewidths are approaching 0.1 pm, which is much less than the diffusion layer thickness for a... 

As discussed earlier, it is generally observed that reductant oxidation occurs under kinetic control at least over the potential range of interest to electroless deposition. This indicates that the kinetics, or more specifically, the equivalent partial current densities for this reaction, should be the same for any catalytically active feature. On the other hand, it is well established that the O2 electroreduction reaction may proceed under conditions of diffusion control at a few hundred millivolts potential cathodic of the EIX value for this reaction even for relatively smooth electrocatalysts. This is particularly true for the classic Pd initiation catalyst used for electroless deposition, and is probably also likely for freshly-electrolessly-deposited catalysts such as Ni-P, Co-P and Cu. Thus, when O2 reduction becomes diffusion controlled at a large feature, i.e., one whose dimensions exceed the O2 diffusion layer thickness, the transport of O2 occurs under planar diffusion conditions (except for feature edges). 

There is compelling evidence that reducing agent oxidation and metal ion reduction are, more often than not, interdependent reactions. Nonetheless, virtually all established mechanisms of the electroless deposition fail to take into account this reaction interdependence. An alternative explanation is that the potentials applied in the partial solution cell studies are different to those measured in the full electroless solution studies. Notwithstanding some differences in the actual potentials at the inner Helmholtz plane in the full solution relative to the partial solutions, it is hard to see how this could be a universal reason for the difference in rates of deposition measured in both types of solution. 

In this chapter we discuss the electrochemical model of electroless deposition (Sections 8.2 and 8.3), kinetics and mechanism of partial reactions (Sections 8.4 and 8.5), activation of noncatalytic surfaces (Section 8.6), kinetics of electroless deposition (Section 8.7), the mechanism of electroless crystallization (Section 8.8), and unique properties of some deposits (Section 8.9). 

An electrochemical model for the process of electroless metal deposition was suggested by Paunovic (10) and Saito (8) on the basis of the Wagner-Traud (1) mixed-potential theory of corrosion processes. According to the mixed-potential theory of electroless deposition, the overall reaction given by Eq. (8.2) can be decomposed into one reduction reaction, the cathodic partial reaction. 

Wagner-Traud Diagram, According to the mixed-potential theory, the overall reaction of the electroless deposition, [Eq. (8.2)] can be described electrochemically in terms of three current-potential i-E) curves, as shown schematically in Eigure 8.2. First, there are two current-potential curves for the partial reactions (solid curves) (1) ic =f(E), the current-potential curve for the reduction of ions, recorded from the rest potential E eq M the absence of the reducing agent Red (when the activity of is equal to 1, eq,M E m) and (2) = f(E), the current-potential... 

Electroless Deposition of Copper. The basic ideas of the mixed-potential theory were tested by Paunovic (10) for the case of electroless copper deposition from a cupric sulfate solution containing ethylenediaminetetraacetic acid (EDTA) as a complexing agent and formaldehyde (HCHO) as the reducing agent (Red). The test involved a comparison between direct experimental values for and the rate of deposition with those derived theoretically from the current-potential curves for partial reactions on the basis of the mixed-potential theory. 

Electroless Deposition in the Presence of Interfering Reactions. According to the mixed-potential theory, the total current density, is a result of simple addition of current densities of the two partial reactions, 4 and However, in the presence of interfering (or side) reactions, 4 and/or may be composed of two or more components themselves, and verification of the mixed-potential theory in this case would involve superposition of current-potential curves for the electroless process investigated with those of the interfering reactions in order to correctly interpret the total i-E curve. Two important examples are discussed here. 

The second example is electroless deposition of copper from solutions containing dissolved oxygen (49,53). In this case the interfering reaction is the reduction of the oxygen, and the cathodic partial current density is the sum of two components ... 

Interaction Between Partial Reactions. The original mixed-p)otential theory assumes that the two partial reactions are independent of each other (1). In some cases this is a valid assumption, as was shown earlier in this chapter. However, it was shown later that the partial reactions are not always independent of each other. For example, Schoenberg (13) has shown that the methylene glycol anion (the formaldehyde in an alkaline solution), the reducing agent in electroless copper deposition, enters the first coordination sphere of the copper tartrate complex and thus influences the rate of the cathodic partial reaction. Ohno and Haruyama (37) showed the presence of interference in partial reactions for electroless deposition of Cu, Co, and Ni in terms of current-potential curves. 

Conclusions. The discussion in this section shows the validity of the mixed-potential theory for electroless deposition of Cu, Ni, and An. The discussions in the sections Electroless Deposition in the Presence of Interfering Reactions and Interaction Between Partial Reactions illustrate the complexities of electroless processes and the presence of a variety of factors that should be taken into account when applying the mixed-potential theory to the electroless processes. 

A comparison of the results using this method and the rate of electroless copper deposition determined gravimetrically shows that the best results are obtained with the Le Roy equation applied to the polarization data in the anodic range. It is interesting to note that here, in the metal deposition as in the corrosion (9), the partial reaction, which does not involve destruction or building of a crystal lattice of metal substrate, gives better results (this is hardly surprising, of course). 

In electroless deposition of a metal M, the current-potential relationships for the partial reaction may be written as linear functions ... 

We described one example of this type of electrochemical deposition in Section 5.7 when we considered processes on a strip of Zn placed in a solution of CUSO4 (Fig. 5.11). In Chapter 5 we stated that there are two partial reactions in that system, as in an electroless system. In displacement deposition of Cu on Zn, electrons are supplied in the oxidation reaction of Zn ... 

The film deposition was carried out at room temperature from an aqueous solution of plumbous acetate, ammonium acetate, and ammonium persulphate, using NH4OH to bring the pH to 6. A trace of AgNOs was added as a catalyst for reaction 7.4 [29]. A film of PbOi ca. 50 nm thick was formed in an hour. Once this initial film was deposited, thicker films could be built up, usually at a somewhat higher pH, in the absence of the AgNOs. The initial film formation appears to be a pure CD reaction. However, electrochemical studies of further film buildup showed that an electroless deposition mechanism, involving two partial electrochemical reactions, was responsible for film formation. 

Thus, from the kinetic aspects, the cathodic partial reaction is an electrochemical reaction [Eq. (8.14)], which is preceded by a chemical reaction [Eq. (8.13)]. Paunovic (31) studied the first step in the cathodic partial reaction of electroless copper deposition by chronopotentiometry and potential sweep (potentiodynamic)... 

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