Electrochemical plating method

The electrochemical plating method was used to fabricate IPMCs with different types of electrodes. The exact chemicals and reduction materials are shown in Table. 2.1. An Instron 5565 machine was used for the tensile testing (see Fig. 2.12 (a) for the setup). The fabricated IPMC samples were punched out using a dog-bone shaped punch mold. Its size followed ASTM 638 and 882, as shown in Fig. 2.12 (b). The tensile test was per-... 

Bouroushian M, Kosanovic T, Spyrellis N (2006) A pulse plating method for the electrosynthesis of ZnSe. J Appl Electrochem 36 821-826... 

The electrochemical reduction method can produce mesostmctured metals in the form of thin films. By electrodeposition of plating mixtures made from appropriate salts, mesostmctured metal films can be produced on the electrode surface with high surface areas and good mechanical and electrochemical stabihty. The ability to produce ordered mesostmctured metal films may lead to new types of electrode materials for apphcations such as batteries, fuel cells, and sensors. 

Y. Harada, K. Fushimi, S. Madokoro, H. Sawai, and S. Ushio, The characterization of via-filling technology with electroless plating method, J. Electrochem. Soc. 133, 2428, 1986. 

In the proposed new method, microorganisms suspended in a liquid culture are incubated at 37 °C for 20 min in the absence or presence of an antibiotic, using the same drug concentration as is present in the accepted agar plate method. Respiratory activity (breathing) is then measured by a new electrochemical method. If respiratory activity is < 90% of the control measurement, made in the absence of antibiotic, the microorganism is susceptible to the antibiotic. The new method requires only 25 min, and can therefore provide results (and effective treatment regimes) much more rapidly than the accepted method. 

To prepare metal hexacyanoferrate films, very frequently the following procedure was followed first a film of the respective metal, for example, cadmium [79], copper [80], silver [81], or nickel [82, 83] was electrochemically plated on the surface of a platinum electrode, and that was followed by chemical oxidation of the metal film in a solution of K3[Fe(CN)6], leading to the formation of the metal hexacyanoferrates. The same method has been used to produce films of nickel hexacyanoruthen-ate and hexacyanomanganate using the appropriate anions [83]. It is also possible to perform the oxidation of the deposited metals in solutions containing hexacyano-ferrate(II) by cyclic oxidation/reduction of the latter. In a similar way, films of copper heptacyanonitrosylferrate have been deposited [84]. 

Electron transfer reactions involving catalytic chlorophyll were studied by the vibrating plate method [3, 7, 47,48] in the electrochemical circuit ... 

For the electrochemical plating of silver, a 99.9% silver anode is used with an electrolyte composed of [Ag(CN)2] and other required additives. Silver should not come into direct contact with steel or severe corrosion can occur. Steel parts can be protected by first coating with copper or nickel. Silver coating is commonly used for flatware, hol-loware, jewelry, electrical, and mechanical applications. Chemical methods are available to apply silver as a coating to plastic or glass. 

One of the earliest applications of the template method was to prepare ensanble miCTo-scopic (7, 18) and nanoscopic electrodes (116, 141). Such electrodes were prepared by electrochemically depositing noble metals within the pores of the commercially available polymeric filtration membranes. The fabrication of a microelectrode ensemble based on the electrochemical deposition of platinum into the pores of a track-etched microporous polycarbonate host membrane was first shown in 1987 by Charles Martin (7). The word ensemble was used to describe the final device because the elements in the device are not evenly spaced. The procedure is simple, and requires only routine and inexpensive electrochemical instrumentation. It was ultimately found that electroless plating allowed for more uniform metal deposition (116). Both plating methods are important for the fabrication of the array, and further considerations continue in the following. 

From the aforementioned materials, the noble metals (Pt, Au, or Pd) are usually a preferred choice for IPMC electrodes due to their high electrical conductivity and electrochemical stability and availability in cation complex form that can be effectively used with electroless plating method. 

Many electroless coppers also have extended process Hves. Bailout, the process solution that is removed and periodically replaced by Hquid replenishment solution, must still be treated. Better waste treatment processes mean that removal of the copper from electroless copper complexes is easier. Methods have been developed to eliminate formaldehyde in wastewater, using hydrogen peroxide (qv) or other chemicals, or by electrochemical methods. Ion exchange (qv) and electro dialysis methods are available for bath life extension and waste minimi2ation of electroless nickel plating baths (see... 

Reference 38 is a good guide to the selection of plate thickness test methods. Test methods may vary with the purity and electrochemical activity of the deposit. Metals deposited from commercial plating solutions are seldom pure. For example, zinc deposits from the three commonly used baths, ie, cyanide, chloride, and zincate, vary significantly in purity and activity (39). Standard ASTM test methods for determining plate thickness are... 

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