Dry film lamination

First planar integrated circuits fabricated r Electron beam lithography demonstrated Dry film laminate resist introduced... 

Dry Film Lamination The resist lamination was performed using a Model 712 Hot Roll Laminator supplied by MacDermid, Inc., Waterbury, Connecticut. The heart of the lamination system is an aluminum-cored fuser roll which is about 2.3 inches in diameter and is coated by 0.1 inch thick additives-filled silicon rubber. Figure 3 shows a schematic of the fuser roll. All dry film lamination experiments were performed using a conveyor speed of 20 inches per minute an air-assisted pressure of 0 PSIg and a fuser roll temperature of 103 C. The hold time between surfece treatment and resist lamination was kept constant at 60 minutes. 

Hole plugging with alkaline-resolvable ink tenting (dry film lamination)... 

However, it is useful for very thin materials and nonstandard-size panels in small lot sizes. With automatic equipment, the basics are the same but the panel enters from an automatic loader or a conveyorized preclean tool directly into and throngh the dry-film laminator. 

Dry film laminate for conductor pattern (reverse pattern). 

Dry film lamination and pattern printing Due to the relatively low temperature and lack of wet processing (moisture), dry film lamination and pattern printing have httle effect on dimensional control. Pattern imaging is, however, an opportunity to apply appropriate dimensional corrections for the foUowing processes. 

Dry film lamination of the MMA-TBMA-MAA resist is impractical. To lower the glass transition (and thus the lamination temperature) of these... 

Lamination Inks. This class of ink is a specialized group. In addition to conforming to the constraints described for flexo and gravure inks, these inks must not interfere with the bond formed when two or more films, eg, polypropylene and polyethylene, are joined with the use of an adhesive in order to obtain a stmcture that provides resistance properties not found in a single film. Laminations are commonly used for food applications such as candy and food wrappers. Resins used to make this type of ink caimot, therefore, exhibit any tendency to retain solvent vapor after the print has dried. Residual solvent would contaminate the packaged product making the product unsalable. 

Typical of the temporary or manufacturing aid coating systems is the RISTON dry film photoresist for printed circuit (PC) board fabrication. This was the first of these systems developed. The RISTON product stmcture and the basic steps in its use are shown in Figure 2. It consists of a photopolymer sheet laminated between a Mylar cover sheet and a polyolefin separation sheet. It is manufactured as a continuous web (see Coating PROCESSES, survey), and is suppHed in roUs of varying width and photopolymer composition. 

Fig. 2. Schematic of the RISTON dry film photoresist process, (a) Removal of polyolefin separator sheet and laminate resist to clean surface, using special laminator (b) exposure to uv source using positive or negative phototool (positive to plate negative for print-and-etch) (c) removal of the protective Mylar, which is readily removed by hand and (d) development using a special processor (3).

The microstructure was realized by a dry-film photoresist technique and based on established techniques from printed circuit board technology [142], Dry resists are available as thin films, e.g. of thickness 50 or 100 pm. The resist films are encased in other polymer materials which are later removed. The resist films can be deposited on various base materials such as silicon or polymers giving mechanical stability. Lamination is carried out with a roller laminator. Then, exposure is made and spray development without any solvents follows. The process steps can be repeated at multi-laminated structures. Closed structures can be made in this way. 

For patient monitoring as well as for extracellular microphysiometry low volume fluid handling systems with integrated microbiosensor arrays have to be developed (Trajanoski et al. 1996). A very versatile and reliable technology is the use of polymer laminate film. The laminate is based on a PCB material and provides mixed fluidic-electric platform for the assembly of a biosensor array and microfluidic channels. Subsequent lamination of dry film resist layers over previously patterned layers allows the creation of closed channels without the use of any sacrificial layer (Fig. 3). 

Uses Acrylic for frothable backcoatings with exc. durability to laundering/ dry cleaning, UV, and heat, and for film laminating Features Very soft self-crosslinking... 

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