Spray developers

To investigate these two possibilities, a wafer coated with GMC was exposed and then divided into a number of sections. Different sections were spray developed with varying strengths of the developer. Spray developing was found to be a more efficient and reproducible way to dissolve the soluble... 

A 48-year-old man taking losartan, low-dose amitriptyline, and triamcinolone acetonide nasal spray developed pain in the abdomen and hips. Radiography and magnetic resonance imaging showed rapidly... 

The microstructure was realized by a dry-film photoresist technique and based on established techniques from printed circuit board technology [142], Dry resists are available as thin films, e.g. of thickness 50 or 100 pm. The resist films are encased in other polymer materials which are later removed. The resist films can be deposited on various base materials such as silicon or polymers giving mechanical stability. Lamination is carried out with a roller laminator. Then, exposure is made and spray development without any solvents follows. The process steps can be repeated at multi-laminated structures. Closed structures can be made in this way. 

Lithographic Characterization. Electron-beam exposures were conducted on an EBES system operating at 20 kV, with a beam address and spot size both equal to 0.25 ym. Electron response parameters were evaluated using linewidth control patterns. P(SI-CMS) was spray developed after exposure using an APT Model 915 resist processor in toluene-methanol (1 1) for 30 sec followed by a methanol rinse for 45 sec. Aqueous solutions of tetramethylammonium hydroxide (TMAH, 25% in water, Fluka Inc.) were used for the novolac resist development. Exposed films were dip-developed for 20 sec. in TMAH-water (1 2.5) solutions. 

Pattern Development. The development of patterns exposed in thin films of PVTMSK was diflScult because of its high solubility in almost all organic solvents. Excessive thinning of the unexposed areas could be prevented by carrying out the development at low temperatures either by spray development with a 2-propanol mist while the wafer is spinning at 1000-2500 rpm or by dip development in 2-propanol at + 5 C. Spray development cooled the wafer to as low as 8-10 °C because of the fast evaporation of the solvent, but even at such low temperatures and short development times (5-15 s), a nonuniform thinning of the film occurred. 

Figure 6. Lithographic sensitivity curve for PVTMSK exposed to deep-UV radiation. The pattern was spray developed for 10 s with 2-propanol at...

A 65-year-old woman, who had previously tolerated calcitonin nasal spray, developed eye and nose congestion, an itchy nose, and sneezing minutes after using intranasal salmon calcitonin (17). She was later given intramuscular salmon calcitonin and developed generalized urticaria and nasal itching within minutes. Skin testing was positive with eel and salmon calcitonins but not human calcitonin, and she was treated with human calcitonin without adverse effects. 

Solutions of polyimides were spin coated at 3000 rpm for 60 sec. onto silicon wafers which had been treated with DuPont VM 651 adhesion promoter. After coating, wafers were dried at 70 C on a hot plate. A Karl Suss proximity printer was used for imaging, and the wafers were developed in an APT spin-spray developer. 

The detection of the sample components requires a two-spray development. The first step is to add nitrite and make a diazonium salt of the sulfa drugs. 

Thus, the above constraints limit total development time available from as much as 2 minutes with batch development(1) to development processes of about 30 to 60 seconds. If the e(6) value is used as a measure of process quality (which is only partially the case as discussed below), it can be seen (Figure 1) that dilute developer gives the best performance. However, the penalty is that required exposure time and thus camera throughput decreases (Figure 2), In addition, since the dose required to obtain breakthrough (Eo) is not only increased but has a steep slope for short development time, linewidth control might be expected to degrade as well. This, infact, has been our experience in practice. In order to obtain equivalent linewidth control with Microposit 351(5) (3.5 1 and 5 1 dilution), the total spray develop time had to be increased from 30 to 60 seconds. 

Fig. 33.3 Stages of spray development for neat oil at different pressures [3]...

Fig. 1 (a) The top image shows the deposition of photoresist on a dehydrated and then primed wafer. The image below shows the coated wafer with uniform layer of photoresist, (b) The photoresist-coated wafer is exposed to UV light with an intact mask, (c) The pattern is developed by rinsing the substrate in a developing solution or using a spray developer. This process will remove the unwanted photoresist and leaves the pattern on the surface of the substrate... 

The exposed parts may be developed using a standard spray developer containing aqueous sodium carbonate as the development solution, as illustrated in Figure 7.14. The temperature of the developer may be varied from 25 to 45°C. 

A. Ninhydrin spray. Developed plates dried at 100°C and sprayed with pyridine reheat to aid removal of ammonia traces... 

International Thermal Spray Association (ITSA), The http //www.thermalspray.org/ (accessed August 16, 2010). The International Thermal Spray Association is closely interwoven with the history of thermal spray development in this hemisphere. Founded in 1948, and once known as Metallizing Service Contractors, the association has been closely tied to almost all major advances in thermal spray technology, equipment and materials, industry events, education, standards, and market development in North and South America (from Web page). 

If the atmosphere is clean but not dry and the humidity approaches 100%, a scattered pattern of corrosion spots eventually appears, but considerable areas of unaffected surface remain for a very long time. If, however, the surface becomes contaminated by corrosive dust or cathodic particles, the whole surface rapidly becomes covered with a grayish layer of corrosion product (Tawil, 1987). A clean, unprotected magnesium alloy surface exposed to indoor or outdoor atmospheres free from salt spray develops a gray Him that protects the metal from corrosion (Froats et al., 1987). The rates of corrosion and resistance to corrosion of magnesium alloys vary depending on alloy composition (Loose, 1946) as discussed previously. 

Data extracted from numerical simulations and experiments on swirling liquid sheet breakup can be applied as inflow conditions for the subsequent modelling and simulation of secondary droplet breakup and spray development in a spray process based on the Eulerian-Lagrangian approach. 

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