Decoupling with Packages

Draw dependency diagrams (see Section 7.4, Decoupling with Packages) between operations, classes, packages, and components. Study the package-level dependencies and seek ways to refactor across packages to reduce coupling. 

Let s look at two issues that arise with the use of encapsulation in packages model decoupling with auxiliary definitions and the use of encapsulation in specifications. 

Packages can be structured in many different ways. The separation of an interface from classes in separate packages provides a pattern for setting up the project package structure. Combined with consistent naming conventions, it makes certain aspects of the architecture very visible in the project development stmcture (see Section 7.4.1, Role-based Decoupling of Classes). 

The last and most advanced system presented in this book includes an array of three MOS-transistor-heated microhotplates (Sect. 6.3). The system relies almost exclusively on digital electronics, which entailed a significant reduction of the overall power consumption. The integrated C interface reduces the number of required wire bond connections to only ten, which allows to realize a low-prize and reliable packaging solution. The temperature controllers that were operated in the pulse-density mode showed a temperature resolution of 1 °C. An excellent thermal decoupling of each of the microhotplates from the rest of the array was demonstrated, and individual temperature modulation on the microhotplates was performed. The three microhotplates were coated with three different metal-oxide materials and characterized upon exposure to various concentrations of CO and CH4. 

Applications that have received attention, and the material properties that enable them, are shown in Figure 27.1. These applications are reviewed in detail in Waser and Ramesh. Decoupling capacitors and filters on semiconductor chips, packages, and polymer substrates (e.g., embedded passives ) utilize planar or low aspect ratio oxide films. These films, with thicknesses of 0.1 to 1 J,m, are readily prepared by CSD. Because capacitance density is a key consideration, high-permittivity materials are of interest. These needs may be met by morpho-tropic phase boundary PZT materials, BST, and BTZ (BaTi03-BaZr03) solid solutions. Phase shifters (for phase array antennas) and tunable resonator and filter applications are also enabled by these materials because their effective permittivity exhibits a dependence on the direct current (DC) bias voltage, an effect called tunability. 

In -the moderation-control method for S% enriched UFii, criticality safety is assured by control of two parameters- the U enrichment and the hydrogen moderation. Topical subjects to be reviewed in method development include UF , purity control in liquefaction operations the Influence of container size on internal and external moderntion effects decoupling properties of the cylinder wall In water-moderated UFa arrays special neutron multiplication experiments with large UFo assemblies derivation of moderation control limits large cylinder cleaning procedures and protective packaging. The administrative requirements for method application are al.so discussed briefly. 

The one-dimensional decoupled diffusion equation without the elimination of stress-dependent terms is easier to solve numerically. With li-ion concentration obtained, intercalation-induced stresses can be calculated using the analytical expressions of Equations 26.4 and 26.5. Governing equations for one-dimensional spherical particles can be solved using the finite difference method. Governing equations for three-dimensional elHpsoidal particles are solved using the finite element analysis package GOMSOL Multiphysics. 

RNA lumped at the tower top, while wind loads are obtained by a dedicated software package, capable of modeling the rotor aerodynamics, with no earthquake ground motion at the tower base, since the analysis is decoupled. 

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