Curing agent formulations

The collection of reviews to be published in ADVANCES IN POLYMER SCIENCE is devoted just to these fundamental problems. The epoxy resin-curing agent formulations are typical thermosetting systems of a rather high degree of complexity. Therefore, some of the formation-structure-properties relationships are still of empirical or semiempirical nature. The main objective of this series of articles is to demonstrate the progress in research towards the understanding of these relationships in terms of current theories of macromolecular systems. 

Table I. 73 series prepolymer and curing agent formulations.

Phenolic Resins. Phenohc resins (qv) are formed by the reaction of phenol [108-95-2] C H O, and formaldehyde [50-00-0] CH2O. If basic conditions and an excess of formaldehyde are used, the result is a resole phenohc resin, which will cure by itself Hberating water. If an acid catalyst and an excess of phenol are used, the result is a novolac phenohc resin, which is not self-curing. Novolac phenohc resins are typically formulated to contain a curing agent which is most often a material known as hexamethylenetetraamine [100-97-0] C H22N4. Phenohc resin adhesives are found in film or solution... 

Formulation. Polysulftde-based sealants are formulated with appropriate ingredients to obtain the desired properties for a particular appHcation. A typical formulation contains Hquid polysulftde polymer, curing agent, cure accelerators (bases) or retarders (acids), fillers, plasticizers, thixotropes, and adhesion promoters. 

The outstanding performance characteristics of the resins are conveyed by the bisphenol A moiety (toughness, rigidity, and elevated temperature performance), the ether linkages (chemical resistance), and the hydroxyl and epoxy groups (adhesive properties and formulation latitude, or reactivity with a wide variety of chemical curing agents) (see also Phenolic resins). 

Some rubber base adhesives need vulcanization to produce adequate ultimate strength. The adhesion is mainly due to chemical interactions at the interface. Other rubber base adhesives (contact adhesives) do not necessarily need vulcanization but rather adequate formulation to produce adhesive joints, mainly with porous substrates. In this case, the mechanism of diffusion dominates their adhesion properties. Consequently, the properties of the elastomeric adhesives depend on both the variety of intrinsic properties in natural and synthetic elastomers, and the modifying additives which may be incorporated into the adhesive formulation (tackifiers, reinforcing resins, fillers, plasticizers, curing agents, etc.). 

Formulation of a solvent-borne CR. A typical formulation of a solvent-borne CR adhesive may include the following components (fillers are not commonly added and curing agents are added to improve heat resistance) (1) polychloroprene elastomer (2) metal oxides (3) resins (4) antioxidants (5) solvents (6) fillers (7) curing agents (8) other modifiers. 

Uses. There are about forty to fifty organic peroxides commercially available in more than seventy formulations designed for specific applications which include (1) initiators for vinyl monomer polymerizations, and copolymerizations of monomers such as vinyl chloride, ethylene, styrene, vinyl acetate, acrylics, fluoroolefms and buta-dienestyrene (2) curing agents for thermoset polyesters, styrenated alkyds and oils, silicone rubbers and poly allyl diglycol carbonates ... 

After formulation with a flame retardant filler such as alumina trihydrate Al203 3H20, hydrated silica or calcium carbonate, a peroxide curing agent and... 

Bismaleimides - Bismaleimides resins were first introduced into the market in the early 1970 s. As with other resin systems, there are many variations of bismaleimides. The Kermid and Kinel bismaleimide products as marketed in the U. S. by Rhodia are representative examples. Bismaleimide chemistry is represented in Eq. 3 where curing can be accomplished thermally through the unsaturation in the maleimide or by way of the Michael Reaction where an appropriate curing agent such as aromatic diamine adds across the activated double bond. In most instances, a combination of curing thermally through the double bond and via an aromatic diamine is used in actual practice. Bismaleimides are frequently formulated... 

Uses Water-soluble salts textile softeners antirust formulations fatty acid derivatives pharmaceuticals curing agent for resins emulsifying agents in acid media organic synthesis. 

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